Patents by Inventor Chih Chiu

Chih Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12369431
    Abstract: A semiconductor structure includes a substrate, an adhesion layer, arranged on the substrate, a first release layer, arranged on the adhesion layer and a first semiconductor device, including a semiconductor epitaxial stack, and a conducting structure directly connected to the first release layer. The first semiconductor device is not electrically connected to the substrate by the adhesion layer and the first release layer.
    Type: Grant
    Filed: February 13, 2024
    Date of Patent: July 22, 2025
    Assignee: EPISTAR CORPORATION
    Inventors: Hao-Min Ku, You-Hsien Chang, Shih-I Chen, Fu-Chun Tsai, Hsin-Chih Chiu
  • Patent number: 12319729
    Abstract: The present disclosure provides an anti-Staphylococcus aureus specific antibody and the nucleic acid encoding sequence thereof, and uses of the same. The anti-Staphylococcus aureus specific antibody of the present disclosure achieves the effect of treating Staphylococcus aureus infection and enhancing immune cells against Staphylococcus aureus through various efficacy experiments.
    Type: Grant
    Filed: April 2, 2024
    Date of Patent: June 3, 2025
    Assignee: CHINA MEDICAL UNIVERSITY HOSPITAL
    Inventors: Der-Yang Cho, Shao-Chih Chiu, Shi-Wei Huang, Chih-Ming Pan, Mei-Chih Chen, Yeh Chen, Po-Ren Hsueh, Tien Ni, Jia-Xin Yu, Chao-Jung Chen
  • Patent number: 12293944
    Abstract: A method of forming a semiconductor device includes forming a conductive line over a substrate; forming an etch stop layer (ESL) over the conductive line, the ESL extending continuously along an upper surface of the conductive line and along an upper surface of a first dielectric layer adjacent to the conductive line, where a first lower surface of the ESL contacts the upper surface of the conductive line, and a second lower surface of the ESL contacts the upper surface of the first dielectric layer, the first lower surface being closer to the substrate than the second lower surface; forming a second dielectric layer over the ESL; forming an opening in the second dielectric layer, the opening exposing a first portion of the ESL; removing the first portion of the ESL to expose the conductive line; and filling the opening with an electrically conductive material to form a via.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: May 6, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Han Chen, Chien-Chih Chiu, Ming-Chung Liang
  • Publication number: 20250135055
    Abstract: The present invention provides a manufacturing method and cleaning method of light-triggered light-transmitting cleaning structure. The manufacturing method includes following steps: step S1, providing a light-transmitting substrate; step S2, forming a nanoparticle layer on the substrate surface; step S3, heating the light-transmitting substrate to a softening temperature and allowing metallic nanoparticles to permeate the light-transmitting substrate; step S4, cooling for the metallic nanoparticles to form a doped structure in the light-transmitting substrate, forming the light-triggered light-transmitting cleaning structure. The cleaning method forms an optical Tamm state by irradiating said structure with a light source to resonate, such that the optical Tamm state interacts with ambient substance to form a cleaning substance for removing pollutants. The present invention achieves the purpose of pollutants cleaning under the conditions of high transparency, high light transmission, and long service life.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 1, 2025
    Inventors: CHENG-SHENG TSUNG, CHUN-CHIH CHIU, YUAN-QIU ZHENG
  • Publication number: 20250118519
    Abstract: A surface mount fuse and fuse element thereof are disclosed. The fuse element has a lead-free flat fuse, a flux layer, and a porous metal layer. The porous metal layer is bonded on one surface of the lead-free flat fuse through the flux layer. A part of the flux layer penetrates into the porous metal layer through capillary action, so the flux fills the pores of the first porous metal layer to distribute on the lead-free flat fuse evenly. When overcurrent occurs in the current loop and high temperature occurs, the flux layer helps the porous metal layer and the lead-free flat fuse to melt effectively, thereby interrupting the current loop in time.
    Type: Application
    Filed: December 14, 2023
    Publication date: April 10, 2025
    Inventors: Hung-Chih CHIU, Po-Shuo CHIU
  • Publication number: 20250110662
    Abstract: A computer vision processing system is provided. The system includes one or more target devices and a processing unit. The target devices are configured to run the executable code of an image processing pipeline. The processing unit is configured to receive a series of application programming interface (API) calls and create a raw graph accordingly, redraw the raw graph into a compilable graph by sequentially processing each node, and compile the compilable graph into the executable code of the image processing pipeline. The series of API calls includes at least one tiling API call to set at least one of the nodes and at least one of the data objects as tileable. Each tileable node corresponds to multiple parallel processing nodes in multiple branches in the compilable graph, and each tileable data object corresponds to multiple tile data objects in the branches in the compilable graph.
    Type: Application
    Filed: September 20, 2024
    Publication date: April 3, 2025
    Inventors: Po-Yuan JENG, Hung-Chun LIU, Yu-Chieh LIN, Chien-Han SU, Yung-Chih CHIU, Lei CHEN
  • Publication number: 20250057973
    Abstract: A drug carrier with a property of crossing the blood-brain barrier comprises an extracellular vesicle with a human leukocyte antigen-G antibody on its surface. This carrier can serve as a pharmaceutical composition for promoting apoptosis of brain tumor cells, inhibiting growth of brain tumor cells, or reducing expression of O6-methylguanine-DNA methyltransferase (MGMT) in brain tumor cells. These effects contribute to the treatment of glioblastoma multiforme (GBM).
    Type: Application
    Filed: August 13, 2024
    Publication date: February 20, 2025
    Inventors: Der-Yang Cho, Shao-Chih Chiu, Yi-Wen Chen, Ming-You Shie, Chih-Ming Pan, Shi-Wei Huang, Yen Chen, Cheng-Yu Chen, Kai-Wen Kan
  • Patent number: 12221483
    Abstract: The present disclosure provides a fusion protein and the nucleic acid encoding sequence thereof, and uses of the same. The fusion protein of the present disclosure achieves the effect of treating cancer, immunoregulation and activating immune cells through various efficacy experiments.
    Type: Grant
    Filed: January 30, 2024
    Date of Patent: February 11, 2025
    Assignee: CHINA MEDICAL UNIVERSITY HOSPITAL
    Inventors: Der-Yang Cho, Shao-Chih Chiu, Shi-Wei Huang, Chih-Ming Pan, Mei-Chih Chen, Yu-Chuan Lin, Yeh Chen, Yi-Wen Chen, Ming-You Shie, Kai-Wen Kan
  • Publication number: 20250037858
    Abstract: The present invention disclose a medical image-based system for predicting lesion classification and a method thereof. The system comprises a feature data extracting module for providing a raw feature data based on a medical image, and a predicting module for outputting a predicted class and a risk index according to the raw feature data. The predicting module comprises a classification unit for generating the predicted class and a prediction score corresponding thereto according to the raw feature data, and a risk evaluation unit for generating the risk index according to the prediction score. The system provides medical personnels a reference score and a risk index to determine progression of a certain disease.
    Type: Application
    Filed: February 1, 2024
    Publication date: January 30, 2025
    Inventors: YI-SHAN TSAI, YU-HSUAN LAI, CHENG-SHIH LAI, CHAO-YUN CHEN, MENG-JHEN WU, YI-CHUAN LIN, YI-TING CHIANG, PENG-HAO FANG, PO-TSUN KUO, YI-CHIH CHIU
  • Publication number: 20240387254
    Abstract: A semiconductor structure includes a via in contact with a conductive line and extending through a first etch stop layer, a first inter-metal dielectric layer, and a second etch stop layer. The second etch stop layer is disposed over the first inter-metal dielectric layer, and the first inter-metal dielectric layer is disposed over the first etch stop layer. The semiconductor structure also includes a trench in contact with the via and extending through an insulating layer and a second inter-metal dielectric layer. The second inter-metal dielectric layer is disposed over the insulating layer which is disposed over the second etch stop layer.
    Type: Application
    Filed: July 29, 2024
    Publication date: November 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Han Chen, Shih-Yu Chang, Chien-Chih Chiu, Yi-Tang Chen, Da-Wei Lin
  • Publication number: 20240387227
    Abstract: Semiconductor devices, methods of manufacturing the semiconductor device and tools are disclosed herein. Some methods include providing an electrostatic chuck and placing an edge ring adjacent to the electrostatic chuck. The electrostatic chuck includes a first electrode to generate a sheath at a first distance over the electrostatic chuck. The edge ring includes a coil and a second electrode to generate an electric field control to maintain a portion of the sheath over the edge ring in a coplanar orientation with the portion of the sheath over the electrostatic chuck.
    Type: Application
    Filed: July 29, 2024
    Publication date: November 21, 2024
    Inventors: Shih-Yu Chang, Chien-Han Chen, Chien-Chih Chiu, Chi-Che Tseng
  • Patent number: 12148657
    Abstract: A semiconductor interconnect structure includes a conductive line electrically coupled to an active semiconductor device, a first etch stop layer formed over the conductive line, a first dielectric layer formed over the first etch stop layer, a second etch stop layer formed over the first dielectric layer, a second dielectric layer formed over the second etch stop layer, and an interconnect structure electrically coupled to the via and extending through the first etch stop layer, the first dielectric layer, the second etch stop layer, and the second dielectric layer. The interconnect structure includes a via extending through the first etch stop layer, the second etch stop layer, and the first dielectric layer and a trench extending through the second dielectric layer.
    Type: Grant
    Filed: March 27, 2023
    Date of Patent: November 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chien-Han Chen, Shih-Yu Chang, Chien-Chih Chiu, Yi-Tang Chen, Da-Wei Lin
  • Publication number: 20240374726
    Abstract: A BAG6 specific chimeric antigen receptor, a nucleic acid, a BAG6 specific chimeric antigen receptor expression plasmid, a BAG6 specific chimeric antigen receptor expressing cell, a pharmaceutical composition for treating cancer, and use of the BAG6 specific chimeric antigen receptor expressing cell are provided. The BAG6 specific chimeric antigen receptor specifically binds to BCL2 associated athanogene 6 (BAG6). The nucleic acid encodes the BAG6 specific chimeric antigen receptor. The BAG6 specific chimeric antigen receptor expression plasmid expresses the BAG6 specific chimeric antigen receptor. The BAG6 specific chimeric antigen receptor expressing cell is obtained by transducing the BAG6 specific chimeric antigen receptor into an immune cell. The pharmaceutical composition for treating cancer includes the BAG6 specific chimeric antigen receptor expressing cell and a pharmaceutically acceptable carrier.
    Type: Application
    Filed: May 3, 2024
    Publication date: November 14, 2024
    Applicant: China Medical University Hospital
    Inventors: Der-Yang Cho, Shao-Chih Chiu, Chia-Ing Jan, Chih-Ming Pan, Shi-Wei Huang
  • Patent number: 12130519
    Abstract: A backlight assembly is provided, comprising a backboard, one or more light sources, a diffuser plate, and one or more supporting assembly. The light sources are arranged on the backboard. The diffuser plate is arranged on the light-emitting side of the light source. The supporting assembly is arranged between the backboard and the diffuser plate. The supporting assembly comprises a supporting base and an elastic support. The supporting base connects with the backboard, one end of the elastic support is connected with the supporting base, another end of the elastic support supports the diffuser plate. The elastic support defines on a plurality of dimming grooves, the plurality of dimming grooves reflects at least a part of light emitted by the light source to the diffusion plate.
    Type: Grant
    Filed: December 7, 2023
    Date of Patent: October 29, 2024
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chih-Hsien Chen, Chia-Huang Chang, Ming-Chih Chiu
  • Patent number: 12124548
    Abstract: An authentication system for authenticating an identification of a subject is provided. The authentication system includes a photoplethysmogram (PPG) sensor, a storage device, and a processor. The PPG sensor is configured to sense pulses of a blood vessel of the subject to generate a sensed PPG signal of the subject. The storage device stores an authentication model. The processor is configured to load the authentication model from the storage device and input the sensed PPG signal and a reference PPG signal into the authentication model to generate a result value which indicates whether the identification of the subject passes an authentication test.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: October 22, 2024
    Assignee: MEDIATEK INC.
    Inventors: Hung-Chih Chiu, En Jen
  • Publication number: 20240332069
    Abstract: A semiconductor interconnect structure includes a conductive line electrically coupled to an active semiconductor device, a first etch stop layer formed over the conductive line, a first dielectric layer formed over the first etch stop layer, a second etch stop layer formed over the first dielectric layer, a second dielectric layer formed over the second etch stop layer, and an interconnect structure electrically coupled to the via and extending through the first etch stop layer, the first dielectric layer, the second etch stop layer, and the second dielectric layer. The interconnect structure includes a via extending through the first etch stop layer, the second etch stop layer, and the first dielectric layer and a trench extending through the second dielectric layer.
    Type: Application
    Filed: March 27, 2023
    Publication date: October 3, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Han Chen, Shih-Yu Chang, Chien-Chih Chiu, Y.T. Chen, Da-Wei Lin
  • Patent number: 12106920
    Abstract: A lightweight industrial fuse has a housing and a conductive fuse. The housing has a first plastic half-housing and a second half-housing combined with each other. The conductive fuse is integrally formed and clamped between the first and second half-housing. The conductive fuse has a fusible body and two intermediary portions disposed within the housing, and two electrode portions exposed from two opposite ends of the housing. Thus, an enclosed accommodation cavity of the housing is defined through the combination of the first and second half-housing. A manufacturing process is simplified, and a manufacturing cost is decreased, and further a weight of the industrial fuse is effectively reduced.
    Type: Grant
    Filed: November 23, 2022
    Date of Patent: October 1, 2024
    Assignee: CONQUER ELECTRONICS CO., LTD.
    Inventors: Hung-Chih Chiu, Po-Shuo Chiu
  • Publication number: 20240269077
    Abstract: A solution for preserving extracellular vesicles/exosomes has a carrier solvent selected from a group consisting of polysorbate 80, sucrose, and polyethylene glycol 3350/4000; and a stabilizer selected from a group consisting of salts, amino acids, and amino acid salts; wherein the pH of the preservation solution ranges from 5 to 7.4.
    Type: Application
    Filed: February 6, 2024
    Publication date: August 15, 2024
    Inventors: Yi-Wen Chan, Ming-You SHIE, Yen CHEN, Der-Yang CHO, Shao-Chih CHIU, Yen-Hong LIN, Kai-Wen KAN
  • Patent number: 12012454
    Abstract: The present disclosure provides an anti-tumor antigen nanobody that specifically binds to a human leukocyte antigen-G. The present disclosure also provides the nucleic acid sequence of the anti-tumor antigen nanobody, use of the anti-tumor antigen nanobody for treating cancer and immune-related disorders, and a method for detecting expression levels of HLA-G.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: June 18, 2024
    Assignee: CHINA MEDICAL UNIVERSITY HOSPITAL
    Inventors: Der-Yang Cho, Shao-Chih Chiu, Shi-Wei Huang, Chih-Ming Pan, Mei-Chih Chen, Yu-Chuan Lin, Yeh Chen
  • Publication number: 20240186446
    Abstract: A semiconductor structure comprises a substrate, an adhesion layer, arranged on the substrate, a first release layer, arranged on the adhesion layer and a first semiconductor device, comprising a semiconductor epitaxial stack, and a conducting layer directly connected to the first release layer, wherein the first semiconductor device is not electrically connected to the substrate by the adhesion layer and the first release layer.
    Type: Application
    Filed: February 13, 2024
    Publication date: June 6, 2024
    Inventors: Hao-Min KU, You-Hsien CHANG, Shih-I CHEN, Fu-Chun TSAI, Hsin-Chih CHIU