Abstract: A semiconductor package includes a substrate, first bumps, a first chip, metal pillars, second bumps and a second chip. The substrate includes first and second conductive pads which are located on a top surface of the substrate. Both ends of the first bumps are connected to the first conductive pads and the first chip, respectively. Both ends of the metal pillars are connected to the second conductive pads and one end of the second bumps, respectively. A cross-sectional area of each of the metal pillars is larger than that of each of the second bumps. The second chip is connected to the other end of the second bumps and located above the first chip.

Abstract: A flip-chip bonding structure includes a substrate and a chip. A lead of the substrate includes a body, a hollow opening, a bonding island and at least one connecting bridge. The hollow opening is in the body and surrounded by the body. The bonding island is located in the hollow opening such that there is a hollow space in the hollow opening and located between the body and the bonding island. The connecting bridge is located in the hollow space to connect the body and the bonding island. A bump of the chip is bonded to the bonding island by a solder. The solder is restricted on the bonding island and separated from the body by the hollow space so as to avoid the solder from overflowing to the body and avoid the chip from shifting.

Abstract: Provided is a method for synthesizing a perovskite quantum dot film, including: preparing a cellulose nanocrystal (CNC) solution, wherein the CNC solution includes a plurality of CNCs with sulfate groups; preparing a precursor solution; mixing the CNC solution and the precursor solution to form a mixed solution; and filtering and drying the mixed solution to form a perovskite quantum dot film.

Abstract: Provided is a method for synthesizing a perovskite quantum dot film, including: preparing a cellulose nanocrystal (CNC) solution, wherein the CNC solution includes a plurality of CNCs with sulfate groups; preparing a precursor solution; mixing the CNC solution and the precursor solution to form a mixed solution; and filtering and drying the mixed solution to form a perovskite quantum dot film.

Abstract: A package structure with conformal shielding includes a substrate providing electrically connected inner grounding structures, a chip module mounted on the substrate, a molding compound covering the chip module and one surface of the substrate, and a conductive shielding layer covering the molding compound and the lateral sides of the substrate, and electrically connected with a part of the inner grounding structures. The substrate further provides one or multiple independent conductive structures electrically connected with the conductive shielding layer and exposed to the outside. By measuring the resistance value between one independent conductive structure and the conductive shielding layer or another independent conductive structure or one ground contact and then comparing the measured resistance value with a predetermined reference value, the EMI shielding performance of the package structure is determined.

Abstract: A package structure with conformal shielding includes a substrate providing electrically connected inner grounding structures, a chip module mounted on the substrate, a molding compound covering the chip module and one surface of the substrate, and a conductive shielding layer covering the molding compound and the lateral sides of the substrate, and electrically connected with a part of the inner grounding structures. The substrate further provides one or multiple independent conductive structures electrically connected with the conductive shielding layer and exposed to the outside. By measuring the resistance value between one independent conductive structure and the conductive shielding layer or another independent conductive structure or one ground contact and then comparing the measured resistance value with a predetermined reference value, the EMI shielding performance of the package structure is determined.

Abstract: A lens device includes: a housing formed with a module-mounting hole that has a hole axis, and provided with a mounting surface that is disposed radially and outwardly of the module-mounting hole; a lens module having a lens axis; and an alignment correction unit for mounting the lens module on the housing at the module-mounting hole. The alignment correction unit includes a module barrel coupled to the lens module, an elastically deformable component clamped by the module barrel toward the mounting surface of the housing, and a set of screw fasteners for fastening the module barrel onto the mounting surface at angularly spaced apart locations relative to the hole axis. Depths of threaded engagement of the screw fasteners with the mounting surface are independently adjustable to permit adjustment of the lens axis of the lens module relative to the hole axis of the module-mounting hole.

Abstract: A lens device includes: a housing formed with a module-mounting hole that has a hole axis, and provided with a mounting surface that is disposed radially and outwardly of the module-mounting hole; a lens module having a lens axis; and an alignment correction unit for mounting the lens module on the housing at the module-mounting hole. The alignment correction unit includes a module barrel coupled to the lens module, an elastically deformable component clamped by the module barrel toward the mounting surface of the housing, and a set of screw fasteners for fastening the module barrel onto the mounting surface at angularly spaced apart locations relative to the hole axis. Depths of threaded engagement of the screw fasteners with the mounting surface are independently adjustable to permit adjustment of the lens axis of the lens module relative to the hole axis of the module-mounting hole.