Patents by Inventor Chih-Chih Liu

Chih-Chih Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6806182
    Abstract: Application of an adhesion promoter to a cap layer and oxidation of the adhesion promoter prior to deposition of an organic interlevel dielectric thereon reduces via resistance problems during thermal cycles of semiconductor wafers embodying multiple levels of metal and organic interlevel dielectrics.
    Type: Grant
    Filed: May 1, 2002
    Date of Patent: October 19, 2004
    Assignees: International Business Machines Corporation, Infineon Technologies, AG, United Microelectronics Co.
    Inventors: Darryl Restaino, Shahab Siddiqui, Erdem Kaltalioglu, Delores Bennett, Chih-Chih Liu, Hsueh-Chung Chen, Tong-Yu Chen, Gwo-Shii Yang, Chiung-Sheng Hsiung