Abstract: Semiconductor device and the manufacturing method thereof are disclosed herein. An exemplary semiconductor device comprises a semiconductor fin disposed over a substrate; a metal gate structure disposed over a channel region of the semiconductor fin; a first interlayer dielectric (ILD) layer disposed over a source/drain (S/D) region next to the channel region of the semiconductor fin; and a first conductive feature including a first conductive portion disposed on the metal gate structure and a second conductive portion disposed on the first ILD layer, wherein a top surface of the first conductive portion is below a top surface of the second conductive portion, a first sidewall of the first conductive portion connects a lower portion of a first sidewall of the second conductive portion.

Abstract: Semiconductor devices and methods are provided which facilitate performing physical failure analysis (PFA) testing from a backside of the devices. In at least one example, a device is provided that includes a semiconductor device layer including a plurality of diffusion regions. A first interconnection structure is disposed on a first side of the semiconductor device layer, and the first interconnection structure includes at least one electrical contact. A second interconnection structure is disposed on a second side of the semiconductor device layer, and the second interconnection structure includes a plurality of backside power rails. Each of the backside power rails at least partially overlaps a respective diffusion region of the plurality of diffusion regions and defines openings which expose portions of the respective diffusion region at the second side of the semiconductor device layer.

Abstract: A bonding apparatus with a bonding head having vacuum channels and switchable channels, and the method of forming the same are provided. The bonding apparatus may include a vacuum pump, a blower, a controller communicatively coupled to the vacuum pump and the blower, and a bonding head. The bonding head may include a main body, a first vacuum channel in the main body, wherein the first vacuum channel is connected to the vacuum pump, and a first switchable channel in the main body, wherein the first switchable channel is connected to the vacuum pump and the blower.

Abstract: A die bonding tool includes a bond head having a moveable component. The moveable component may be moveable between an extended position in which a lower surface of the moveable component protrudes below a lower surface of the bond head and a retracted position in which the lower surface of the moveable component does not protrude below the lower surface of the bond head. The moveable component may be used to control a shape of a semiconductor die secured to the lower surface of the bond head during a process of bonding the semiconductor die to a substrate. Accordingly, void areas and other bonding defects may be avoided and the bond formed between the semiconductor die and the target substrate may be improved.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A wafer stacking process is provided in the present invention, including steps of forming a silicon oxide layer on a sacrificial carrier, bonding the silicon oxide layer with a dielectric layer on a front side of a silicon substrate, performing a thinning process on the back side of the silicon substrate to expose TSVs therewithin, bonding the back side of the silicon substrate with another silicon substrate, repeating the thinning process and the process of bonding another silicon substrate above so as to form a wafer stacking structure, and performing a removing process to completely remove the sacrificial carrier.

Abstract: A hybrid body temperature measurement system and a hybrid body temperature measurement method are provided. In the method, position sensing data is obtained. The position sensing data includes an azimuth of one or more to-be-detected objects relative to a reference position. The position sensing data is mapped to a thermal image so as to generate a mapping result. The thermal image is formed in response to a temperature. A position of the to-be-detected object in the thermal image is determined according to the mapping result. Accordingly, the detection accuracy is improved.

Abstract: A method related to magnetic field interference and a sensing system are provided. In the method, magnetic field uniformity within a time period is determined. Movement situation within the time period is determined. Magnetic field interference situation is determined according to the magnetic field uniformity and the movement situation.

Abstract: An identification method applicable to a wireless motion capturing system with multiple wearable devices, which is used to capture the movements of a user operating a virtual avatar model. The identification method includes: receiving a sensor data, where the sensor data is associated with a motion feature, and the motion feature corresponds to nodes of the virtual avatar model; and analyzing the sensor data and identifying the wearable devices as at least one of the nodes.

Abstract: A calculation method and a detection device for detecting a power capacity of a battery of an electronic device are provided. In the calculation method, a highest voltage value and a lowest voltage value of the battery are received. A unit voltage difference value is generated according to the highest voltage value and the lowest voltage value. A voltage value of the battery is converted into voltage value data, and the electronic device is controlled in an operation mode to obtain a time length required for the voltage value data to drop to the unit voltage difference value in the operation mode. A total discharge capacity of the battery is generated according to the time length and a use time interval of the electronic device in the operation mode, and a current power capacity is generated according to the total discharge capacity.

Abstract: A method for retrofitting exercise machines includes removably attaching a sensor module to a moving part of an exercise machine, the sensor module being configured to detect movements of the moving part and transmit the detected data by a first wireless communication connection, placing a control module in a vicinity of yet separated from the exercise machine, the control module being configured to receive the detected data, calculate an angle value and a speed range using the detected data and transmit the angle value and the speed range by a second wireless communication connection, providing a remote cloud-based application server configured to receive the angle value and the speed range via the second wireless communication connection, verify a user, produce data packets based on the angle value, the speed range and the verified user information and transmit the data packets to a display device.

Abstract: A method for retrofitting exercise machines includes removably attaching a sensor module to a moving part of an exercise machine, the sensor module being configured to detect movements of the moving part and transmit the detected data by a first wireless communication connection, placing a control module in a vicinity of yet separated from the exercise machine, the control module being configured to receive the detected data, calculate an angle value and a speed range using the detected data and transmit the angle value and the speed range by a second wireless communication connection, providing a remote cloud-based application server configured to receive the angle value and the speed range via the second wireless communication connection, verify a user, produce data packets based on the angle value, the speed range and the verified user information and transmit the data packets to a display device.

Abstract: A thermal image positioning method for determining a heat source location of the thermal image is disclosed. The thermal image positioning method includes obtaining a temperature array corresponding to the thermal image and determining a region of interest (ROI) of the temperature array. The thermal image positioning method further includes determining an ROI center reference point of the ROI, determining a plurality of corner points corresponding to the ROI, and determining the heat source location according to at least one of the plurality of corner points. A thermal image positioning system is also disclosed herein.

Abstract: A hybrid body temperature measurement system and a hybrid body temperature measurement method are provided. In the method, position sensing data is obtained. The position sensing data includes an azimuth of one or more to-be-detected objects relative to a reference position. The position sensing data is mapped to a thermal image so as to generate a mapping result. The thermal image is formed in response to a temperature. A position of the to-be-detected object in the thermal image is determined according to the mapping result. Accordingly, the detection accuracy is improved.

Abstract: A thermal image positioning method for determining a heat source location of the thermal image is disclosed. The thermal image positioning method includes obtaining a temperature array corresponding to the thermal image and determining a region of interest (ROI) of the temperature array. The thermal image positioning method further includes determining an ROI center reference point of the ROI, determining a plurality of corner points corresponding to the ROI, and determining the heat source location according to at least one of the plurality of corner points. A thermal image positioning system is also disclosed herein.

Abstract: A heart rate correction method and system and a computer readable medium are provided. A heartbeat measurement signal and an acceleration detection signal are collected during a sampling time range. A credibility of an instant heart rate is determined to be credible or incredible based on the acceleration detection signal. An average heart rate is calculated by taking out one or more instant heart rate of which the credibility is determined to be credible. Whether a difference between the average heart rate and a reference heart rate exceeds a variation range is determined. When it is determined that the difference between the average heart rate and the reference heart rate exceeds the variation range, a corrected heart rate is obtained based on a correction value and the reference heart rate, and the corrected heart rate is taken as an output heart rate corresponding to the sampling time range.

Abstract: In an embodiment, a method for estimating an object distance is used by an electronic device including a light sensor. The method includes: detecting, by the light sensor, a light reflected from an object; establishing an object brightness table according to the detected light, where the object brightness table records brightness information of the light corresponding to a plurality of pixel locations; analyzing the object brightness table and a plurality of base brightness tables to obtain differential quantitative information and obtaining a target base distance corresponding to a target base brightness table among the base brightness tables according to the differential quantitative information; and determining a distance between the electronic device and the object according to the target base distance.

Abstract: A gesture recognition method includes performing a binarization process on an image to obtain a binarized image, wherein the binarized image includes a plurality of foreground pixels and a plurality of background pixels; determining whether the plurality of foreground pixels surrounds at least a first background pixel; and determining a gesture complying with a predefined gesture in response to determination that the plurality of foreground pixels surrounds the at least a first background pixel.

Abstract: A gesture recognition method includes performing a binarization process on an image to obtain a binarized image, wherein the binarized image includes a plurality of foreground pixels and a plurality of background pixels; determining whether the plurality of foreground pixels surrounds at least a first background pixel; and determining a gesture complying with a predefined gesture in response to determination that the plurality of foreground pixels surrounds the at least a first background pixel.

Abstract: A gesture recognition method includes determining whether an object stays within a plurality of video frames for more than a specific time; determining a finger number corresponding to the object to generate a finger number determination result, and determining whether or not the object moves away from a light sensing unit to generate an object moving-away determination result, when the object stays within the plurality of video frames for more than the specific time; and determining a gesture of a user according to the finger number determination result and the object moving-away determination result.