Patents by Inventor Chih-Chun Liu

Chih-Chun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11139242
    Abstract: Integrated chips and methods for forming vias in the same include forming a multi-layer isolation structure on an underlying layer. The multi-layer isolation structure includes a first isolation layer around a second isolation layer. Conductive material is formed around the multi-layer isolation structure. The first isolation layer is etched back to expose at least a portion of a sidewall of the conductive material. A conductive via is formed to contact a top surface and the exposed portion of the sidewall of the conductive material.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: October 5, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Ruilong Xie, Chih-Chao Yang, Chi-Chun Liu, Kangguo Cheng
  • Publication number: 20210286412
    Abstract: A portable electronic device including a first body, a second body, a hinge mechanism, a control unit, a sensor unit, a sterilization module, and a shielding module, is provided. The first body has a first inner surface. The second body has a second inner surface. The hinge mechanism is connected between the first body and the second body. The control unit is disposed in the first body or the second body. The sensor unit is disposed in the first body or the second body and coupled to the control unit. The sterilization module is disposed at the hinge mechanism and coupled to the control unit, the sterilization module is configured to generate light for sterilization and disinfection. The shielding module is disposed on the hinge mechanism and the shielding module can move relative to the hinge mechanism.
    Type: Application
    Filed: March 5, 2021
    Publication date: September 16, 2021
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Yi-Chun Lin, Ya-Hui Tseng, I-Kai Liu, Po-Ching Chiang, Chien-Lun Sun, Yen-Kang Chen, Jih-Houng Lee, Chih-Chien Liu
  • Publication number: 20210286274
    Abstract: A method of performing a lithography process includes providing a test pattern. The test pattern includes a first set of lines arranged at a first pitch, a second set of lines arranged at the first pitch, and further includes at least one reference line between the first set of lines and the second set of lines. The test pattern is exposed with a radiation source providing an asymmetric, monopole illumination profile to form a test pattern structure on a substrate. The test pattern structure is then measured and a measured distance correlated to an offset of a lithography parameter. A lithography process is adjusted based on the offset of the lithography parameter.
    Type: Application
    Filed: March 29, 2021
    Publication date: September 16, 2021
    Inventors: Chih-Jie LEE, Shih-Chun HUANG, Shih-Ming CHANG, Ken-Hsien HSIEH, Yung-Sung YEN, Ru-Gun LIU
  • Patent number: 11119001
    Abstract: A machine tool health monitoring method which is to use a predetermined plurality of vibration sensors on a plurality of components of a machine tool and to drive motors of the machine tool to excite the machine tool using an electronic device while the health status of the machine tool is good, and then to perform a diagnostic process to obtain a characteristic cluster consisting of a plurality of modals, and then to define the characteristic cluster as a sample health characteristic cluster. The diagnostic process includes the procedures of vibration transmissibility obtaining, singular value decomposition, curve fitting and modal establishing. In addition, excite the machine tool and proceed the diagnosis process to obtain a current health characteristic cluster. Finally, the current health characteristic cluster is compared with the sample health characteristic cluster to judge whether the machine tool is healthy or not.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: September 14, 2021
    Assignees: NATIONAL CHUNG CHENG UNIVERSITY, TONGTAI MACHINE & TOOL CO., LTD.
    Inventors: Chih-Chun Cheng, Yu-Sheng Chiu, Wen-Nan Cheng, Ping-Chun Tsai, Yu-Hsin Kuo, Wei-Jen Chen, De-Shin Liu, Chen-Wei Chuang, Chih-Ta Wu, Wen-Peng Tseng, Wen-Chieh Kuo
  • Publication number: 20210280511
    Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
    Type: Application
    Filed: May 10, 2021
    Publication date: September 9, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Publication number: 20210280607
    Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.
    Type: Application
    Filed: May 24, 2021
    Publication date: September 9, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Liang CHEN, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Ru-Gun Liu, Wei-Cheng Lin, Lei-Chun Chou, Wei-An Lai
  • Patent number: 11106000
    Abstract: A driving mechanism for supporting an optical member is provided, including a base, a frame, a movable portion, a driving module, and an adhesive member. The base includes a plurality of first sidewalls, and at least one recess is formed on the first sidewalls. The frame includes a plurality of second sidewalls, and at least one opening is formed on the second sidewalls. The base and the frame form a hollow box, and the opening corresponds to the recess. The movable portion and the driving module are disposed in the hollow box. The driving module can drive the movable portion to move relative to the base. The adhesive member is accommodated in the opening and the recess, and extended along the first sidewalls. The adhesive member is disposed between the first sidewalls and the second sidewalls.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: August 31, 2021
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Bing-Ru Song, Yi-Ho Chen, Chia-Pin Hsu, Chih-Wei Weng, Shin-Hua Chen, Chien-Lun Huang, Chao-Chun Chang, Shou-Jen Liu, Kun-Shih Lin, Nai-Wen Hsu, Yu-Cheng Lin, Shang-Yu Hsu, Yu-Huai Liao, Yi-Hsin Nieh, Shih-Ting Huang, Kuo-Chun Kao, Fu-Yuan Wu
  • Publication number: 20210223821
    Abstract: An electronic device assembly is provided, including an electronic device body and a detachable lens module. The electronic device body has a housing and a first joining unit, wherein the first joining unit is disposed on the housing. The detachable lens module is detachably assembled onto the housing and has a second joining unit, wherein the first joining unit is joined to the second joining unit to electrically connect the detachable lens module to the electronic device body.
    Type: Application
    Filed: June 19, 2020
    Publication date: July 22, 2021
    Applicant: Acer Incorporated
    Inventors: Yu-Shih Wang, Yi-Ta Huang, Chih-Chun Liu, Cheng-Nan Ling, Wen-Chieh Tai, Chi-Hung Lai, Wu-Chen Lee, Pin-Chueh Lin, Chih-Wei Liao, Ting-Wen Pai, Wen-Chieh Chen
  • Publication number: 20210208635
    Abstract: An electronic device includes a casing, a stylus, a first magnet, a magnetic ring, and a pair of second magnets. The casing has a surface and an accommodation groove recessed from the surface. The stylus has a front end and a rear end. The first magnet is disposed at one of the front end and the rear end of the stylus, and the magnetic ring is disposed at the other of the front end and the rear end of the stylus. The second magnets are disposed in the casing and located below the accommodation groove, where locations of the first magnet and the magnetic ring correspond to locations of the second magnets.
    Type: Application
    Filed: August 13, 2020
    Publication date: July 8, 2021
    Applicant: Acer Incorporated
    Inventors: Yu-Shih Wang, Wen-Chieh Tai, Cheng-Nan Ling, Chih-Chun Liu
  • Publication number: 20210151267
    Abstract: A touch pad structure includes a touch pad, a dome switch, and a buffer film. The touch pad includes a fulcrum end and a moving end opposite to the fulcrum end, and the touch pad has an outer surface and an inner surface opposite to the outer surface. The dome switch is disposed at the moving end and connected to the inner surface of the touch pad. The dome switch includes a switch body and a convex portion protruding from the switch body. The buffer film is attached to the inner surface of the touch pad and the dome switch. The buffer film covers the dome switch and has a perforation, and the convex portion of the dome switch is located inside the perforation.
    Type: Application
    Filed: June 19, 2020
    Publication date: May 20, 2021
    Applicant: Acer Incorporated
    Inventors: Ting-Wen Pai, Wen-Chieh Tai, Cheng-Nan Ling, Chih-Chun Liu, Hung-Jen Su
  • Patent number: 11009974
    Abstract: A touch pad structure includes a first casing, a second casing, a touch pad, an elastic element, a button, and an adjusting element. The first casing has an opening and is disposed on the second casing. The touch pad is disposed in the opening. The touch pad has a pivot portion and a movable portion. The pivot portion is pivoted to the first casing. A side of the movable portion facing the second casing is provided with a trigger. The elastic element is located between the first casing and the second casing. The elastic element has a first end and a second end. The button is aligned to the trigger and abuts against the first end of the elastic element. The adjusting element rotatably and movably penetrates through the second casing and is aligned to the button. The adjusting element abuts against the second end of the elastic element.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: May 18, 2021
    Assignee: Acer Incorporated
    Inventors: Ting-Wen Pai, Chih-Chun Liu, Yu-Shih Wang, Chien-Yuan Chen
  • Publication number: 20210100133
    Abstract: A fan system is used for dissipating heat of an electronic device. The fan system includes a fan, a hollow structure, and a control circuit. Sound waves made by the fan are transmitted to an interior of the hollow structure when the fan is operating. The control circuit is connected to the hollow structure and is configured to control deformation/deformations of the hollow structure according to a state/states of the fan and/or the electronic device, which change a volume of the interior of the hollow structure for making a resonance frequency of the hollow structure being approximate to a rotation speed of the fan or being the same as the rotation speed of the fan.
    Type: Application
    Filed: November 30, 2020
    Publication date: April 1, 2021
    Inventors: Cheng-Pang WANG, Chih-Chun LIU, Hung Jen SU, Wen-Chen WU
  • Publication number: 20210059059
    Abstract: A foldable electronic device including a first body, a second body, a flexible display disposed on the first and the second bodies, a hinge assembly connected between the first and the second bodies, an extension chain assembly, and a linkage is provided. The first and the second bodies are rotated relatively to be unfolded or folded via the hinge assembly. An end of the linkage and an end of the extension chain assembly are pivoted together and coupled to the first body in a sliding and pivoting manner. Another end of the linkage is pivoted to the hinge assembly, and another end of the extension chain assembly is pivoted to the second body. In a transforming process between the folded and the unfolded states, an extension traveling of the extension chain assembly compensates a size difference of the flexible display between the folded and the unfolded states.
    Type: Application
    Filed: April 27, 2020
    Publication date: February 25, 2021
    Applicant: Acer Incorporated
    Inventors: Ting-Wen Pai, Chi-Hung Lai, Wu-Chen Lee, Chih-Chun Liu
  • Publication number: 20210055762
    Abstract: An electronic device is provided, including a main body, a cover movably connected to the main body, a biasing element connected to the cover and the main body, a movable member movably disposed on the main body, and a magnetic element disposed on the movable member. When the cover is located in a closed position relative to the main body, the cover is attracted by the magnetic element and restricted in the closed position. When the movable member is pushed by an external force to move from its initial position to a first position, the movable member and the magnetic element separate from the cover, and the biasing element drives the cover to move from the closed position to an open position.
    Type: Application
    Filed: April 10, 2020
    Publication date: February 25, 2021
    Inventors: Ting-Wen PAI, Wen-Chieh TAI, Cheng-Nan LING, Chih-Chun LIU, Yu-Shih WANG
  • Publication number: 20210011565
    Abstract: A touch pad structure includes a first casing, a second casing, a touch pad, an elastic element, a button, and an adjusting element. The first casing has an opening and is disposed on the second casing. The touch pad is disposed in the opening. The touch pad has a pivot portion and a movable portion. The pivot portion is pivoted to the first casing. A side of the movable portion facing the second casing is provided with a trigger. The elastic element is located between the first casing and the second casing. The elastic element has a first end and a second end. The button is aligned to the trigger and abuts against the first end of the elastic element. The adjusting element rotatably and movably penetrates through the second casing and is aligned to the button. The adjusting element abuts against the second end of the elastic element.
    Type: Application
    Filed: February 11, 2020
    Publication date: January 14, 2021
    Applicant: Acer Incorporated
    Inventors: Ting-Wen Pai, Chih-Chun Liu, Yu-Shih Wang, Chien-Yuan Chen
  • Patent number: 10879656
    Abstract: A plug connector includes a conductive body, an insulative body, and a ring shape conductive terminal. The conductive body has an assembling hole. The insulative body is sleeved on the conductive body, wherein the insulative body has an opening hole and the assembling hole is aligned with the opening hole. The ring shape conductive terminal is assembled in the assembling hole, wherein the ring shape conductive terminal includes a conductive inner ring and the conductive inner ring includes a plurality of conductive portions. The conductive portions are arranged circularly and each conductive portion has at least two conductive contacts.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: December 29, 2020
    Assignee: Acer Incorporated
    Inventors: Yu-Shih Wang, Chih-Chun Liu, Wen-Chieh Tai
  • Publication number: 20200274305
    Abstract: A plug connector includes a conductive body, an insulative body, and a ring shape conductive terminal. The conductive body has an assembling hole. The insulative body is sleeved on the conductive body, wherein the insulative body has an opening hole and the assembling hole is aligned with the opening hole. The ring shape conductive terminal is assembled in the assembling hole, wherein the ring shape conductive terminal includes a conductive inner ring and the conductive inner ring includes a plurality of conductive portions. The conductive portions are arranged circularly and each conductive portion has at least two conductive contacts.
    Type: Application
    Filed: August 2, 2019
    Publication date: August 27, 2020
    Applicant: Acer Incorporated
    Inventors: Yu-Shih Wang, Chih-Chun Liu, Wen-Chieh Tai
  • Publication number: 20200045845
    Abstract: A fan system is used for dissipating heat of an electronic device. The fan system includes a fan, a hollow structure, and a control circuit. Sound waves made by the fan are transmitted to an interior of the hollow structure when the fan is operating. The control circuit is connected to the hollow structure and is configured to control deformation/deformations of the hollow structure according to a state/states of the fan and/or the electronic device, which change a volume of the interior of the hollow structure for making a resonance frequency of the hollow structure being approximate to a rotation speed of the fan or being the same as the rotation speed of the fan.
    Type: Application
    Filed: November 15, 2018
    Publication date: February 6, 2020
    Inventors: Cheng-Pang Wang, Chih-Chun Liu, Hung Jen Su, Wen-Chen Wu
  • Publication number: 20180261957
    Abstract: An electronic device is provided, including a first module and a second module. The first module includes a housing, a fixing member, a connector, and a flexible member. The housing has a first hole. The fixing member is fixed on the housing and has a second hole corresponding to the first hole. The connector extends through the first and second holes. The flexible member is disposed in the second hole and surrounds the connector. The second module includes a connecting base, wherein the connector is detachably connected to the connecting base.
    Type: Application
    Filed: October 4, 2017
    Publication date: September 13, 2018
    Inventors: Guang-Zong LI, Hung-Jen SU, Chih-Chun LIU, Yu-Shih WANG, Chien-Yun HSU
  • Publication number: 20180191116
    Abstract: An electronic device includes a display and a docking station. The display includes a first connector, and the docking station has a second connector. The first connector includes a first tongue portion and pins at least including a pair of transmitting differential signal pins and ground pins. An orthogonal projection of at least one ground pin on an upper surface of the first tongue portion is located between the transmitting differential signal pins. The transmitting differential signal pins are used to transmit data adopting USB3.1, thunderbolt 2, or thunderbolt 3 transmission specification. The second connector includes a second tongue portion and through holes at least including a pair of transmitting differential signal through holes and ground through holes. The transmitting differential signal pins and the ground pins are connected to the transmitting differential signal through holes and the ground through holes respectively.
    Type: Application
    Filed: July 24, 2017
    Publication date: July 5, 2018
    Applicant: Acer Incorporated
    Inventors: Yu-Shih Wang, Chih-Chun Liu, Po-Yi Lee