Abstract: A 3D image labeling device and a 3D image labeling method are provided. The 3D image labeling device includes a point cloud cluster module, a projection module, an integration module and a point cloud recovery module. The point cloud cluster module clusters multiple points of a 3D unlabeled image as one or more first point clusters according to a 3D unlabeled image and a cluster algorithm to generate a 3D clustered image. The projection module generates a first 2D image with first objects according to the 3D clustered image, wherein each first point cluster corresponds to one of the first objects. The integration module labels the first objects of the first 2D image according to one or more object frames of a 2D labeled image to generate a second 2D image. The point cloud recovery module generates a 3D labeled image according to the second 2D image.

Abstract: A 3D image labeling device and a 3D image labeling method are provided. The 3D image labeling device includes a point cloud cluster module, a projection module, an integration module and a point cloud recovery module. The point cloud cluster module clusters multiple points of a 3D unlabeled image as one or more first point clusters according to a 3D unlabeled image and a cluster algorithm to generate a 3D clustered image. The projection module generates a first 2D image with first objects according to the 3D clustered image, wherein each first point cluster corresponds to one of the first objects. The integration module labels the first objects of the first 2D image according to one or more object frames of a 2D labeled image to generate a second 2D image. The point cloud recovery module generates a 3D labeled image according to the second 2D image.

Abstract: An integrated circuit includes a scribe line, a bonding pad structure and an extension pad structure. The scribe line is disposed on a substrate, and the bonding pad structure and the extension pad structure are both disposed in a dielectric layer on the substrate. The bonding pad structure includes first vias disposed on first metal layers in the dielectric layer. The extension pad structure includes second metal layers and a number of the second metal layer is less than that of the first metal layers. Also, the bonding pad structure has a first region and a second region, and second vias is disposed on the second metal layers in the first region and no vias is disposed on the second metal layers in the second region.

Abstract: An integrated circuit includes a scribe line, a bonding pad structure and an extension pad structure. The scribe line is disposed on a substrate, and the bonding pad structure and the extension pad structure are both disposed in a dielectric layer on the substrate. The bonding pad structure includes first vias disposed on first metal layers in the dielectric layer. The extension pad structure includes second metal layers and a number of the second metal layer is less than that of the first metal layers. Also, the bonding pad structure has a first region and a second region, and second vias is disposed on the second metal layers in the first region and no vias is disposed on the second metal layers in the second region.

Abstract: A split contact structure includes a semiconductor substrate having a major surface; a first upwardly protruding structure disposed on the major surface; a first cell contact region in the major surface and being close to the first upwardly protruding structure; a second upwardly protruding structure disposed on the major surface; a second cell contact region in the major surface and being close to the second upwardly protruding structure; a first patterned layer stacked on the first upwardly protruding structure; a second patterned layer stacked on the first upwardly protruding structure; a first contact structure disposed on a sidewall of the first upwardly protruding structure and being in direct contact with the first cell contact region; and a second contact structure disposed on a sidewall of the second upwardly protruding structure and being in direct contact with the second cell contact region.

Abstract: A memory control system has an SDRAM device, a memory controller, a loading monitoring unit and a memory physical module. The SDRAM device has a plurality of SDRAM cells for storing data. The loading monitoring unit detects workload of a memory interface of the SDRAM device. The memory controller switches an operation condition of the memory system from a first condition to a second condition when the detected workload satisfies at least one predetermined criterion. The memory physical module is coupled between the SDRAM device and the memory controller and has an interface timing calibration circuit configured to adjust timing of signals of the memory interface such that the signals are adjusted in best timing location and data are captured with a great timing margin.

Abstract: Since high-frequency ultrasound provides the advantage of high spatial resolution, it has been applied to relevant fields of medical imaging research. Due to a lack of high-frequency ultrasonic transducer with array structure, the high-frequency ultrasonic transducer must be performed in a fixed depth of focus during scanning. A swept scanning method is typical for flow estimation. However, this method cannot provide the precise flow estimation within the irregular-shaped object, because the focal zone of the above-mentioned transducer just covers a specific depth of focus and the outside the focal area corresponds poor signal to noise ratio. To resolve this problem, the present invention provides a skin scanning method, which can move the transducer along a scanning route parallel to the contour of the irregular-shaped object during scanning. The scanning results show that the skin scanning method improves the accuracy of flow estimation.

Abstract: A DRAM structure has a substrate, a buried transistor with a fin structure, a trench capacitor, and a surface strap on the surface of the substrate. The surface strap is used to electrically connect a drain region to the trench capacitor.

Abstract: The invention discloses a method of forming a finFET device. A hard mask layer is formed on an active area of a semiconductor substrate. A portion of the hard mask layer is etched to form a recess. A conformal gate defining layer is deposited on the recess and a tilt angle ion implantation process is performed. A part of the gate defining layer is removed to define a fin pattern. The fin pattern is subsequently transferred to the hard mask layer. The patterned hard mask layer having the fin pattern is utilized as an etching mask, and the semiconductor substrate is etched to form a fin structure.

Abstract: The present invention discloses a structure of a buried word line, which comprises a semiconductor substrate having a U-shape trench, a U-shape gate dielectric layer in the U-shape trench, a polysilicon layer on the U-shape gate dielectric layer, a conducting layer on the polysilicon layer, and a cover dielectric layer on the conducting layer. The semiconductor structure may have a minimized size and when recess channels are formed thereby, the integration is accordingly improved without suffering from the short channel effect.

Abstract: A method for forming a surface strap includes forming a deep trench capacitor having a conductive connection layer on its surface in the substrate and the conductive connection layer in contact with the conductive layer; forming a poly-Si layer covering the pad layer and the conductive connection layer; performing a selective ion implantation with an angle to make part of the poly-Si layer an undoped poly-Si layer; removing the undoped poly-Si layer to expose part of the conductive connection layer; etching the exposed conductive connection layer to form a recess; removing the poly-Si layer to make the exposed conductive connection layer a conductive connection strap; filling the recess with an insulation material to form a shallow trench isolation; exposing the conductive layer; and selectively removing the conductive layer to form a first conductive strap which forms the surface strap together with the conductive connection strap.

Abstract: The invention discloses a method of forming a finFET device. A hard mask layer is formed on an active area of a semiconductor substrate. A portion of the hard mask layer is etched to form a recess. A conformal gate defining layer is deposited on the recess and a tilt angle ion implantation process is performed. A part of the gate defining layer is removed to define a fin pattern. The fin pattern is subsequently transferred to the hard mask layer. The patterned hard mask layer having the fin pattern is utilized as an etching mask, and the semiconductor substrate is etched to form a fin structure.

Abstract: A DRAM structure has a substrate, a buried transistor with a fin structure, a trench capacitor, and a surface strap on the surface of the substrate. The surface strap is used to electrically connect a drain region to the trench capacitor.

Abstract: The present invention discloses a structure of a buried word line, which comprises a semiconductor substrate having a U-shape trench, a U-shape gate dielectric layer in the U-shape trench, a polysilicon layer on the U-shape gate dielectric layer, a conducting layer on the polysilicon layer, and a cover dielectric layer on the conducting layer. The semiconductor structure may have a minimized size and when recess channels are formed thereby, the integration is accordingly improved without suffering from the short channel effect.

Abstract: The present invention discloses a semiconductor structure comprising a semiconductor substrate having a U-shape trench, a U-shape gate dielectric layer on the U-shape trench, a U-shape gate region on the U-shape gate dielectric layer, a conducting matter in the U-shape gate region, and a cover dielectric layer on the conducting matter. The semiconductor structure may have a minimized size and when recess channels are formed thereby, the integration is accordingly improved without suffering from the short channel effect.

Abstract: Method for fabricating a self-aligned gate of a transistor including: forming a plurality of deep trench capacitors in a substrate, concurrently forming a surface strap and a contact pad on a surface of the substrate, wherein a spacing between the surface strap and the contact pad exposes a portion of an active area, filling the spacing with a dielectric layer, forming a photoresist pattern on the substrate, wherein the photoresist has an opening situated directly above the spacing between the surface strap and the contact pad, etching away the dielectric layer and a portion of a shallow trench isolation region through the opening thereby forming an upwardly protruding fin-typed channel structure, forming a gate dielectric layer on the upwardly protruding fin-typed channel structure, and forming a gate on the gate dielectric layer.

Abstract: A method for forming a surface strap includes forming a deep trench capacitor having a conductive connection layer on its surface in the substrate and the conductive connection layer in contact with the conductive layer; forming a poly-Si layer covering the pad layer and the conductive connection layer; performing a selective ion implantation with an angle to make part of the poly-Si layer an undoped poly-Si layer; removing the undoped poly-Si layer to expose part of the conductive connection layer; etching the exposed conductive connection layer to form a recess; removing the poly-Si layer to make the exposed conductive connection layer a conductive connection strap; filling the recess with an insulation material to form a shallow trench isolation; exposing the conductive layer; and selectively removing the conductive layer to form a first conductive strap which forms the surface strap together with the conductive connection strap.

Abstract: A DRAM structure includes a substrate, a MOS transistor, a deep trench capacitor, a surface strap positioned on the surface of the substrate and interconnecting a drain of the MOS transistor and an electrode of the deep trench capacitor, wherein the sidewall and the top surface of the surface strap are covered with an insulating layer. A passing gate is positioned on the insulating layer.

Abstract: A method and apparatus for hiding information in a communication protocol signal are disclosed. The apparatus comprises a bit selection unit, an information encoding unit and an information decoding unit, wherein the bit selection unit selects suitable bits in the signal for hiding information, the information encoding unit encodes the information into the suitable bits selected by the bit selection unit, and the information decoding unit decodes the information encoded in the suitable bits.

Abstract: A method and a device for multimedia processing are provided. The device includes a processing unit, a DSP chip, and an output unit. The DSP chip has a first stream data generator, a second stream data generator, and a stream manager. The first streamed data generator produces first stream data for a first program. The second streamed data generator produces second stream data for the second program. The stream manager is provided for receiving the first streamed data and/or the second streamed data. When the first streamed data and the second streamed data are produced at the same time, the stream manager mixes the first streamed data and the second streamed data to generate a mixed data.