Abstract: A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.

Abstract: A transistor heat dissipation module is adapted for at least one transistor. The transistor heat dissipation module includes a heat dissipation member and an elastic member. The heat dissipation member includes a first wall and a second wall opposite to each other and a first connecting member connected to the first wall and the second wall. An accommodating space is formed between the first wall and the second wall. The transistor is disposed in the accommodating space. The elastic member is disposed in the accommodating space and is located between the at least one transistor and the first wall to press the at least one transistor against the second wall. An assembly method of a transistor heat dissipation module is further provided.

Abstract: A transistor heat dissipation module is adapted for at least one transistor. The transistor heat dissipation module includes a heat dissipation member and an elastic member. The heat dissipation member includes a first wall and a second wall opposite to each other and a first connecting member connected to the first wall and the second wall. An accommodating space is formed between the first wall and the second wall. The transistor is disposed in the accommodating space. The elastic member is disposed in the accommodating space and is located between the at least one transistor and the first wall to press the at least one transistor against the second wall. An assembly method of a transistor heat dissipation module is further provided.

Abstract: An electrode reaction area testing method of biosensor test strip includes: (1) preparing a semi-finished or finished test strip product having at least one sensing window corresponding to an electrode reaction area; a plural electrodes exposed from the electrode reaction area; (2) detecting the electrode reaction current of the electrode reaction area to obtain a first electrode reaction current and a third electrode reaction current; (3) calculating a current ratio of the first electrode reaction current to the third electrode reaction current; (4) determining the current ratio; (5) completing the detection of the electrode reaction area to determine whether the semi-finished or finished test strip product is good or defective, so as to test the accuracy of the separating plate attaching position or the insulating position and the applicability of the electrode reaction area in the manufacture of the test strip.

Abstract: A power device capable of improving a flicker of a liquid crystal display includes a direct current (DC) voltage/direct current (DC) voltage converter, a common voltage circuit, and a clamper. The DC voltage/DC voltage converter is used for generating a DC low gate voltage. The common voltage circuit receives a polarity reversion signal generated by a timing control circuit, and generates an alternating current (AC) common voltage according to the polarity reversion signal. The clamper is coupled to the DC voltage/DC voltage converter and the common voltage circuit for receiving the DC low gate voltage and the AC common voltage, outputting the AC common voltage and outputting an AC low gate voltage according to the DC low gate voltage and the AC common voltage. A display panel improves the flicker according to the AC low gate voltage.

Abstract: A power device capable of improving a flicker of a liquid crystal display includes a direct current (DC) voltage/direct current (DC) voltage converter, a common voltage circuit, and a clamper. The DC voltage/DC voltage converter is used for generating a DC low gate voltage. The common voltage circuit receives a polarity reversion signal generated by a timing control circuit, and generates an alternating current (AC) common voltage according to the polarity reversion signal. The clamper is coupled to the DC voltage/DC voltage converter and the common voltage circuit for receiving the DC low gate voltage and the AC common voltage, outputting the AC common voltage and outputting an AC low gate voltage according to the DC low gate voltage and the AC common voltage. A display panel improves the flicker according to the AC low gate voltage.