Abstract: A method for fabricating a sensing device includes the following steps. Firstly, an adhering process is performed to attach a sensing integrated circuit on a first circuit board, wherein the sensing integrated circuit has a sensing surface. Then, a packaging process is performed to encapsulate the first circuit board within a package shell, so that at least a portion of a top surface of the first circuit board is covered by the package shell. The sensing surface of the sensing integrated circuit is exposed to a top surface of the package shell. Afterwards, a protective layer is attached on the sensing surface.