Abstract: A semiconductor package includes a die attach pad; a plurality of lead terminals disposed around the die attach pad; a semiconductor die mounted on the die attach pad; a molding compound encapsulating the plurality of lead terminals, the semiconductor die, and the die attach pad; and a step cut sawn into the molding compound along a perimeter of a bottom surface of the semiconductor package. The step cut penetrates through an entire thickness of each of the plurality of lead terminals, whereby each of the plurality of lead terminals has at least an exposed outer end at the step cut.

Abstract: A semiconductor package includes a die attach pad; a plurality of lead terminals disposed around the die attach pad; a semiconductor die mounted on the die attach pad; a molding compound encapsulating the plurality of lead terminals, the semiconductor die, and the die attach pad; and a step cut sawn into the molding compound along a perimeter of a bottom surface of the semiconductor package. The step cut penetrates through an entire thickness of each of the plurality of lead terminals, whereby each of the plurality of lead terminals has at least an exposed outer end at the step cut.

Abstract: A semiconductor package disposed on a base is provided. The semiconductor package includes a semiconductor chip and a redistribution layer (RDL) structure. The semiconductor chip includes a first chip pad and a second chip pad. The redistribution layer (RDL) structure partially covers the semiconductor chip and is separated from the base by the semiconductor chip. The RDL structure includes a redistribution layer (RDL) trace having a first terminal and a second terminal. The first terminal of the RDL trace is electrically coupled to the first chip pad. The second terminal of the RDL trace is electrically coupled to the second chip pad.

Abstract: A semiconductor package includes a die attach pad; a plurality of lead terminals disposed around the die attach pad; a semiconductor die mounted on the die attach pad; a molding compound encapsulating the plurality of lead terminals, the semiconductor die, and the die attach pad; and a step cut sawn into the molding compound along a perimeter of a bottom surface of the semiconductor package. The step cut penetrates through an entire thickness of each of the plurality of lead terminals, whereby each of the plurality of lead terminals has at least an exposed outer end at the step cut.

Abstract: A plate type heat pipe includes a sealed tube, a chamber defined in the tube, and working medium received in the chamber. A mesh wick structure is attached to an inner wall of the tube. In one version of the plate type heat pipe, the wick structure defines a single opening. The opening communicates the chamber and thereby provides additional space for flow of vaporized working medium inside the tube. In other versions of the plate type heat pipe, the wick structure defines two or more openings.

Abstract: A plate type heat pipe includes a sealed tube, a chamber defined in the tube, and working medium received in the chamber. A mesh wick structure is attached to an inner wall of the tube. In one version of the plate type heat pipe, the wick structure defines a single opening. The opening communicates the chamber and thereby provides additional space for flow of vaporized working medium inside the tube. In other versions of the plate type heat pipe, the wick structure defines two or more openings.

Abstract: A heat exchange module (1) includes a fan duct, an evaporator (22), a condenser (26) and an electric fan (50). The fan duct includes a lower portion (10) and an upper portion (30). The lower portion cooperates with the upper portion to define therebetween an air passage (90). The evaporator contains therein a working fluid. The condenser is in fluid communication with the evaporator. The evaporator and the condenser are received in the air passage defined by the fan duct. The working fluid turns into vapor in the evaporator upon receiving heat from a heat-generating component (70) and the vapor turns into condensate upon releasing the heat to the condenser. The electric fan is attached to the fan duct. The electric fan produces an airflow flowing through the air passage for removing the heat away from the condenser.

Abstract: A rotary-type total heat exchanger (10) includes two blowers (21, 22), a rotary wheel (33), an air-guiding member (41) and an air-regulating member (42). The blowers are used to provide a first airflow and a second airflow into the total heat exchanger. The rotary wheel defines therein a plurality of air passageways (331). Upon rotation, the rotary wheel is capable of exchanging heat and moisture between the airflows when the airflows separately flow though the air passageways of the rotary wheel. The air-guiding member is in fluid communication with one of the blowers for guiding one of the airflows toward the rotary wheel. The air-regulating member is located between the rotary wheel and the air-guiding member for distributing the guided airflow over the air passageways of the rotary wheel.

Abstract: A heat exchange module (1) includes a fan duct, an evaporator (22), a condenser (26) and an electric fan (50). The fan duct includes a lower portion (10) and an upper portion (30). The lower portion cooperates with the upper portion to define therebetween an air passage (90). The evaporator contains therein a working fluid. The condenser is in fluid communication with the evaporator. The evaporator and the condenser are received in the air passage defined by the fan duct. The working fluid turns into vapor in the evaporator upon receiving heat from a heat-generating component (70) and the vapor turns into condensate upon releasing the heat to the condenser. The electric fan is attached to the fan duct. The electric fan produces an airflow flowing through the air passage for removing the heat away from the condenser.

Abstract: A loop-type heat exchange device (10) is disclosed, which includes an evaporator (20), a condenser (40), a vapor conduit (30) and a liquid conduit (50). The evaporator defines therein a chamber for containing a working fluid. The chamber is divided into an evaporating region and a micro-channel region. The working fluid in the evaporator evaporates into vapor after absorbing heat at the evaporating region, and the generated vapor flows, via the vapor conduit, to the condenser where the vapor releases its latent heat of evaporation and is condensed into condensate. The condensate then returns back, via the liquid conduit, to the evaporator to thereby form a heat transfer loop. The evaporator is configured in such a manner that an amount of vapor to be formed and accumulated in the micro-channel region can be minimized.

Abstract: A rotary-type total heat exchanger (10) includes two blowers (21, 22), a rotary wheel (33), an air-guiding member (41) and an air-regulating member (42). The blowers are used to provide a first airflow and a second airflow into the total heat exchanger. The rotary wheel defines therein a plurality of air passageways (331). Upon rotation, the rotary wheel is capable of exchanging heat and moisture between the airflows when the airflows separately flow though the air passageways of the rotary wheel. The air-guiding member is in fluid communication with one of the blowers for guiding one of the airflows toward the rotary wheel. The air-regulating member is located between the rotary wheel and the air-guiding member for distributing the guided airflow over the air passageways of the rotary wheel.