Abstract: A semiconductor structure includes a first FinFET device disposed over a substrate, a second FinFET device disposed over the substrate, and an isolation structure. The first FinFET device includes at least a first fin and a first metal gate structure over the first fin. The second FinFET device includes at least a second fin and a second metal gate structure over the second fin. The isolation structure is disposed between the first metal gate structure and the second metal gate structure. The isolation structure includes a dielectric feature and a dielectric layer. The dielectric layer is between the dielectric feature and the first metal gate structure, between the dielectric feature and the second metal gate structure, and between the dielectric feature and the substrate. The dielectric feature and the dielectric layer include different materials and different thicknesses.

Abstract: A keyswitch structure includes a base plate, a keycap, and a keycap support mechanism. The keycap support mechanism is connected to and between the base plate and the keycap. The keycap is movable relative to the base plate through the keycap support mechanism. The keycap support mechanism includes an inner support and an outer support. The outer support and the inner support are pivotally connected with each other around a rotation axis. The outer support includes two outer frame portions and a central frame. The central frame is located between the two outer frame portions in a direction parallel to the rotation axis. Therein, in the case where the inner support is stacked on the outer support, the inner support is located inside the outer support and straddles the central frame.

Abstract: A semiconductor structure includes a first FinFET device disposed over a substrate, a second FinFET device disposed over the substrate, and an isolation structure. The first FinFET device includes at least a first fin and a first metal gate structure over the first fin. The second FinFET device includes at least a second fin and a second metal gate structure over the second fin. The isolation structure is disposed between the first metal gate structure and the second metal gate structure. The isolation structure includes a dielectric feature and a dielectric layer. The dielectric layer is between the dielectric feature and the first metal gate structure, between the dielectric feature and the second metal gate structure, and between the dielectric feature and the substrate. The dielectric feature and the dielectric layer include different materials and different thicknesses.

Abstract: A solder pad structure includes a first metal layer disposed on an insulation layer, wherein the first metal layer is electrically connected with an underlying interconnection circuit layer through a conductive through hole disposed in the insulation layer. A solder resist layer having an opening exposing a central portion of the first metal layer is disposed on the insulating layer. A pillar-shaped second metal layer is disposed within the opening directly on the first metal layer. A solder ball filled into the opening is in contact with the pillar-shaped second metal layer.

Abstract: A solder pad structure includes a first metal layer disposed on an insulation layer, wherein the first metal layer is electrically connected with an underlying interconnection circuit layer through a conductive through hole disposed in the insulation layer. A solder resist layer having an opening exposing a central portion of the first metal layer is disposed on the insulating layer. A pillar-shaped second metal layer is disposed within the opening directly on the first metal layer. A solder ball filled into the opening is in contact with the pillar-shaped second metal layer.

Abstract: A card connector for electrically coupling a PC card to an electrical device is provided. The card connector comprises a header section having a plurality of terminal pins disposed within the header section. A first and second elongated arm section are integrally coupled with the header section. Each one of the arms extend from a first end to a second end thereby forming a slot which is adapted to receive the PC card and guide the PC card into electrical contact with the terminal pins. A guide housing is securely disposed over said first arm. A push-rod is slidably mounted within the guide housing and adapted to move from a first position to a second position. A post is disposed within the guide housing. A swing arm is pivotally mounted on the push-rod and is adapted to engage and disengage with the post as the push-rod moves from the first position to the second position. A first spring is in communication with said swing arm.

Abstract: An improved cassette loading/unloading device for use with magnetic tape machines is disclosed. It contains a connection member, which includes a first stopper portion extending from a drive plate toward a sliding plate; a second stopper portion mounted on a rear side of the first stopper portion; a connection sheet extending from the sliding plate into a space between the first and second stopper portions; a connection pin penetrating through the first, and second stopper portions and the connection sheet along the path of insertion of the cassette into the magnetic tape unit for relative sliding with the connection sheet; and a buffer spring provided on the connection pin between the second stopper portion and the connection sheet for buffering an impact force when the drive plate pushes the sliding plate.

Abstract: A magnetic tape loading mechanism for a magnetic recording and/or reproducing apparatus is disclosed. The loading mechanism includes a reversible driving motor which can be actuated by signals sent from a positional detector to drive a gear train in order to perform a switching operation of work modes. The gear train includes five actuating gears which are operatively connected to the corresponding members, such as a pair of mounting blocks each having an inclination post and a guide roller provided thereon, a moving post, a tension post and a pinch roller, so that these members can be moved to a predetermined position according to the various time sequences and work modes, to enable the magnetic tape to be led out of a tape cassette located in the apparatus and to be wound around a magnetic head having a magnetic drum, thereby allowing to record or reproduce signals from the magnetic tape.