Abstract: An electric device includes a semiconductor assembly, a circuit board, first conductive pads and second conductive pads. The circuit board has a chip-mounted area with a rectangular shape. The first conductive pads are arranged in a center zone or all corner zones of the chip-mounted area, and the second conductive pads are arranged within the rest in the chip-mounted area. The first conductive pads are respectively soldered to one part of solder joints of the semiconductor assembly through first solder-ball portions, and the second conductive pads are respectively soldered to another part of the solder joints of the semiconductor assembly through second solder-ball portions. Each of the second conductive pads is sized smaller than one of the first conductive pads, and a maximum width of each of the second solder-ball portions is greater than a maximum width of each of the first solder-ball portions.

Abstract: An inspecting device including a carrier, multiple telescopic probes, a locking component and a conductive structure is provided. The carrier has a through hole and a ground pad corresponding to the through hole. The through hole penetrates from the first surface to the second surface of the carrier, and the ground pad is disposed on the second surface. The telescopic probes are disposed in parallel on the first surface of the carrier. The locking component passes through the through hole and is disposed between two adjacent telescopic probes of the multiple telescopic probes. The locking component includes a screw. A head of the screw has a first pitch and a second pitch, and a density of the first pitch is different from a density of the second pitch. The conductive structure is partially embedded in the locking component, and the conductive structure, the locking component and the ground pad are electrically connected.

Abstract: A thermal peak suppression device includes a heat dissipation fin set, a heat dissipator, a thermal phase change material, a filling gas, a fin-array frame and a capillary tube. The heat dissipator includes a thermal conductive block thermally coupled to the heat dissipation fin set, and a closed cavity formed inside the thermal conductive block to have a hot zone and a cold zone. The thermal phase change material is disposed within the hot zone. The filling gas is disposed within the cold zone. The fin-array frame is connected to the thermal conductive block within the cold zone. Two opposite ends of the capillary tube are respectively located within the cold zone and the hot zone. When the thermal phase change material is transformed into a liquid state, the thermal phase change material is sent to the hot zone through the capillary tube.

Abstract: A probe card device includes a wiring board provided with a plurality of contacts, a probe head having a probe holder and a plurality of conductive probes arranged on the probe holder, respectively, and a circuit protection assembly including an insulation plate, a plurality of through holes and a plurality of self-resetting fusing elements. The insulation plate is sandwiched between the wiring board and the probe head. The through holes are respectively formed on the insulation plate and arranged in an array form. The self-resetting fusing elements are respectively disposed within the through holes. Each of the self-resetting fusing elements is electrically connected to one of the contacts and one of the conductive probes for reversibly breaking down electric currents from the wiring board to the conductive probe.

Abstract: A conductive probe includes a columnar body. The columnar body is defined with a longitudinal direction. The columnar body is provided with a first contacting surface and a second contacting surface in the longitudinal direction. The first contacting surface is opposite to the second contacting surface, and the first contacting surface is cross shaped or X-shaped for contacting to a conductive pillar of a device under test (DUT).

Abstract: A pogo pin-free testing device for IC chip test includes a load board, a ceramic interposer disposed on the load board, and copper core balls. The ceramic interposer has first and second surfaces and connecting points, and the second surface of the ceramic interposer faces the load board. Each connecting point has through holes penetrating the first and second surfaces, and an inner sidewall surface thereof has a metallization layer. The metallization layer is extended to a portion of the first surface and a portion of the second surface. In each of the connecting points, an area of an extending portion of the metallization layer extended to the second surface is less than an area of an extending portion of the metallization layer extended to the first surface. The copper core balls are disposed between the load board and the through holes of each connecting point of the ceramic interposer.

Abstract: A testing apparatus including a base and a preheating unit arranged on the base is provided. The preheating unit includes a gas generator, a blocking mechanism and a heating device. The gas generator is configured to discharge air toward the base to form an air wall. The blocking mechanism is located above the air wall and forms a heat preservation space with the air wall. The heating device is arranged in the heat preservation space.

Abstract: A testing system includes a testing apparatus and a crack noise monitoring device. The testing apparatus includes a testing stage and an element pickup module for pressing a semiconductor element on the testing stage. The crack noise monitoring device includes a database unit, a sound conduction set, a voiceprint generation unit and a processing unit. The database unit has a first voiceprint pattern. The sound conduction set is connected to the voiceprint generation unit and the testing apparatus for transmitting a sound wave from the semiconductor element to the voiceprint generation unit. The voiceprint generation unit receives and converts the sound wave into a second voiceprint pattern. The processing unit is electrically connected to the voiceprint generating unit and the database unit for determining whether the first voiceprint pattern is identical to the second voiceprint pattern.

Abstract: A pogo pin-free testing device for IC chip test includes a load board, a ceramic interposer disposed on the load board, and copper core balls. The ceramic interposer has first and second surfaces and connecting points, and the second surface of the ceramic interposer faces the load board. Each connecting point has through holes penetrating the first and second surfaces, and an inner sidewall surface thereof has a metallization layer. The metallization layer is extended to a portion of the first surface and a portion of the second surface. In each of the connecting points, an area of an extending portion of the metallization layer extended to the second surface is less than an area of an extending portion of the metallization layer extended to the first surface. The copper core balls are disposed between the load board and the through holes of each connecting point of the ceramic interposer.

Abstract: A testing socket includes a metal block, an assembly block, an analog ground probe pin and a digital ground probe pin. The metal block is formed with a concave portion and used to connect to an independent main ground. The assembly block is electrically isolated from the metal block, and detachably embedded in the recess, so that the metal block and the assembly block are assembled together to be a probe holder. The digital grounding probe is inserted in the metal block, electrically connected to the independent main ground through the metal block. The digital ground probe pin can be electrically connected to a device to be tested (DUT) and the independent main ground. The analog ground probe pin is inserted in the assembly block, and electrically connected to the DUT and another independent main ground.

Abstract: A testing system includes a testing apparatus and a crack noise monitoring device. The testing apparatus includes a testing stage and an element pickup module for pressing a semiconductor element on the testing stage. The crack noise monitoring device includes a database unit, a sound conduction set, a voiceprint generation unit and a processing unit. The database unit has a first voiceprint pattern. The sound conduction set is connected to the voiceprint generation unit and the testing apparatus for transmitting a sound wave from the semiconductor element to the voiceprint generation unit. The voiceprint generation unit receives and converts the sound wave into a second voiceprint pattern. The processing unit is electrically connected to the voiceprint generating unit and the database unit for determining whether the first voiceprint pattern is identical to the second voiceprint pattern.

Abstract: A testing apparatus includes a testing stage and an element pickup module. The test loader includes a testing area and a plurality of terminals arranged within the testing area. The element pickup module includes a mobile arm movable towards the testing stage, an air passage set disposed within the mobile arm and respectively connected to the vacuum pump equipment and the mobile arm, and a pressure-buffering portion. The pressure-buffering portion includes an elastic pad and a plurality of penetrating openings. The elastic pad is disposed on the bottom portion of the mobile arm, and provided with a flat surface for contacting a semiconductor element. The penetrating openings are distributed on the flat surface to connect to the air passage set so that the semiconductor element is fixedly sucked on the flat surface by the vacuum pump equipment through the penetrating openings.

Abstract: A thermal peak suppression device includes a heat dissipation fin set, a heat dissipator, a thermal phase change material, a filling gas, a fin-array frame and a capillary tube. The heat dissipator includes a thermal conductive block thermally coupled to the heat dissipation fin set, and a closed cavity formed inside the thermal conductive block to have a hot zone and a cold zone. The thermal phase change material is disposed within the hot zone. The filling gas is disposed within the cold zone. The fin-array frame is connected to the thermal conductive block within the cold zone. Two opposite ends of the capillary tube are respectively located within the cold zone and the hot zone. When the thermal phase change material is transformed into a liquid state, the thermal phase change material is sent to the hot zone through the capillary tube.

Abstract: A testing equipment includes a testing platform and a component carrying device including a carrying arm, a vacuum suction unit, a working bottom cover and a fluid transmission assembly. The carrying arm lifts and carries a device under test (DUT) onto the testing platform. The vacuum suction unit removably sucks to the DUT. The working bottom cover includes a cover body and an elastic airtight ring. The cover body is connected to the carrying arm, and the elastic airtight ring is fixedly disposed on the cover body for hermetically covering the DUT, so that a liquid filling space is collectively formed by the cover body and the DUT. The fluid transmission assembly extends into the liquid filling space for continuously passing a working liquid to the DUT and withdrawing the working liquid back away from the liquid filling space for thermally exchanging with the DUT.

Abstract: A testing equipment includes a testing platform and a component carrying device including a carrying arm, a vacuum suction unit, a working bottom cover and a fluid transmission assembly. The carrying arm lifts and carries a device under test (DUT) onto the testing platform. The vacuum suction unit removably sucks to the DUT. The working bottom cover includes a cover body and an elastic airtight ring. The cover body is connected to the carrying arm, and the elastic airtight ring is fixedly disposed on the cover body for hermetically covering the DUT, so that a liquid filling space is collectively formed by the cover body and the DUT. The fluid transmission assembly extends into the liquid filling space for continuously passing a working liquid to the DUT and withdrawing the working liquid back away from the liquid filling space for thermally exchanging with the DUT.

Abstract: An inspecting device including a carrier, multiple telescopic probes, a locking component and a conductive structure is provided. The carrier has a through hole and a ground pad corresponding to the through hole. The through hole penetrates from the first surface to the second surface of the carrier, and the ground pad is disposed on the second surface. The telescopic probes are disposed in parallel on the first surface of the carrier. The locking component passes through the through hole and is disposed between two adjacent telescopic probes of the multiple telescopic probes. The locking component includes a screw. A head of the screw has a first pitch and a second pitch, and a density of the first pitch is different from a density of the second pitch. The conductive structure is partially embedded in the locking component, and the conductive structure, the locking component and the ground pad are electrically connected.

Abstract: A testing apparatus including a base and a preheating unit arranged on the base is provided. The preheating unit includes a gas generator, a blocking mechanism and a heating device. The gas generator is configured to discharge air toward the base to form an air wall. The blocking mechanism is located above the air wall and forms a heat preservation space with the air wall. The heating device is arranged in the heat preservation space.

Abstract: A connector has a casing and a circuit board structure. The circuit board structure is mounted through the casing and has a board main body, a projecting body, and multiple metal electrodes. The projecting body is mounted on a connecting end surface of the board main body and projects from the connecting end surface in an insertion direction of the connector. When the connector is connected to another device, the projecting body of the circuit board structure may push a part of pins of the device first, so the user may exert less force to insert the projecting body into the device. Then, when the circuit board structure is inserted further, the board main body may abut the remaining pins. Because part of the pins have been pushed away by the projecting body, the board main body only needs to counteract resistance from the remaining pins.

Abstract: A circuit board assembly has a circuit board and a high-speed cable. The high-speed cable has two signal lines, a ground conductor, an impedance-reducing conductor, and a covering material. The signal lines, the ground conductor, and the impedance-reducing conductor are mounted through the entire high-speed cable. The covering material wraps the signal lines, the ground conductor, and the impedance-reducing conductor, and has a conductive layer and an isolation layer as an inner layer and an outer layer respectively. The conductive layer has multiple loops electrically connected to the ground conductor and the impedance-reducing conductor. Thus, the impedance in the covering material, the ground conductor, and the impedance-reducing conductor is decreased, which prevents from attenuating the signal intensity during transmission at high frequency.

Abstract: A probe card module including a probe card assembly and a strengthening structure is provided. The probe card assembly includes a first surface, a second surface opposite to the first surface, and a plurality of probes protruding from the first surface. The second surface includes a central zone and a peripheral zone surrounding the central zone. Projections of the probes on the second surface are located at the central zone. The strengthening structure is disposed on the second surface and includes two support bases which protrude from the peripheral zone and are away from each other, and the strengthening structure also includes an arc-shaped reinforcement assembly connected to the two support bases, where the arc-shaped reinforcement assembly protrudes toward and leans against the central zone.