Abstract: A semiconductor device structure is provided. The device includes one or more first semiconductor layers, each first semiconductor layer of the one or more first semiconductor layers is surrounded by a first intermixed layer, wherein the first intermixed layer comprises a first material and a second material.

Abstract: A semiconductor device structure, along with methods of forming such, are described. The semiconductor device structure includes a first dielectric feature extending along a first direction, the first dielectric feature comprising a first dielectric layer having a first sidewall and a second sidewall opposing the first sidewall, a first semiconductor layer disposed adjacent the first sidewall, the first semiconductor layer extending along a second direction perpendicular to the first direction, a second dielectric feature extending along the first direction, the second dielectric feature disposed adjacent the first semiconductor layer, and a first gate electrode layer surrounding at least three surfaces of the first semiconductor layer, and a portion of the first gate electrode layer is exposed to a first air gap.

Abstract: Semiconductor structures and methods for forming the same are provided. The semiconductor structure includes a plurality of first nanostructures formed over a substrate, and a dielectric wall adjacent to the first nanostructures. The semiconductor structure also includes a first liner layer between the first nanostructures and the dielectric wall, and the first liner layer is in direct contact with the dielectric wall. The semiconductor structure also includes a gate structure surrounding the first nanostructures, and the first liner layer is in direct contact with a portion of the gate structure.

Abstract: A semiconductor device according to the present disclosure includes a source feature and a drain feature, a plurality of semiconductor nanostructures extending between the source feature and the drain feature, a gate structure wrapping around each of the plurality of semiconductor nanostructures, a bottom dielectric layer over the gate structure and the drain feature, a backside power rail disposed over the bottom dielectric layer, and a backside source contact disposed between the source feature and the backside power rail. The backside source contact extends through the bottom dielectric layer.

Abstract: In some embodiments, the present disclosure relates to an integrated chip. The integrated chip includes a first channel structure configured to transport charge carriers within a first transistor device and a first gate electrode layer wrapping around the first channel structure. A second channel structure is configured to transport charge carriers within a second transistor device. A second gate electrode layer wraps around the second channel structure. The second gate electrode layer continuously extends from around the second channel structure to cover the first gate electrode layer. A third channel structure is configured to transport charge carriers within a third transistor device. A third gate electrode layer wraps around the third channel structure. The third gate electrode layer continuously extends from around the third channel structure to cover the second gate electrode layer.

Abstract: A method for forming a semiconductor device is provided. The method includes forming a plurality of first channel nanostructures and a plurality of second channel nanostructures in an n-type device region and a p-type device region of a substrate, respectively, and sequentially depositing a gate dielectric layer, an n-type work function metal layer, and a cap layer surrounding each of the first and second channel nanostructures. The cap layer merges in first spaces between adjacent first channel nanostructures and merges in second spaces between adjacent second channel nanostructures. The method further includes selectively removing the cap layer and the n-type work function metal layer in the p-type device region, and depositing a p-type work function metal layer over the cap layer in the n-type device region and the gate dielectric layer in the p-type device region. The p-type work function metal layer merges in the second spaces.

Abstract: A sensing system is disclosed. The sensing system includes a sensor cartridge and a readout device. The sensor cartridge includes a sensing device and a micro-channel-structure. The sensing device includes a chip member and an electrode member arranged projectively offset from each other.

Abstract: A cutting device includes a bottom plate, a platform located on the bottom plate for holding a workpiece, a first support plate connected to the support plate and located above the bottom plate, a first telescopic cylinder having a first piston, a blade connected to the first piston, a first medium providing device configured to provide medium, a first switch including a gateway A1 connected to a first lower cavity of the first telescopic cylinder, a gateway B1 opened to the outside, a gateway P1 connected to the first medium providing device, a first sensor including a gateway A2 opened to the outside, a gateway B2 communicating with a first upper cavity of the first telescopic cylinder, and a gateway P2 connected to the gateway B1.

Abstract: A vacuum device includes a vacuum generator, a guiding pipe, a connection member, and a stand. One end of the guiding pipe is connected to the vacuum generator. One end of the connection member is connected to the other end of the guiding pipe. The other end of the connection member is connected to the stand. The stand includes a top surface, a first sidewall connected to the top surface, and a pressing portion extending outward from the first sidewall. The connection member is supported by the top surface. The stand defines a first hole and a second hole communicating with the first hole. The first hole runs through the top surface and meets the connection member and the guiding pipe. The second hole runs through the first sidewall and the pressing portion.

Abstract: Lens module testing device for testing a lens module includes a testing platform, a light source, a testing board, a sensing element, a processor, a driving element, and a position feedback unit. The light source, the testing board, and the sensing element are arranged in order on the testing platform along an optical axis of the lens module. The lens module is positioned between the testing board and the sensing element. The light source emits testing light to the testing board, and the sensing element senses an image of the testing board and sends the image to the processor. The processor determines whether the testing board is in a focal plane of the lens module, controls the driving element to adjust a position of the testing board relative to the lens module, and obtains position information from the position feedback unit to generate a focal length of the lens module.

Abstract: A device includes a bearing assembly, a supporting assembly, a cutting assembly, a rotation pole, and a transmitting assembly. The supporting assembly includes a driving pole rotatably supported on the bearing assembly and a pair of guiding rails positioned on the bearing assembly. The cutting assembly screws on the driving pole and is slidably supported on the guiding rails. The cutting assembly includes a cutter protruding from the top plate. The rotation pole is rotatably positioned on the bearing assembly and is configured for supporting a lens module. The transmitting assembly drives the rotation pole and the driving pole to rotate. The driving pole drives the cutting assembly to move and the rotation pole to rotate, the cutter cuts the lens module during moving along the driving pole.

Abstract: A camera module testing device for detecting light leakage in relation to a camera module includes a base, a first fixing plate, a second fixing plate, a movable element, a stepping motor, a sliding table, a support mechanism, a board and a power supply module, and a processing unit. The movable element includes a first movable plate, a second movable plate, and a third movable plate. The support mechanism and the camera module are driven to rotate to various predetermined angles. The stepping motor drives movable element, the support mechanism and the camera module to swing a predetermined number times for each predetermined angle. The lens captures an image each time. The processing unit compares an image captured each time with a predetermined image and analyze if there is a problem of light leakage for the camera module.

Abstract: A tripod head includes a shell, an adjusting member, a supporting member, and a locking member. The shell defines a receiving space and an adjusting opening communicating with the receiving space. The adjusting member includes a spherical adjusting portion and a connecting portion connected to the adjusting portion. The adjusting portion is received in the receiving space, and the connecting portion passes out of the shell through the adjusting opening. The adjusting portion adjusts a position and angle of the connecting portion relative to the shell by rotating in the receiving space. The supporting member supports the adjusting portion in the receiving space. The locking member locks the adjusting portion between the supporting member and the shell.

Abstract: A lens assembling device is configured to assemble lenses into a lens barrel. The lens assembling device includes a hollow external barrel, a hollow internal barrel, and a pushing element. The external barrel includes a first hollow chamber and a second hollow chamber coaxial with the first hollow chamber. The first hollow chamber is configured to partly receive the lens barrel. The internal barrel is connected to the push element and is received in the second hollow chamber, and is configured to receive a lens. The pushing element is configured to push the lens from the internal barrel into the lens barrel.

Abstract: Lens module testing device for testing a lens module includes a testing platform, a light source, a testing board, a sensing element, a processor, a driving element, and a position feedback unit. The light source, the testing board, and the sensing element are arranged in order on the testing platform along an optical axis of the lens module. The lens module is positioned between the testing board and the sensing element. The light source emits testing light to the testing board, and the sensing element senses an image of the testing board and sends the image to the processor. The processor determines whether the testing board is in a focal plane of the lens module, controls the driving element to adjust a position of the testing board relative to the lens module, and obtains position information from the position feedback unit to generate a focal length of the lens module.

Abstract: A lens cutting device for cutting lenses of a molded lens member from supporting scraps includes a supporting portion, a sliding portion slidably connected to the supporting portion, a separating portion positioned on the sliding portion for keeping the molded lens member thereon, and a cutting portion positioned above the separating portion for cutting the lenses from the scrap. The supporting portion includes a bottom plate defining a first opening and a second opening arranged along a first linear direction. The sliding portion drives the separating portion to move along the first linear direction to selectively align the separating portion with the first opening or with the second opening.

Abstract: A valve includes a main body, an actuating member, and at least one resilient member. The main body defining includes a sliding hole and comprising a first connecting hole, a second connecting hole and a third connecting hole. The first connecting hole and the second connecting hole communicate with the sliding hole. The actuating member includes a sliding rod interferentially fit and slidable received in the sliding hole between a first position and a second position. The sliding rod defines a first hole, a second hole, and a third hole communicating with the second hole.

Abstract: A device includes a bearing assembly, a supporting assembly, a cutting assembly, a rotation pole, and a transmitting assembly. The supporting assembly includes a driving pole rotatably supported on the bearing assembly and a pair of guiding rails positioned on the bearing assembly. The cutting assembly screws on the driving pole and is slidably supported on the guiding rails. The cutting assembly includes a cutter protruding from the top plate. The rotation pole is rotatably positioned on the bearing assembly and is configured for supporting a lens module. The transmitting assembly drives the rotation pole and the driving pole to rotate. The driving pole drives the cutting assembly to move and the rotation pole to rotate, the cutter cuts the lens module during moving along the driving pole.

Abstract: A lens assembling device is configured to assemble lenses into a lens barrel. The lens assembling device includes a hollow external barrel, a hollow internal barrel, and a pushing element. The external barrel includes a first hollow chamber and a second hollow chamber coaxial with the first hollow chamber. The first hollow chamber is configured to partly receive the lens barrel. The internal barrel is connected to the push element and is received in the second hollow chamber, and is configured to receive a lens. The pushing element is configured to push the lens from the internal barrel into the lens barrel.

Abstract: A positioning device is configured for positioning a runner system, and includes a retainer, a number of flanges, and a number of bearing assemblies. The retainer includes a supporting surface. The flanges extend substantially perpendicularly upward from the supporting surface. The flanges cooperatively define a cavity for receiving the runner system. The bearing assemblies are configured for inserting through the flanges to tightly abut against the runner system in the cavity.