Patents by Inventor Chih-Feng LI

Chih-Feng LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240071953
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240071954
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Patent number: 9292030
    Abstract: A circuit includes a band-gap reference circuit and a start-up circuit. The band-gap reference circuit includes an operational amplifier, a first current path between a power supply node and a reference node, a second current path between the power supply node and the reference node, and a feedback path between an output of the operational amplifier and the first and second current paths. A first input of the operational amplifier is coupled to the first current path, and a second input of the operational amplifier is coupled to the second current path. The start-up circuit includes a current source and at least one switch coupled between the current source and the band-gap reference circuit. The at least one switch is configured to electrically couple the current source with the first and second current paths during a start-up phase.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: March 22, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Fu Lee, Chih-Feng Li
  • Patent number: 9229467
    Abstract: A device includes a bandgap reference circuit and a start-up circuit. The bandgap reference circuit includes an amplifier and a first transistor. The amplifier has an inverting input terminal, a non-inverting input terminal, and an output terminal. The first transistor has a gate electrode electrically connected to the output terminal. The start-up circuit has a first path electrically connected to the output terminal and the non-inverting input terminal, and a second path electrically connected to the output terminal and the inverting input terminal.
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: January 5, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Chih-Feng Li
  • Patent number: 8975882
    Abstract: A regulating circuit includes a first comparator configured to control a turning on and a turning off of a first transistor based on a first comparison a reference voltage to a feedback voltage. The first transistor is coupled between an output node and a first voltage supply. A second comparator is configured to control a turning on and a turning off of a second transistor based on a second comparison of the reference voltage to the feedback voltage. The second transistor is coupled to the output node. A high-impedance circuit is coupled in series with the second transistor such that the high-impedance block is disposed between the second transistor and a second power supply. The high-impedance circuit is configured to generate a constant current between the output node and the second voltage supply when the second transistor is turned on.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: March 10, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Chih-Feng Li
  • Publication number: 20150054486
    Abstract: A device includes a bandgap reference circuit and a start-up circuit. The bandgap reference circuit includes an amplifier and a first transistor. The amplifier has an inverting input terminal, a non-inverting input terminal, and an output terminal. The first transistor has a gate electrode electrically connected to the output terminal. The start-up circuit has a first path electrically connected to the output terminal and the non-inverting input terminal, and a second path electrically connected to the output terminal and the inverting input terminal.
    Type: Application
    Filed: August 22, 2013
    Publication date: February 26, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Chih-Feng Li
  • Publication number: 20140340070
    Abstract: A circuit includes a band-gap reference circuit and a start-up circuit. The band-gap reference circuit includes an operational amplifier, a first current path between a power supply node and a reference node, a second current path between the power supply node and the reference node, and a feedback path between an output of the operational amplifier and the first and second current paths. A first input of the operational amplifier is coupled to the first current path, and a second input of the operational amplifier is coupled to the second current path. The start-up circuit includes a current source and at least one switch coupled between the current source and the band-gap reference circuit. The at least one switch is configured to electrically couple the current source with the first and second current paths during a start-up phase.
    Type: Application
    Filed: July 30, 2014
    Publication date: November 20, 2014
    Inventors: Chia-Fu LEE, Chih-Feng LI
  • Patent number: 8816670
    Abstract: An electronic circuit includes a band-gap reference circuit and a start-up circuit. The band-gap reference circuit includes an operational amplifier which has an output and first and second inputs. The band-gap reference circuit is configured to generate a predetermined reference voltage at the output of the operational amplifier after a start-up phase of the band-gap reference circuit. The start-up circuit includes at least one switch arranged to connect at least one current source to at least one of the inputs of the operational amplifier during the start-up phase, and to disconnect the at least one current source from the at least one of the inputs of the operational amplifier after the start-up phase.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: August 26, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Fu Lee, Chih-Feng Li
  • Publication number: 20140117952
    Abstract: A regulating circuit includes a first comparator configured to control a turning on and a turning off of a first transistor based on a first comparison a reference voltage to a feedback voltage. The first transistor is coupled between an output node and a first voltage supply. A second comparator is configured to control a turning on and a turning off of a second transistor based on a second comparison of the reference voltage to the feedback voltage. The second transistor is coupled to the output node. A high-impedance circuit is coupled in series with the second transistor such that the high-impedance block is disposed between the second transistor and a second power supply. The high-impedance circuit is configured to generate a constant current between the output node and the second voltage supply when the second transistor is turned on.
    Type: Application
    Filed: October 31, 2012
    Publication date: May 1, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventor: Chih-Feng LI
  • Publication number: 20130082770
    Abstract: An electronic circuit includes a band-gap reference circuit and a start-up circuit. The band-gap reference circuit includes an operational amplifier which has an output and first and second inputs. The band-gap reference circuit is configured to generate a predetermined reference voltage at the output of the operational amplifier after a start-up phase of the band-gap reference circuit. The start-up circuit includes at least one switch arranged to connect at least one current source to at least one of the inputs of the operational amplifier during the start-up phase, and to disconnect the at least one current source from the at least one of the inputs of the operational amplifier after the start-up phase.
    Type: Application
    Filed: September 30, 2011
    Publication date: April 4, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Fu LEE, Chih-Feng LI