Patents by Inventor Chih-Hao HSIEH

Chih-Hao HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12040281
    Abstract: A manufacturing method of a semiconductor package is provided. The method includes: providing an initial rigid-flexible substrate, wherein the initial rigid-flexible substrate includes rigid structures and a flexible core laterally penetrating through the rigid structures, and further includes a supporting frame connected to the rigid structures; bonding a package structure onto the initial rigid-flexible substrate, wherein the package structure includes semiconductor dies and an encapsulant laterally surrounding the semiconductor dies; and removing the supporting frame.
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: July 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chuei-Tang Wang, Chen-Hua Yu, Chung-Shi Liu, Chih-Yuan Chang, Jiun-Yi Wu, Jeng-Shien Hsieh, Tin-Hao Kuo
  • Patent number: 9099530
    Abstract: Integrated circuit methods are described. The methods include providing a photomask that includes two main features for two via openings and further includes an optical proximity correction (OPC) feature linking the two main features; forming a hard mask layer on a substrate, the hard mask layer including two trench openings; forming a patterned resist layer over the hard mask layer using the photomask, wherein the patterned resist layer includes a peanut-shaped opening with two end portion aligned with the two trench openings of the hard mask layer, respectively; and performing a first etch process to the substrate using the hard mask layer and the patterned resist layer as a combined etch mask.
    Type: Grant
    Filed: May 8, 2014
    Date of Patent: August 4, 2015
    Assignee: Taiwan Semiconductor Manufacturing Compnay, Ltd.
    Inventors: Chung-Yi Lin, Jiing-Feng Yang, Tzu-Hao Huang, Chih-Hao Hsieh, Dian-Hau Chen, Hsiang-Lin Chen, Ko-Bin Kao, Yung-Shih Cheng
  • Publication number: 20140242794
    Abstract: Integrated circuit methods are described. The methods include providing a photomask that includes two main features for two via openings and further includes an optical proximity correction (OPC) feature linking the two main features; forming a hard mask layer on a substrate, the hard mask layer including two trench openings; forming a patterned resist layer over the hard mask layer using the photomask, wherein the patterned resist layer includes a peanut-shaped opening with two end portion aligned with the two trench openings of the hard mask layer, respectively; and performing a first etch process to the substrate using the hard mask layer and the patterned resist layer as a combined etch mask.
    Type: Application
    Filed: May 8, 2014
    Publication date: August 28, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Yi Lin, Jiing-Feng Yang, Tzu-Hao Huang, Chih-Hao Hsieh, Dian-Hau Chen, Hsiang-Lin Chen, Ko-Bin Kao, Yung-Shih Cheng
  • Patent number: 8728332
    Abstract: Integrated circuit methods are described. The methods include providing a photomask that includes two main features for two via openings and further includes an optical proximity correction (OPC) feature linking the two main features; forming a hard mask layer on a substrate, the hard mask layer including two trench openings; forming a patterned resist layer over the hard mask layer using the photomask, wherein the patterned resist layer includes a peanut-shaped opening with two end portion aligned with the two trench openings of the hard mask layer, respectively; and performing a first etch process to the substrate using the hard mask layer and the patterned resist layer as a combined etch mask.
    Type: Grant
    Filed: May 7, 2012
    Date of Patent: May 20, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Yi Lin, Jiing-Feng Yang, Tzu-Hao Huang, Chih-Hao Hsieh, Dian-Hau Chen, Hsiang-Lin Chen, Ko-Bin Kao, Yung-Shih Cheng
  • Publication number: 20130295769
    Abstract: Integrated circuit methods are described. The methods include providing a photomask that includes two main features for two via openings and further includes an optical proximity correction (OPC) feature linking the two main features; forming a hard mask layer on a substrate, the hard mask layer including two trench openings; forming a patterned resist layer over the hard mask layer using the photomask, wherein the patterned resist layer includes a peanut-shaped opening with two end portion aligned with the two trench openings of the hard mask layer, respectively; and performing a first etch process to the substrate using the hard mask layer and the patterned resist layer as a combined etch mask.
    Type: Application
    Filed: May 7, 2012
    Publication date: November 7, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chung-Yi Lin, Jiing-Feng Yang, Tzu-Hao Huang, Chih-Hao Hsieh, Dian-Hau Chen, Hsiang-Lin Chen, Ko-Bin Kao, Yung-Shih Cheng
  • Publication number: 20130147725
    Abstract: A comprehensive eyeglass dispensing assistance system includes an input device, a data storage device and a display device respectively electrically coupled to a processor, which receives an inputted instruction signal from the input device to fetch corresponding eyeglass dispensing desktop data and eyeglass wearing simulation animation data from the data storage devices for display on a menu directory zone and a condition indicator zone on the screen of the display device so that the consumers can understand and judge the symptoms and reasons of their vision acuity and the type or kind of corrective eyeglasses to be selected, facilitating optometric procedure explanation and performance.
    Type: Application
    Filed: June 1, 2012
    Publication date: June 13, 2013
    Inventors: Ching-Chung CHU, Ching-Ming CHEN, Chun-Nung HUANG, Chih-Hao HSIEH, Chih-Hui WU