Abstract: A semiconductor device includes a plurality of semiconductor layers vertically separated from one another. The semiconductor device includes a gate structure that comprises a lower portion and an upper portion, wherein the lower portion wraps around each of the plurality of semiconductor layers. The semiconductor device includes a gate spacer that extends along a sidewall of the upper portion of the gate structure and has a bottom surface. A portion of the bottom surface of the gate spacer and a top surface of a topmost one of the plurality of semiconductor layers form an angle that is less than 90 degrees.

Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.

Abstract: An electronic package is provided, in which a circuit structure is stacked on a carrier structure having a routing layer via support structures, where electronic elements are disposed on upper and lower sides of the circuit structure and the carrier structure, and the electronic elements and the support structures are encapsulated by a cladding layer, such that the electronic package can effectively increase the packaging density to meet the requirements of multi-functional end products.

Abstract: A semiconductor device includes a plurality of channel layers vertically separated from one another. The semiconductor device also includes an active gate structure comprising a lower portion and an upper portion. The lower portion wraps around each of the plurality of channel layers. The semiconductor device further includes a gate spacer extending along a sidewall of the upper portion of the active gate structure. The gate spacer has a bottom surface. Moreover, a dummy gate dielectric layer is disposed between the gate spacer and a topmost channel layer of plurality of channel layers. The dummy gate dielectric layer is in contact with a top surface of the topmost channel layer, the bottom surface of the gate spacer, and the sidewall of the gate structure.

Abstract: Systems, methods and devices are provided, which can include an engineering change order (ECO) base. A base layout cell includes metal layer regions, conductive gate patterns arranged above metal layer regions; oxide definition (OD) patterns, metal-zero layer over oxide-definition (metal-zero) patterns, at least one cut metal layer (CMD) pattern; and at least one via region. The base layout cell can be implemented in at least two non-identical functional cells. A first functional cell of the at least two non-identical functional cells includes first interconnection conductive patterns arranged connecting metal-zero structures corresponding to at least two metal-zero patterns in a first layout, and a second functional cell of the at least two non-identical functional cells includes second interconnection conductive patterns arranged connecting metal-zero structures corresponding to at least two metal-zero patterns in a second layout.

Abstract: The present invention relates a sealing apparatus with interlocking air inflation device for wafer carrier and a sealing method thereof, wherein the sealing apparatus is disposed between a wafer container and a cover of a wafer carrier, used for sealing the cover and the wafer container when the cover is closed to the wafer container. The sealing apparatus comprises: at least one latch set, at least one interlocked cam, an air inflation sealing member, and at least one air intake/outtake valve, wherein the interlocked cam is adopted for connecting an interlocking device having an air inflation member, and the interlocking device can be used to drive the interlocked cam for making the latch set bolt the cover and the wafer container, and inflate the air inflation sealing member through the air inflation member thereof and the air intake/outtake valve in order to inflate and expand the air inflation sealing member.

Abstract: The present invention relates a sealing apparatus with interlocking air inflation device for wafer carrier and a sealing method thereof, wherein the sealing apparatus is disposed between a wafer container and a cover of a wafer carrier, used for sealing the cover and the wafer container when the cover is closed to the wafer container. The sealing apparatus comprises: at least one latch set, at least one interlocked cam, an air inflation sealing member, and at least one air intake/outtake valve, wherein the interlocked cam is adopted for connecting an interlocking device having an air inflation member, and the interlocking device can be used to drive the interlocked cam for making the latch set bolt the cover and the wafer container, and inflate the air inflation sealing member through the air inflation member thereof and the air intake/outtake valve in order to inflate and expand the air inflation sealing member.