Patents by Inventor Chih Han Ma

Chih Han Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD
    Publication number: 20230083007
    Abstract: An electronic device and a method for manufacturing a flexible circuit board are provided. The electronic device includes the flexible circuit board. The flexible circuit board includes a first flexible substrate, a first seed layer, a first conductive layer, and a second seed layer. The first seed layer is disposed on the first flexible substrate. The first conductive layer is disposed on the first seed layer. The second seed layer is disposed on the first conductive layer. The first seed layer is in contact with the first conductive layer.
    Type: Application
    Filed: November 17, 2022
    Publication date: March 16, 2023
    Applicant: Innolux Corporation
    Inventors: Jia Sin Li, Tong-Jung Wang, Chia-Chieh Fan, Shan Shan Hsu, Chih Han Ma
  • ELECTRONIC DEVICE
    Publication number: 20230025999
    Abstract: An electronic device including an electronic unit and a functional unit is provided. The electronic unit includes a substrate, a plurality of semiconductor components, and a cover layer. The substrate has a plurality of first side surfaces. The semiconductor components are disposed on the substrate. The cover layer is disposed on the semiconductor components and has a plurality of second side surfaces. The functional unit is disposed on at least one of at least one of the first side surfaces and at least one of the second side surfaces.
    Type: Application
    Filed: June 27, 2022
    Publication date: January 26, 2023
    Applicant: Innolux Corporation
    Inventors: Hao-Jung Huang, Chi-Liang Chang, I-Ho Shen, Ker-Yih Kao, Yun-Sheng Chen, Chiao-Chu Tsui, Chih-Han Ma, Shan-Shan Hsu, Chia-Chieh Fan
  • ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD
    Publication number: 20210259103
    Abstract: An electronic device and a method for manufacturing a flexible circuit board are provided. The electronic device includes the flexible circuit board. The flexible circuit board includes a first flexible substrate, a first seed layer, a first conductive layer, and a second seed layer. The first seed layer is disposed on the first flexible substrate. The first conductive layer is disposed on the first seed layer. The second seed layer is disposed on the first conductive layer. The first seed layer is in contact with the first conductive layer.
    Type: Application
    Filed: January 22, 2021
    Publication date: August 19, 2021
    Applicant: Innolux Corporation
    Inventors: Jia Sin Li, Tong-Jung Wang, Chia-Chieh Fan, Shan Shan Hsu, Chih Han Ma