Abstract: Provided are a package structure having a joint structure and a method of forming the same. The package structure includes: a first under bump metallurgy (UBM) structure disposed on a first dielectric layer, wherein the first UBM structure at least comprises: a barrier layer embedded in the first dielectric layer; and an upper metal layer disposed over the barrier layer, wherein a sidewall of the barrier layer is laterally offset outward from a sidewall of the upper metal layer, and a portion of a top surface of the barrier layer is exposed by the first dielectric layer; and a solder layer disposed on the first UBM structure and contacting the upper metal layer.

Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.

Abstract: Some implementations described herein provide techniques and apparatuses for a stacked semiconductor die package. The stacked semiconductor die package may include an upper semiconductor die package above a lower semiconductor die package. The stacked semiconductor die package includes one or more rows of pad structures located within a footprint of a semiconductor die of the lower semiconductor die package. The one or more rows of pad structures may be used to mount the upper semiconductor die package above the lower semiconductor die package. Relative to another stacked semiconductor die package including a row of dummy connection structures adjacent to the semiconductor die that may be used to mount the upper semiconductor die package, a size of the stacked semiconductor die package may be reduced.

Abstract: A package structure is provided. The package structure includes a first die and a second die, a dielectric layer, a bridge, an encapsulant, and a redistribution layer structure. The dielectric layer is disposed on the first die and the second die. The bridge is electrically connected to the first die and the second die, wherein the dielectric layer is spaced apart from the bridge. The encapsulant is disposed on the dielectric layer and laterally encapsulating the bridge. The redistribution layer structure is disposed over the encapsulant and the bridge. A top surface of the bridge is in contact with the RDL structure.

Abstract: The present disclosure provides a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes channel members disposed over a substrate, a gate structure engaging the channel members, and an epitaxial feature adjacent the channel members. At least one of the channel members has an end portion in physical contact with an outer portion of the epitaxial feature. The end portion of the at least one of the channel members includes a first dopant of a first concentration. The outer portion of the epitaxial feature includes a second dopant of a second concentration. The first concentration is higher than the second concentration.

Abstract: A package structure and methods for forming the package structure are provided. The package structure includes a package component, an encapsulant disposed around the package component, and a redistribution structure disposed over the package component and the encapsulant. The package component includes a substrate, a protection structure, which includes an organic material, over a first surface of the substrate, and a multi-layered structure encapsulated by the protection structure. Sidewalls of the multi-layered structure are spaced apart from the encapsulant by the protection structure.

Abstract: A system on chip (SoC) die package is attached to a redistribution structure of a semiconductor device package such that a top surface of the SoC die package is above a top surface of an adjacent memory die package. This may be achieved through the use of various attachment structures that increase the height of the SoC die package. After encapsulating the memory die package and the SoC die package in an encapsulation layer, the encapsulation layer is grinded down. The top surface of the SoC die package being above the top surface of the adjacent memory die package results in the top surface of the SoC die package being exposed through the encapsulation layer after the grinding operation. This enables heat to be dissipated through the top surface of the SoC die package.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure, a backside dielectric layer, conductive terminals, an electronic device, and an underfill is provided. The semiconductor die laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes redistribution conductive layers and thermal enhancement structures electrically insulated from the redistribution conductive layers, and the thermal enhancement structures are thermally coupled to the semiconductor die. The backside dielectric layer is disposed on the redistribution circuit structure. The conductive terminals penetrate through the backside dielectric layer. The electronic device is disposed over the backside dielectric layer and electrically connected to the redistribution circuit structure through the conductive terminals.

Abstract: A data storage device is disclosed. The data storage device comprises a controller and a data storage unit. The controller comprises a firmware. The data storage unit comprises a first system storage sector and a second system storage sector. A state of the first system storage sector is preset as a display state by the firmware, and a state of the second system storage sector is preset as a hidden state by the firmware. The first system storage sector stores an original operating system, and the second system storage sector stores a backup operating system. When the original operating system damages, the firmware will recover the original operating system in the first system storage sector via the backup operating system in the second system storage sector; afterwards, a boot operation can be executed via the original operating system recovered, again.

Abstract: The invention provides a system capable of remotely maintaining the operation of electronic apparatus. The system comprises a cloud management platform and at least one electronic apparatus. The electronic apparatus comprises a data storage device and an operating system maintenance device. The data storage device comprises a plurality of flash memories and a controller. The operating system maintenance device comprises a microprocessor and a network communication component. An operating system is installed in the flash memories of the data storage device. When the operating system of the electronic device is abnormal, the operating system maintenance device receives an operating system repairing instruction from the cloud management platform via the network communication component.

Abstract: A data storage device is disclosed. The data storage device comprises a controller and a data storage unit. The controller comprises a firmware. The data storage unit comprises a first system storage sector and a second system storage sector. A state of the first system storage sector is preset as a display state by the firmware, and a state of the second system storage sector is preset as a hidden state by the firmware. The first system storage sector stores an original operating system, and the second system storage sector stores a backup operating system. When the original operating system damages, the firmware will recover the original operating system in the first system storage sector via the backup operating system in the second system storage sector; afterwards, a boot operation can be executed via the original operating system recovered, again.

Abstract: The invention a computer system is disclosed. The computer system comprises a motherboard and a data storage device. The data storage device comprises a controller and a data storage unit. The controller comprises a firmware. The data storage unit comprises a first system storage sector and a second system storage sector. The first system storage sector stores an original operating system, and a monitoring program is installed in the original operating system. The monitoring program periodically sends an indication signal to the controller. The second system storage sector stores a backup operating system. If the controller doesn't receive the indication signal from the monitoring program, the firmware will execute an operating system recovery procedure to recover the original operating system of the first system storage sector by the backup operating system of the second system storage sector.

Abstract: Systems and methods for personalized sudden cardiac death risk prediction that generates fingerprints of imaging features of cardiac structure and function. One or more fingerprints and clinical data may be used to generate a risk score. The output risk score may be used to predict the time of death in order to select high-risk patients for implantable cardioverter-defibrillator treatment.

Abstract: Provided herein is a method for treating an oral cancer in a subject. According to embodiments of the present disclosure, the method comprises respectively obtaining a first and a second biological samples from a lesion site and a non-lesion site of the subject; respectively measuring the expression levels of CHEK1, PIK3CA, or PIK3CD in both biological samples by qRT-PCR thereby obtaining a first and a second expression level; determining the ratio of the first to the second expression level; and administering to the subject an effective amount of a checkpoint kinase 1 inhibitor when the ratio for CHEK1 is at least 1.7 or a phosphatidylinositol 3-kinase inhibitor when the ratio for PIK3CA is at least 2.4, or when the ratio for PIK3CD is at least 3.1.

Abstract: The invention provides a data storage device comprising a controller and a data storage unit. The data storage unit comprises a first system storage area and a second system storage area. The first system storage area stores an original operating system, and comprises a first initial sector address. The second system storage area stores a backup operating system, and comprises a second initial sector address. The controller comprises a firmware. A boot pointer offset procedure is defined in the firmware. A boot pointer is preset by the firmware to point to the first initial sector address of the first system storage area, and therefore a boot operation is executed by the original operating system. When the original operating system damages, the firmware executes the boot pointer offset procedure to offset the boot pointer to the second initial sector address, and executes the boot operation by the backup operating system.

Abstract: A method for determining immune competence against severe acute respiratory syndrome coronavirus 2 (SARS-CoV-2) includes obtaining a blood sample from a subject in need thereof, detecting, in the blood sample, levels of binding antibodies against SARS-CoV-2 spike S1 protein and its receptor binding domain (RBD), and calculating a weighted value using a regression model. Another method for determining immune competence against SARS-CoV-2 is also disclosed.

Abstract: The invention provides a system capable of remotely controlling electronic apparatus to execute program. The system comprises a cloud management platform and at least one electronic apparatus. The electronic apparatus comprises a data storage device and a program execution management device. The data storage device comprises a plurality of flash memories and a controller. The program execution management device comprises a microprocessor having a network communication function. When the cloud management platform wants the electronic device to execute a specific operation or collect a specific information, it will send a specific operation instruction to the program execution management device.

Abstract: The invention provides a system capable of remotely controlling electronic apparatus, which includes a cloud management platform and at least one electronic apparatus. The electronic apparatus includes at least one operation element, and a data storage device having a network communication function. The data storage device includes a first transmission interface, a second transmission interface, a data storage unit, and an operation management unit. Via the first transmission interface, data stored in the data storage unit can be read or data can be written into the data storage unit. The operation management unit of the data storage device transmits a specific operation instruction to the operation element via the second transmission interface after receiving the specific operation instruction sent from the cloud management platform, such that the operation element can execute a corresponding operation according to the specific operation instruction.

Abstract: Provided herein is a method for treating an oral cancer in a subject. According to embodiments of the present disclosure, the method comprises respectively obtaining a first and a second biological samples from a lesion site and a non-lesion site of the subject; respectively measuring the expression levels of CHEK1, PIK3CA, or PIK3CD in both biological samples by qRT-PCR thereby obtaining a first and a second expression level; determining the ratio of the first to the second expression level; and administering to the subject an effective amount of a checkpoint kinase 1 inhibitor when the ratio for CHEK1 is at least 1.7 or a phosphatidylinositol 3-kinase inhibitor when the ratio for PIK3CA is at least 2.4, or when the ratio for PIK3CD is at least 3.1.

Abstract: A remote control system is disclosed. The remote control system comprises a cloud management platform and an electronic apparatus. The electronic apparatus comprises a data storage device and a motherboard. The data storage device comprises a data storage unit and a program execution management unit. The program execution management unit comprises a microprocessor. The data storage device is connected a powered device module. The powered device module is able to provide an Ethernet power to the data storage device. When the electronic apparatus is in a power-off state, the data storage device can keep working by the Ethernet power, so that the cloud management platform can control the operations of the data storage device at any time.