Abstract: An electronic device includes a monitor stand, a hinge mechanism, and an operation element. The hinge mechanism includes a back plate, a speed reduction assembly, and a friction assembly. The back plate is fixed to the monitor stand. The speed reduction assembly includes an input plate and a speed reduction member. The speed reduction member is arranged on the input plate. The friction assembly is arranged between the back plate and the input plate. The operation element is connected to the speed reduction member. A rotation center of the operation element coincides with an axis of the back plate and the speed reduction member are coaxially arranged.

Abstract: The present specification describes examples of position-based switching of display devices. An example augmented reality (AR) device includes an AR display device to render display data. The example AR device also includes a wireless communication device to transmit and receive wireless signals. The example AR device further includes a processor to: 1) determine a position of the AR device relative to a computing device based on wireless signals communicated with the computing device; and 2) switch an activity state of the AR display device based on the determined position of the AR device relative to the computing device.

Abstract: Systems, methods, and computer programs products are described for optimizing circuit synthesis for implementation on an integrated circuit. A register transfer level code description of logic behavior of a circuit. The register transfer level code description is converted into structurally defined circuit designs for multiple types of components and feature size technologies. A floor plan of each structurally defined circuit design is generated. A physically simulated circuit is created for each floor plan. A range of operating conditions is swept over to analyze power, performance, and area of each physically simulated circuit.

Abstract: An antenna rotation structure includes a rotating shaft member rotatably disposed through a perforated groove of a housing, an annular member, and an elastic member. The rotating shaft member has a holding portion located in an accommodating space of the housing, a connecting portion connected to the holding portion and with an annular groove, and a gripping portion with one end connected to the connecting portion and the other end protruded from the housing. The annular member is disposed in the annular groove and abuts the perforated groove. The elastic member is sleeved on the one end of the gripping portion. The connecting portion and the one end of the gripping portion are disposed in the perforated groove. The gripping portion is turned to drive the rotating shaft member to rotate, thereby adjusting an angle of the antenna.

Abstract: A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.

Abstract: An optical structure film and a light source module are provided. The optical structure film includes multiple optical unit microstructures. Each of the optical unit microstructures has four side surfaces and an inwardly concave beam splitting surface. The beam splitting surface is respectively connected to the side surfaces, and the beam splitting surface has four endpoints when viewed from a front viewing angle. Connection lines of the four endpoints form a rectangle. The beam splitting surface includes at least one beam splitting curved surface. A junction of the at least one beam splitting curved surface and one of the four side surfaces is a first line segment. A projection of a midpoint of an edge of the rectangle on the beam splitting surface overlaps with a relative extreme point of the first line segment.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: An IC device includes first through third rows of fin field-effect transistors (FinFETs), wherein the second row is between and adjacent to each of the first and third rows, the FinFETs of the first row are one of an n-type or p-type, the FinFETs of the second and third rows are the other of the n-type or p-type, the FinFETs of the first and third rows include a first total number of fins, and the FinFETs of the second row include a second total number of fins one greater or fewer than the first total number of fins.

Abstract: In one example in accordance with the present disclosure, an electronic device is described. The electronic device includes a wireless controller. The wireless controller is to establish a first wireless connection between the electronic device and a peripheral device to receive a unique identifier for a second electronic device. The wireless controller is also to establish, based on the unique identifier for the second electronic device, a second wireless connection between the electronic device and the second electronic device. The electronic device includes a wireless transceiver to wirelessly transfer data to the second electronic device through the second wireless connection.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A wafer container includes a frame, a door and at least a pair of shelves. The frame has opposite sidewalls. The pair of the shelves are respectively disposed and aligned on the opposite sidewalls of the frame. Various methods and devices are provided for holding at least one wafer to the shelves during transport.

Abstract: A portable electronic device including a first body, a second body, and a hinge mechanism is provided. The second body is connected to the first body through the hinge mechanism, and the hinge mechanism has a basis axis located at the first body and a rotation axis located at a lower end of the second body. When the second body rotates with respect to the first body, the rotation axis slides along an arc shaped path with respect to the basis axis to increase or decrease a distance between the rotation axis and the basis axis and increase or decrease a distance between the lower end of the second body and a back end of the first body.

Abstract: A quenching fixture adapted to clamp at least one workpiece is provided. The quenching fixture includes a first positioning component and a second positioning component. Both of the first positioning component and the second positioning component have a positioning surface, multiple protrusions protruding from the positioning surface and a heat dissipation channel disposed between the protrusions in a staggered manner. The positioning surface of the first positioning component faces the positioning surface of the second positioning component, and the protrusions of the first positioning component overlap the protrusions of the second positioning component. The workpiece is clamped between the protrusions of the first positioning component and the protrusions of the second positioning component.

Abstract: A housing structure manufacturing method and an electronic device are provided. The housing structure manufacturing method includes providing a plurality of memory polymeric materials, heating the plurality of memory polymeric materials, and forming the housing structure having a first morphology by printing the plurality of memory polymeric materials that are heated.

Abstract: A heating stage includes a pedestal and a thermal-conductive plate. The thermal-conductive plate is located on the pedestal. The thermal-conductive plate has a central portion and an edge portion surrounding the central portion, and the edge portion comprises a first portion and a second portion connected to the first portion, where the first portion is sandwiched between the central portion and the second portion. A height of the second portion gradually decreases along a direction from the central portion toward the edge portion.

Abstract: A lens includes a curved surface. A plurality of taper shape structures is formed on the curved surface, and each taper shape structure has at least three substantial flat surfaces. P is less than or equal to 500 nm. H is less than or equal to 500 nm. The P refers to the pitch between two adjacent taper shape structures. The H refers to maximum vertical distance between each taper shape structure and the curved surface.

Abstract: A heating stage includes a pedestal and a thermal-conductive plate. The thermal-conductive plate is located on the pedestal. The thermal-conductive plate has a central portion and an edge portion surrounding the central portion, and the edge portion comprises a first portion and a second portion connected to the first portion, where the first portion is sandwiched between the central portion and the second portion. A height of the second portion gradually decreases along a direction from the central portion toward the edge portion.

Abstract: A heat-dissipating device for expansion card is provided. The expansion card has a printed circuit card. The printed circuit card has an inserting-type connecter at one end thereof and a securing hole formed at the other end thereof. The heat-dissipating device includes a base plate, a plurality of cooling fins protruded from the base plate, a screwing portion, and at least one hooking part. The base plate has a flat bottom surface, a first side and a second side opposite to the first side. The screwing portion is formed at the first side of the base plate. The position of the screwing portion is corresponding to that of the securing hole of the expansion card. The at least one hooking part is disposed at the second side of the base plate and is hooked with one side of the printed circuit card.