Patents by Inventor CHIH-CHIN KO

CHIH-CHIN KO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240196751
    Abstract: Disclosed is a stress-resistant trace structure and a piezoelectric detection device made thereof. The stress-resistant trace structure includes a patterned trace layer and a porous anti-stress layer. The patterned trace layer has a non-linear pattern and is configured on the porous anti-stress layer. Specifically, the porous anti-stress layer has a plurality of through holes, and the through holes are vertically interlaced with the non-linear pattern.
    Type: Application
    Filed: February 15, 2023
    Publication date: June 13, 2024
    Inventors: BO-JHANG SUN, CHIH-CHIN KO, HSIN-YU CHEN, JI-AN CHEN
  • Patent number: 8857111
    Abstract: A composite damper includes a first connector, a second connector and at least a dampening device. The first connector and the second connector are relative movable to each other, and the at least one dampening device is received between the first connector and the second connector. The dampening device comprises at least a rigid member and at least a dampening member, wherein the rigid member has the properties of high stiffness and low damping, while the dampening member has the properties of low stiffness and high damping. With such design, the composite damper could absorb vibrations during earthquakes.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: October 14, 2014
    Assignees: National Cheng Kung University, Tongji University
    Inventors: Yun-Che Wang, Bin Zhao, Hai-Jie Ge, Chih-Chin Ko
  • Publication number: 20140000185
    Abstract: A composite damper includes a first connector, a second connector and at least a dampening device. The first connector and the second connector are relative movable to each other, and the at least one dampening device is received between the first connector and the second connector. The dampening device comprises at least a rigid member and at least a dampening member, wherein the rigid member has the properties of high stiffness and low damping, while the dampening member has the properties of low stiffness and high damping. With such design, the composite damper could absorb vibrations during earthquakes.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 2, 2014
    Inventors: YUN-CHE WANG, BIN ZHAO, HAI-JIE GE, CHIH-CHIN KO