Patents by Inventor Chih-Fan Wang

Chih-Fan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of planarization of semiconductor devices
    Patent number: 6908361
    Abstract: A method of planarizing a semiconductor device includes the steps of providing a semiconductor substrate, forming a semiconductor component over the semiconductor substrate, depositing a doped silicate glass layer over the semiconductor component using a high density plasma chemical vapor deposition, the doped silicate glass layer forming a protrusion directly over the semiconductor component, and planarizing the doped silicate glass layer by a chemical mechanical polishing process to remove the protrusion.
    Type: Grant
    Filed: September 10, 2002
    Date of Patent: June 21, 2005
    Assignee: Winbond Electronics Corporation
    Inventors: Shao-Yu Ting, Jack Liang, Chih-Fan Wang
  • Method of planarization of semiconductor devices
    Publication number: 20040048480
    Abstract: A method of planarizing a semiconductor device includes the steps of providing a semiconductor substrate, forming a semiconductor component over the semiconductor substrate, depositing a doped silicate glass layer over the semiconductor component using a high density plasma chemical vapor deposition, the doped silicate glass layer forming a protrusion directly over the semiconductor component, and planarizing the doped silicate glass layer by a chemical mechanical polishing process to remove the protrusion.
    Type: Application
    Filed: September 10, 2002
    Publication date: March 11, 2004
    Inventors: Shao-Yu Ting, Jack Liang, Chih-Fan Wang