Abstract: A housing structure manufacturing method and an electronic device are provided. The housing structure manufacturing method includes providing a plurality of memory polymeric materials, heating the plurality of memory polymeric materials, and forming the housing structure having a first morphology by printing the plurality of memory polymeric materials that are heated.

Abstract: The disclosure provides a heat dissipation structure and a heat dissipation assembly including the same. The heat dissipation structure includes an accommodation portion and two mount portions. The accommodation portion includes a cover part and two sidewall parts. The cover part is located between and connected to the two sidewall parts. The cover part is located between and connected to the two mount portions by the two sidewall parts. Each of the two sidewall parts is absent of any holes, or the heat dissipation structure has a hollow structure located at the cover part and extending between the two mount portions.

Abstract: A housing structure manufacturing method and an electronic device are provided. The housing structure manufacturing method includes providing a plurality of memory polymeric materials, heating the plurality of memory polymeric materials, and forming the housing structure having a first morphology by printing the plurality of memory polymeric materials that are heated.

Abstract: A heating stage includes a pedestal and a thermal-conductive plate. The thermal-conductive plate is located on the pedestal. The thermal-conductive plate has a central portion and an edge portion surrounding the central portion, and the edge portion comprises a first portion and a second portion connected to the first portion, where the first portion is sandwiched between the central portion and the second portion. A height of the second portion gradually decreases along a direction from the central portion toward the edge portion.

Abstract: A lens includes a curved surface. A plurality of taper shape structures is formed on the curved surface, and each taper shape structure has at least three substantial flat surfaces. P is less than or equal to 500 nm. H is less than or equal to 500 nm. The P refers to the pitch between two adjacent taper shape structures. The H refers to maximum vertical distance between each taper shape structure and the curved surface.

Abstract: A heating stage includes a pedestal and a thermal-conductive plate. The thermal-conductive plate is located on the pedestal. The thermal-conductive plate has a central portion and an edge portion surrounding the central portion, and the edge portion comprises a first portion and a second portion connected to the first portion, where the first portion is sandwiched between the central portion and the second portion. A height of the second portion gradually decreases along a direction from the central portion toward the edge portion.

Abstract: A heat-dissipating device for expansion card is provided. The expansion card has a printed circuit card. The printed circuit card has an inserting-type connecter at one end thereof and a securing hole formed at the other end thereof. The heat-dissipating device includes a base plate, a plurality of cooling fins protruded from the base plate, a screwing portion, and at least one hooking part. The base plate has a flat bottom surface, a first side and a second side opposite to the first side. The screwing portion is formed at the first side of the base plate. The position of the screwing portion is corresponding to that of the securing hole of the expansion card. The at least one hooking part is disposed at the second side of the base plate and is hooked with one side of the printed circuit card.

Abstract: A lens includes a curved surface. A plurality of taper shape structures is formed on the curved surface, and each taper shape structure has at least three substantial flat surfaces. P is less than or equal to 500 nm. H is less than or equal to 500 nm. The P refers to the pitch between two adjacent taper shape structures. The H refers to maximum vertical distance between each taper shape structure and the curved surface.

Abstract: A lamp includes a shell, a lamp head, and an electrical cable. The shell has an outer surface and an inner surface. The inner shell surface defines a recess and two or more locking pieces extending out from the exterior surface. The lamp head has an exterior surface and a locking portion extending out from the exterior portion. The electrical cable has a first end connected to the lamp head and a second end extending into the shell recess. The two or more locking pieces are configured to form one or more locking grooves. The locking portion is releasably receivable into the one or more locking groove locking the lamp head to the shell. The second end of the electrical cable is connectable to a light positioned in the shell recess with the lamp head, electrical cable and light cooperating to form a circuit loop.

Abstract: A method for describing characteristics of drawn objects by a text string includes drawing at least one object on a first display area of a first electronic device; the first electronic device generating a text string according to a type of the at least one object and a position of the at least one object shown on the first display area, the text string including a description text of the at least one object, the description text of the at least one object including a code of the at least one object and coordinates of the at least one object; the first electronic device transmitting the text string to a second electronic device; and the second electronic device displaying the at least one object on a second display area of the second electronic device according to the text string.

Abstract: A clip assembly for clipping a heatsink module on the first or second circuit board is provided. The first and second circuit boards respectively have first and second mounting holes located around the first and second device. The clip assembly includes a base, mounting parts and a clipper. The base located on the first or second circuit board has an opening, first clipping portions, third and fourth mounting holes. The first or second device is disposed in the opening and the heatsink module is in contact with the first or second device. The mounting parts pass through the corresponding first and third mounting holes or through the corresponding second and fourth mounting holes for fixing the base on the first or second circuit board. The clipper has second clipping portions to clasp first clipping portions so as to clip the heatsink module on the base.

Abstract: A heat dissipation module is provided. The heat dissipation module comprises a fixing part and a plurality of heat dissipation fins. The heat dissipation fins are fastened unto the fixing part. Each heat dissipation fin has at least a bent portion. The bent portion connects to a first portion and a second portion. Furthermore, the first portion and the second portion are not located on the edge of the heat dissipation fin. Since the heat dissipation module uses fins having bent portions, a larger heat dissipation area is provided for achieving a better cooling effect.

Abstract: A method for fabricating a crack resistant inter-layer dielectric for a salicide process. The method includes forming an insulating layer on a provided substrate, forming a planarized inter-layer dielectric layer on the insulating layer, and performing a short-duration thermal treatment to increase the density of the inter-layer dielectric layer.