Patents by Inventor Chih-Chin Lin

Chih-Chin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240177653
    Abstract: A light-emitting diode (LED) display device, includes: a plurality of displaying basic-units, each of the displaying basic-units having a plurality of sub-pixel regions, on which a plurality of red LED units, a plurality of green LED units, a plurality of blue LED units, and a plurality of white LED units are selectively provided; and a control unit, performing an image reconstruction process for an input image, thereby making each of the displaying basic-units display color, color grayscale, or black-and-white grayscale; wherein in each of the displaying basic-units, the quantity of green LED units is more than or equal to the quantity of white LED units, and the quantity of green LED units is more than the quantity of blue LED units or red LED units.
    Type: Application
    Filed: September 28, 2023
    Publication date: May 30, 2024
    Inventors: Jui Yi WU, Chih Hao LIN, Jian-Chin LIANG
  • Patent number: 11991823
    Abstract: The present disclosure is relates to a conductive film and a manufacturing method thereof. The conductive film includes a base layer, a TPU complex layer, a conductive layer and a TPU surface layer. The TPU complex layer includes a TPU heat-resistant layer and a TPU melting layer. The TPU heat-resistant layer is disposed on the TPU melting layer, and the TPU melting layer is disposed on the base layer. The conductive layer includes a conductive circuit disposed on the TPU heat-resistant layer. The TPU surface layer is disposed on the conductive layer. Utilizing the TPU complex layer, the conductive layer does not contact directly with the base layer to avoid breaking the conductive line of the conductive layer when the base layer is pulled. Therefore, the lifetime of the conductive film can be increased.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: May 21, 2024
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chih-Yi Lin, Kuo-Kuang Cheng, Chi-Chin Chiang, Wen-Hsin Tai, I-Ju Wu, Chi-Ho Tien
  • Patent number: 11987431
    Abstract: A top-opening substrate carrier comprises a container body, a door member and at least one latching mechanism. The latching mechanism includes a rotary drive member, a first driven cam, a second driven cam, a first connecting rod, a second connecting rod, two longitudinal latching arms and two lateral latching arms. The first driven cam and the second driven cam are disposed at two sides of the rotary drive member. When the rotary drive member is rotated by force, it links and activates the first connecting rod and the second connecting rod to synchronously drive the first driven cam and the second driven cam to rotate, thereby driving the two longitudinal latching arms and the two lateral latching arms to project towards locking holes of the container body and locked, or retract from the locking holes of the container body and unlocked.
    Type: Grant
    Filed: March 27, 2023
    Date of Patent: May 21, 2024
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Ming-Chien Chiu, Yung-Chin Pan, Cheng-En Chung, Chih-Ming Lin, Po-Ting Lee, Wei-Chien Liu, Tzu-Ning Huang
  • Patent number: 11983848
    Abstract: Aspects of the disclosure provide a frame processor for processing frames with aliasing artifacts. For example, the frame processor can include a super-resolution (SR) and anti-aliasing (AA) engine and an attention reference frame generator coupled to the SR and AA engine. The SR and AA engine can be configured to enhance resolution and remove aliasing artifacts of a frame to generate a first high-resolution frame with aliasing artifacts and a second high-resolution frame with aliasing artifacts removed. The attention reference frame generator can be configured to generate an attention reference frame based on the first high-resolution frame and the second high-resolution frame.
    Type: Grant
    Filed: January 6, 2023
    Date of Patent: May 14, 2024
    Assignee: MEDIATEK INC.
    Inventors: Cheng-Lung Jen, Pei-Kuei Tsung, Chih-Wei Chen, Yao-Sheng Wang, Shih-Che Chen, Yu-Sheng Lin, Chih-Wen Goo, Shih-Chin Lin, Tsung-Shian Huang, Ying-Chieh Chen
  • Patent number: 11975243
    Abstract: The present disclosure is relates to a TPU ball structure and a manufacturing method thereof. The TPU ball structure includes a ball bladder layer, a yarn layer and a surface layer. The ball bladder layer is made of TPU material. The yarn layer is made of TPU material, and the yarn layer is disposed to cover the ball bladder layer. The surface layer is made of TPU material, and the surface layer is disposed to cover the yarn layer. The above layers of the TPU ball structure are made of TPU material to satisfy a requirement for environmental protection, and are recyclable. There is no need to use adhesive to adhere the above layers of the TPU ball structure. Therefore, the peeling strength between the layers of the TPU ball structure can be increased so that the whole peeling strength of the TPU ball structure can be increased.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: May 7, 2024
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chih-Yi Lin, Kuo-Kuang Cheng, Chi-Chin Chiang, Wen-Hsin Tai
  • Publication number: 20240147718
    Abstract: Some embodiments of the present application are directed towards an integrated circuit (IC). The integrated circuit includes a semiconductor substrate including a logic region and a memory cell region. A logic device is arranged on the logic region. A memory device is arranged on the memory cell region. An isolation structure extends into a top surface of the semiconductor substrate, and laterally separates the logic region from the memory cell region. The isolation structure includes dielectric material and has an uppermost surface and a slanted upper surface extending from the uppermost surface to an edge of the isolation structure proximate to memory cell region.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Inventors: Meng-Han Lin, Chih-Ren Hsieh, Chen-Chin Liu, Chih-Pin Huang
  • Publication number: 20240134136
    Abstract: An optical transceiver module temperature control device includes a processor, a printed circuit board assembly, an optical transceiver module and a temperature adjustment element. The processor is configured to measure an ambient temperature. The printed circuit board assembly includes a first side and a second side. The first side is opposite to the second side. The optical transceiver module is disposed on the first side of the printed circuit board assembly. The temperature adjustment element is coupled to the processor and disposed on the second side of the printed circuit board assembly. The processor is configured to generate a temperature adjustment signal according to the ambient temperature and an operating temperature range. The temperature adjustment element is configured to perform heat exchange with the printed circuit board assembly according to the temperature adjustment signal to adjust a temperature of the optical transceiver module into the operating temperature range.
    Type: Application
    Filed: October 23, 2023
    Publication date: April 25, 2024
    Applicant: Formerica Optoelectronics, Inc.
    Inventors: Yun-Cheng HUANG, Yi-Nan SHIH, Chih-Chung LIN, Yun-Chin TSAI
  • Patent number: 11966121
    Abstract: An electronic window is provided for adjusting light and includes a first panel, a second panel, and an intermediate layer. The first panel includes a first alignment layer. The second panel includes a second alignment layer. The intermediate layer is disposed between the first panel and the second panel. The angle of orientation of the first alignment layer is between 25 degrees and 65 degrees, and the angle of orientation of the second alignment layer is between 115 degrees and 155 degrees.
    Type: Grant
    Filed: March 17, 2023
    Date of Patent: April 23, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: En-Hsiang Chen, Chih-Chin Kuo, Mao-Shiang Lin, Hsu-Kuan Hsu
  • Patent number: 11961951
    Abstract: A light emitting diode device includes a substrate, a conductive via, first and second conductive pads, a driving chip, a flat layer, a redistribution layer, a light emitting diode, and an encapsulating layer. The substrate has a first surface and a second surface opposite thereto. The conductive via penetrates from the first surface to the second surface. The first and second conductive pads are respectively disposed on the first and second surface and in contact with the conductive via. The driving chip is disposed on the first surface. The flat layer is disposed over the first surface and covers the driving chip and the first conductive pad. The redistribution layer is disposed on the flat layer and electrically connects to the driving chip. The light emitting diode is flip-chip bonded to the redistribution layer. The encapsulating layer covers the redistribution layer and the light emitting diode.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: April 16, 2024
    Assignee: Lextar Electronics Corporation
    Inventors: Chih-Hao Lin, Jian-Chin Liang, Shih-Lun Lai, Jo-Hsiang Chen
  • Publication number: 20240111192
    Abstract: An optical device includes: a first substrate; a second substrate disposed opposite to the first substrate; a first conductive layer disposed on the first substrate, wherein the first conductive layer includes a first surface and a third side surface connecting to the first surface; a second conductive layer disposed on the second substrate; a sealant disposed between the first conductive layer and the second conductive layer and having a first side and a second side opposite to the first side; a liquid crystal layer disposed between the first conductive layer and the second conductive layer and locating at the first side of the sealant; and a barrier layer disposed between the first conductive layer and the second conductive layer and locating at the second side of the sealant, wherein at least part of the first surface and the third side surface are not covered by the barrier layer.
    Type: Application
    Filed: August 29, 2023
    Publication date: April 4, 2024
    Inventors: Chih-Chin KUO, Mao-Shiang LIN, Hsu-Kuan HSU
  • Patent number: 11949056
    Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, micro light emitting elements, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting elements are disposed on the first adhesive layer and have a first surface facing to the first adhesive layer and an opposing second surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting elements and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A thickness of the flexible substrate is less than 100 um.
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: April 2, 2024
    Assignee: Lextar Electronics Corporation
    Inventors: Chih-Hao Lin, Jo-Hsiang Chen, Shih-Lun Lai, Min-Che Tsai, Jian-Chin Liang
  • Patent number: 11912837
    Abstract: The present disclosure provides a thin film including a first thermoplastic polyolefin (TPO) elastomer which is anhydride-grafted. The present disclosure further provides a method for manufacturing the thin film, a laminated material and a method for adhesion.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: February 27, 2024
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chih-Yi Lin, Kuo-Kuang Cheng, Chi-Chin Chiang, Wen-Hsin Tai, Ming-Chen Chang
  • Publication number: 20050001389
    Abstract: The present invention is to provide a horizontal balance control system of motor vehicle comprising a pneumatic conveyor (or electromagnetic device) operable to actuate hydraulic devices, links, and other mechanical elements for generating a restraint force among wheels in the same line or not in the same line, a control means is operable to activate the pneumatic conveyor for outputting compressed gas to increase pressure of a valve thereof and enable wheels in the same line or not in the same line to rotate toward the same direction. By utilizing this, discomfort of a driver and one or more passengers due to moving forward or backward while the motor vehicle is braking or accelerating is eliminated.
    Type: Application
    Filed: July 2, 2003
    Publication date: January 6, 2005
    Inventor: Chih-Chin Lin
  • Patent number: 6834865
    Abstract: The present invention is to provide a horizontal balance control system of motor vehicle comprising a pneumatic conveyor (or electromagnetic device) operable to actuate hydraulic devices, links, and other mechanical elements for generating a restraint force among wheels in the same line or not in the same line, a control means is operable to activate the pneumatic conveyor for outputting compressed gas to increase pressure of a valve thereof and enable wheels in the same line or not in the same line to rotate toward the same direction. By utilizing this, discomfort of a driver and one or more passengers due to moving forward or backward while the motor vehicle is braking or accelerating is eliminated.
    Type: Grant
    Filed: July 2, 2003
    Date of Patent: December 28, 2004
    Inventor: Chih-Chin Lin