Abstract: Provided is an etching-before-packaging horizontal chip three-dimensional system level metal circuit board structure comprising a metal substrate frame; the metal substrate frame is provided with base islands and pins therein; the front faces of the base islands are provided with chips; the front faces of the chips are connected to the front faces of the pins via metal wires; conductive posts are disposed on the front faces or back faces of the pins; the peripheral areas of the base islands, the areas between the base islands and the pins, the areas between the pins, the areas above the base islands and the pins, the areas below the base islands and the pins, and the exteriors of the chips, the metal wires and the conductive posts are all encapsulated with molding compound.

Abstract: A first-etched and later-packaged three-dimensional system-in-package normal chip stack package structure and a processing method for manufacturing the same are provided. The structure includes: a die pad (1); a lead (2); a chip (4) provided on a top surface of the die pad (1) by a conductive or non-conductive adhesive material (3); a metal wire (5) via which a top surface of the chip (4) is connected to a top surface of the lead (2); a conductive pillar (6) provided on the surface of the lead (2); and a molding material (7).

Abstract: A first-etched and later-packaged three-dimensional system-in-package normal chip stack package structure and a processing method for manufacturing the same are provided. The structure includes: a die pad (1); a lead (2); a chip (4) provided on a top surface of the die pad (1) by a conductive or non-conductive adhesive material (3); a metal wire (5) via which a top surface of the chip (4) is connected to a top surface of the lead (2); a conductive pillar (6) provided on the surface of the lead (2); and a molding material (7).

Abstract: Provided is an etching-before-packaging horizontal chip three-dimensional system level metal circuit board structure comprising a metal substrate frame; the metal substrate frame is provided with base islands and pins therein; the front faces of the base islands are provided with chips; the front faces of the chips are connected to the front faces of the pins via metal wires; conductive posts are disposed on the front faces or back faces of the pins; the peripheral areas of the base islands, the areas between the base islands and the pins, the areas between the pins, the areas above the base islands and the pins, the areas below the base islands and the pins, and the exteriors of the chips, the metal wires and the conductive posts are all encapsulated with molding compound.

Abstract: A first-packaged and later-etched three-dimensional flip-chip system-in-package structure and a processing method thereof are provided. The package structure includes: a pad (1), a pin (2); a conductive pillar (3) disposed on an upper surface of the pin (2); a first die (4) flipped on an upper surface of the pad (1); a first molding material or epoxy resin (9) for encapsulating with a peripheral region of the conductive pillar (3) and the first die (4); an anti-oxidation layer (11) provided on a surface of the conductive pillar (3) exposed from the first molding material or epoxy resin (9); a second die (8) flipped on a lower surface of the pad (1) and the pin (2); and a second molding material or epoxy resin (10) for encapsulating with the region of the lower surfaces of the pad (1) and the pin (2) and a peripheral region of the second die (8).

Abstract: The present invention relates to a first-packaged and later-etched normal chip three dimension-on-chip metal circuit board structure and a processing method for manufacturing the same, the structure includes: metal substrate frame (1); a lead (3) provided in the metal substrate frame (1); a conductive pillar (4) provided in a top surface of the lead (3); a chip is mounted normally on a top surface of the metal circuit frame (1) or between the leads (3); a metal wire (6) via which a top surface of the chip (5) is connected to a top surface of the lead (3); a molding material (8) with which a periphery region of the lead (3), the conductive pillar (4), the chip (5) and the metal wire (6) is encapsulated, with the molding material (8) being flushed with a top of the conductive pillar (4).

Abstract: A flash device structure comprises a front window mechanism and a fixing seat. The front window mechanism has a base, a luminous module and a placement element, wherein the luminous module is set up on the placement element to be located inside the base and maintain the luminous module electrically connected. The fixing seat includes a trigger, wherein the trigger electrically connects with the luminous module when the fixing seat is connected into the front window mechanism.

Abstract: A flash device structure comprises a front window mechanism and a fixing seat. The front window mechanism has a base, a luminous module and a placement element, wherein the luminous module is set up on the placement element to be located inside the base and maintain the luminous module electrically connected. The fixing seat includes a trigger, wherein the trigger electrically connects with the luminous module when the fixing seat is connected into the front window mechanism.