Abstract: The present disclosure provides a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes channel members disposed over a substrate, a gate structure engaging the channel members, and an epitaxial feature adjacent the channel members. At least one of the channel members has an end portion in physical contact with an outer portion of the epitaxial feature. The end portion of the at least one of the channel members includes a first dopant of a first concentration. The outer portion of the epitaxial feature includes a second dopant of a second concentration. The first concentration is higher than the second concentration.

Abstract: Some implementations described herein provide techniques and apparatuses for a fixture including a semiconductor die package and methods of formation. The semiconductor die package is mounted to an interposer. In addition to the semiconductor die package, the fixture includes a lid component having a top structure and footing structures that connect the lid component to the interposer. The fixture includes a thermal interface material between a top surface of the semiconductor die package and the top structure of the lid component. The footing structures, connected to the interposer using deposits of an epoxy material, provide increase a structural rigidity of the fixture relative to another fixture not including the footing structures.

Abstract: A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.

Abstract: A semiconductor device includes a package substrate, a package component and at least one adhesive pattern. The package component has a thermal interface material (TIM) layer thereon. The adhesive pattern has a first surface facing the package substrate and a second surface opposite to the first surface, and the second surface of the at least one adhesive pattern is substantially coplanar with a surface of the TIM layer.

Abstract: Embodiments of the present disclosure provide a method for forming semiconductor device structures. The method includes forming a fin structure having a stack of semiconductor layers comprising first semiconductor layers and second semiconductor layers alternatingly arranged, forming a sacrificial gate structure over a portion of the fin structure, removing the first and second semiconductor layers in a source/drain region of the fin structure that is not covered by the sacrificial gate structure, forming an epitaxial source/drain feature in the source/drain region, removing portions of the sacrificial gate structure to expose the first and second semiconductor layers, removing portions of the second semiconductor layers so that at least one second semiconductor layer has a width less than a width of each of the first semiconductor layers, forming a conformal gate dielectric layer on exposed first and second semiconductor layers, and forming a gate electrode layer on the conformal gate dielectric layer.

Abstract: A movable carrier includes a bottom frame assembly, a first support member, a link assembly, a position mechanism, and a first unlock member. The first support member has a first end portion pivotally connected to the bottom frame assembly. The link assembly includes a link member and a first connect member. The link member is disposed at a second end portion of the first support member. The first connect member is pivotally connected to the link member and connected to the second end portion through the link member. The position mechanism is disposed on the link assembly and corresponds to the first connect member. The first unlock member is disposed on the link assembly and connected to the position mechanism. When the first unlock member contacts the bottom frame assembly, it carries the position mechanism to move to change the position of the first connect member.

Abstract: Provided are a light-emitting diode and a semiconductor device.

Abstract: A plasma etching system generates a plasma above a wafer in a plasma etching chamber. The wafer is surrounded by a focus ring. The plasma etching system straightens a plasma sheath above the focus ring by generating a supplemental electric field above the focus ring.

Abstract: A pedaling sensing device of an electric bicycle is configured to connect to a motor and includes a crank axle, a first gearwheel, a second gearwheel, an assisting unit and a sensing unit. The crank axle extends along an axial direction and has a plurality of first helical teeth connected to each other and arranged continuously. The first gearwheel is disposed around the crank axle and comprises a first inner annulus surface and a first outer annulus surface. The first inner annulus surface is formed with a plurality of second helical teeth matching the first helical teeth. The second helical teeth are connected to each other and arranged continuously. The second gearwheel is disposed around the first gearwheel and has a second inner annulus surface. The second inner annulus surface is formed with a second transmission structure matching the first transmission structure.

Abstract: In a method of controlling a plasma beam of a plasma etcher a flow rate controller of the plasma etcher is set to generate one or more flow rates of an etching gas corresponding to one or more plasma beams of the plasma etcher. The emitted light generated by plasma discharge corresponding to the one or more plasma beams of the plasma etcher is monitored. The flow rate controller is calibrated based on the one or more flow rates and a corresponding emitted light of the plasma discharge.

Abstract: A method for processing a semiconductor wafer is provided. The method includes placing a first semiconductor wafer on a wafer chuck in a process chamber. The method further includes adjusting a distance between a gas dispenser positioned above the wafer chuck and an upper edge ring surrounding the wafer chuck. The method also includes producing a plasma for processing the first semiconductor wafer by exciting a gas dispenser from the gas dispenser after the adjustment. In addition, the method includes removing the first semiconductor wafer from the process chamber.

Abstract: A movable carrier includes a bottom frame assembly, a first support member, a link assembly, a position mechanism, and a first unlock member. The first support member has a first end portion pivotally connected to the bottom frame assembly. The link assembly includes a link member and a first connect member. The link member is disposed at a second end portion of the first support member. The first connect member is pivotally connected to the link member and connected to the second end portion through the link member. The position mechanism is disposed on the link assembly and corresponds to the first connect member. The first unlock member is disposed on the link assembly and connected to the position mechanism. When the first unlock member contacts the bottom frame assembly, it carries the position mechanism to move to change the position of the first connect member.

Abstract: A moving carrier comprises a bottom frame assembly, a first support member and a link assembly. A first end portion of the first support member is connected with the bottom frame assembly. The link assembly includes a link member, a first connect member, a second connect member, and two adapter members. The link member is disposed at a second end portion of the first support member. The first connect member and the second connect member are disposed on the link member and connected to the second end portion through the link member. The adapter members are disposed corresponding to ends of the first connect member and the second connect member, and each adapter member has an adapter portion. In the process of changing positions of the first connect member and the second connect member relative to the link member, the adapter portions are oriented to the same direction.

Abstract: An unlocking device with a pause function comprises a first moving member having a first protruding portion, a second moving member having a second protruding portion, and a third moving member having a third end portion and a fourth end portion. The second moving member is disposed corresponding to the first moving member. The second protruding portion is disposed cooperated with the first protruding portion. The third end portion is connected to the second moving member. When the fourth end portion of the third moving member contacts a carry body, and a first end portion of a releasing member moves along a first direction towards the housing, the releasing member drives the first moving member to move in the first direction, so the second moving member holds the position of the releasing member by the second protruding portion and the first protruding portion.

Abstract: A pedaling sensing device of an electric bicycle is configured to connect to a motor and includes a crank axle, a first gearwheel disposed around the crank axle, a second gearwheel disposed around the first gearwheel, a sensing unit, an assisting unit, and a chain wheel. The crank axle has first bevel teeth, and the first gearwheel has a first transmission structure and second bevel teeth matching the first bevel teeth. The second gearwheel has a second transmission structure matching the first transmission structure. When the crank axle is driven by a force to rotate, the first gearwheel, second gearwheel and chain wheel are carried to rotate. The first gearwheel also moves with respect to the crank axle along the axial direction, so the sensing unit can sense the applied force. Then, the motor drives the assisting gearwheel and chain wheel to rotate, thereby achieving assisting riding effect.

Abstract: A plasma processing apparatus is provided. The apparatus includes a lower sheltering module. The apparatus further includes an upper sheltering module arranged adjacent to the lower sheltering module. The apparatus includes an upper plate and an upper PEZ ring positioned around the upper plate. The apparatus also includes a shadowing unit that includes a number of engaging parts in the form of arcs detachably positioned on the upper PEZ ring. In addition, the apparatus includes a plasma generation module for generating plasma in the peripheral region of the lower sheltering module and the upper sheltering module.

Abstract: A drivetrain of an electric bike is provided. The drivetrain includes an outer rotor type motor, a shaft gear, a crankshaft and a single-stage velocity-reduction driving assembly. The outer rotor type motor includes a stator assembly, a rotor assembly and a housing. The rotor assembly is disposed to the housing. The shaft gear includes a joint portion and a gear portion. The joint portion is disposed to the housing. The single-stage velocity-reduction driving assembly is configured around the crankshaft and includes a driving gear. A central axis of the shaft gear and a central axis of the crankshaft are substantially parallel to each other and non-coaxial, and the driving gear directly meshes with the gear portion. Accordingly, the drivetrain of the electric bike of the present invention has the advantages of easier assembly and having lower cost.

Abstract: A carrying device and a folding method thereof are disclosed. The carrying device includes a seat assembly, a front-leg assembly and a rear-leg assembly. The front-leg assembly includes an upper frame, a lower frame, a first transmission member and a second transmission member. The upper frame is disposed at the lower frame. The first transmission member is disposed at the upper frame and corresponded to the second transmission member. The rear-leg assembly disposed at the lower frame includes a third transmission member disposed corresponding to the second transmission member, a rear-leg frame, and a connector connecting the rear-leg frame with the lower frame. When the upper frame moves relative to the lower frame, the first transmission member drives the third transmission member to move by the second transmission member to link the connector to make the rear-leg frame approach or move away from the lower frame.

Abstract: A moving carrier is disclosed. A lower-frame assembly includes a first moving member disposed on the guiding member, a second moving member disposed on the guiding member, an elastic member disposed corresponding to the guiding member, and a third moving member disposed on the second moving member. A transmitting member of a front-wheel assembly has a guiding groove. One end of the third moving member is disposed in the guiding groove. When the first moving member moves along the guiding member, the first moving member enables the elastic member to store a first energy. When the elastic member releases the first energy, the second moving member drives the third moving member to move and the third moving member pushes the guiding groove to move, so that the transmitting member can drive the front-wheel frame to move toward the lower-frame assembly.

Abstract: A moving carrier comprises a bottom frame assembly, a first support member and a link assembly. A first end portion of the first support member is connected with the bottom frame assembly. The link assembly includes a link member, a first connect member, a second connect member, and two adapter members. The link member is disposed at a second end portion of the first support member. The first connect member and the second connect member are disposed on the link member and connected to the second end portion through the link member. The adapter members are disposed corresponding to ends of the first connect member and the second connect member, and each adapter member has an adapter portion. In the process of changing positions of the first connect member and the second connect member relative to the link member, the adapter portions are oriented to the same direction.