Patents by Inventor Chih-Hao Hsu

Chih-Hao Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190026529
    Abstract: The present invention provides a surface treatment method, applicable to surface treatment of a fingerprint sensing module and including the following steps: (a) providing a fingerprint sensing module; (b) radiating an ultraviolet curable resin layer of the fingerprint sensing module by using a laser; (c) removing the ultraviolet curable resin layer by using a paint remover; and (d) removing an ink layer of the fingerprint sensing module by using the paint remover.
    Type: Application
    Filed: November 13, 2017
    Publication date: January 24, 2019
    Inventor: Chih-Hao Hsu
  • Publication number: 20190022685
    Abstract: The present invention provides a rotary spraying coating system, configured to evenly form a paint on a surface of a chip connecting plate.
    Type: Application
    Filed: December 7, 2017
    Publication date: January 24, 2019
    Inventor: CHIH-HAO HSU
  • Publication number: 20190017867
    Abstract: The invention provides a light emitting sensing device and a manufacturing method thereof. The light emitting sensing device comprises: a non-translucent substrate having a first surface with at least one recess formed on the first surface; a light emitting element disposed in the at least one recess; a light sensing element disposed on the first surface; a first transparent material disposed in the at least one recess and covering the light emitting element; and a second transparent material disposed on the first surface and covering the light sensing element. The light emitting sensing device provided in this embodiment solves the problem in the prior art, the infrared light emitted by the light emitting chip irradiates into the sensing chip and causes the sensing chip to be interfered by the light of the light emitting chip resulting in reduced sensing accuracy.
    Type: Application
    Filed: July 12, 2018
    Publication date: January 17, 2019
    Applicant: Everlight Electronics Co., Ltd.
    Inventors: SHIH-WEN LAI, CHIH-HAO HSU, YI-HUI LIAO, JIAN-HONG LAI, YI-TING HUANG, KUAN-YU CHEN, SHU-WEI CHEN, CHIEH-YU KANG
  • Patent number: 10176356
    Abstract: A method for manufacturing a fingerprint identification module is provided. In a step (a), a fingerprint sensor comprising a substrate, a sensing chip and a package layer is provided. The sensing chip is disposed on the substrate. The sensing chip is encapsulated by the package layer. In a step (b), an ink material is coated on the package layer, so that a color ink layer is formed on the package layer. In a step (c), a stamping tool is used to stamp the color ink layer, so that a top surface of the color ink layer becomes a first high gloss surface. In a step (d), the color ink layer to be heated through baking or irradiated with UV light, so that the color ink layer is hardened.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: January 8, 2019
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Mao-Hsiu Hsu, Li-Pin Wang, Hong-Kai Huang, Chih-Hao Hsu
  • Publication number: 20180338381
    Abstract: The present invention provides a fingerprint recognition module, including: a substrate, a fingerprint sensing die fixed on the substrate, an encapsulation layer covering the fingerprint sensing die and the substrate, the encapsulation layer having a composition plane, and an imprint layer, where the imprint layer is formed on the composition plane.
    Type: Application
    Filed: November 16, 2017
    Publication date: November 22, 2018
    Inventor: CHIH-HAO HSU
  • Publication number: 20180307931
    Abstract: A fingerprint sensor imprinting system includes a first fixture, an imprinting module, a laser cutting module, an air pump and a second fixture. The first fixture includes an opening for accommodating a fingerprint sensor. The imprinting module forms an imprinted layer on the first fixture and the fingerprint sensor. The laser cutting module cuts the imprinted layer to define a protective layer on the top surface of the fingerprint sensor. The second fixture has a recess for accommodating the fingerprint sensor. After the fingerprint sensor is transferred to the recess, the air pump is enabled to drive the vacuum adsorption unit to adsorb the fingerprint sensor, and then the protective layer is cut such that the area of the protective layer is equal to the area of the top surface of the fingerprint sensor.
    Type: Application
    Filed: September 12, 2017
    Publication date: October 25, 2018
    Inventor: CHIH-HAO HSU
  • Patent number: 10108842
    Abstract: A method for assembling a fingerprint identification module is provided. During the process of cutting a sensing strip, the junction parts between adjacent fingerprint sensors are retained. Consequently, the cut sensing strip is still a one-piece structure. Then, a paint-spraying process is performed to spray paint on the one-piece structure of the sensing strip. After the junction parts are removed, plural individual fingerprint sensors are produced. In comparison with the conventional technology of spraying paint on the individual fingerprint sensors, the assembling time of the method of the present invention is largely reduced. Consequently, the production efficiency of the present invention is enhanced.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: October 23, 2018
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Mao-Hsiu Hsu, Chih-Hao Hsu, Ying-Chieh Chuang
  • Publication number: 20180270418
    Abstract: An image sensing apparatus including a light source, an image sensor, at least one lens, and a wavelength selecting device is provided. The light source is configured to emit an illumination light to irradiate an object. The image sensor is configured to receive a light signal from the object and send an image signal corresponding to the light signal. The at least one lens is located on a transmission path of the light signal and between the object and the image sensor. The wavelength selecting device is located on the transmission path of the light signal and between the object and the image sensor. The wavelength selecting device has a first reflector and a second reflector, and a gap exists between the first reflector and the second reflector. The gap is adapted to be adjusted to have a first predetermined optical path length or a second predetermined optical path length.
    Type: Application
    Filed: June 28, 2017
    Publication date: September 20, 2018
    Applicant: Industrial Technology Research Institute
    Inventors: Jing-Yuan Lin, Horn-Chin Lee, Chia-Jung Chang, Chih-Hao Hsu
  • Publication number: 20180143173
    Abstract: Provided is a residual toxicant detection system and a residual toxicant detection method, the residual toxicant detection method including: allowing an aqueous solution containing a residual toxicant to flow into a detection portion including a cavity; providing at a side of the cavity a light containing a specific wavelength range to react with the residual toxicant; receiving the light that passes through the cavity on another side of the cavity, thereby generating a sensing signal; and calculating an amount of change in absorbance of the aqueous solution according to the sensing signal, wherein when the amount of change in absorbance is less than a threshold value, a detection count is accumulated, and when the accumulated detection count is greater than a predetermined value, a detection result is generated. Therefore, whether or not the residual toxicant on the object is cleaned can be determined easily and accurately.
    Type: Application
    Filed: June 5, 2017
    Publication date: May 24, 2018
    Inventors: Chia-Jung Chang, Jui-Hung Tsai, Chih-Hao Hsu, Jing-Yuan Lin
  • Publication number: 20180143128
    Abstract: Disclosed is a residual toxicant detection device for detecting the amount of residual toxicants in an aqueous solution to be measured. The residual toxicant detection device includes an accommodation space formed from a shell, a water inlet and a water outlet positioned on the shell for the aqueous solution to flow therein and thereout, respectively, a sensing chamber in the accommodation space, a light source emitter and a light sensor positioned near the sensing chamber, the light source emitter emitting light of a wavelength range, the light sensor receiving the light passing through the sensing chamber, and a circuit board receiving sensing signals sensed by the light sensor, such that absorbance and a change of the absorbance of residual toxicants in the aqueous solution to be measured are calculated.
    Type: Application
    Filed: November 15, 2017
    Publication date: May 24, 2018
    Inventors: Jui-Hung Tsai, Ying-Hao Wang, Chia-Jung Chang, Chih-Hao Hsu, Jing-Yuan Lin
  • Publication number: 20180129851
    Abstract: A method for manufacturing a fingerprint identification module is provided. In a step (a), a fingerprint sensor comprising a substrate, a sensing chip and a package layer is provided. The sensing chip is disposed on the substrate. The sensing chip is encapsulated by the package layer. In a step (b), an ink material is coated on the package layer, so that a color ink layer is formed on the package layer. In a step (c), a stamping tool is used to stamp the color ink layer, so that a top surface of the color ink layer becomes a first high gloss surface. In a step (d), the color ink layer to be heated through baking or irradiated with UV light, so that the color ink layer is hardened.
    Type: Application
    Filed: January 6, 2017
    Publication date: May 10, 2018
    Inventors: MAO-HSIU HSU, LI-PIN WANG, HONG-KAI HUANG, CHIH-HAO HSU
  • Publication number: 20180101717
    Abstract: A method for assembling a fingerprint identification module is provided. During the process of cutting a sensing strip, the junction parts between adjacent fingerprint sensors are retained. Consequently, the cut sensing strip is still a one-piece structure. Then, a paint-spraying process is performed to spray paint on the one-piece structure of the sensing strip. After the junction parts are removed, plural individual fingerprint sensors are produced. In comparison with the conventional technology of spraying paint on the individual fingerprint sensors, the assembling time of the method of the present invention is largely reduced. Consequently, the production efficiency of the present invention is enhanced.
    Type: Application
    Filed: December 2, 2016
    Publication date: April 12, 2018
    Inventors: Mao-Hsiu HSU, Chih-Hao HSU, Ying-Chieh CHUANG
  • Publication number: 20180087962
    Abstract: An optical package is provided. The optical package includes an interference splitter allowing a light having a predetermined wavelength range to transmit through, a sensing element, and a light-transmitting structure. The light-transmitting structure includes a light-transmitting pillar and a light-absorbing layer surrounding the light-transmitting pillar, and the light-absorbing layer absorbs the light having the predetermined wavelength range. The interference splitter, the light-transmitting pillar, and the sensing element are arranged aligned with each other along an extending direction of the light-transmitting pillar. The sensing element is configured to receive the light transmitting through the interference splitter and the light-transmitting pillar.
    Type: Application
    Filed: December 27, 2016
    Publication date: March 29, 2018
    Inventors: Chia-Jung CHANG, Yu-Sheng HSIEH, Jing-Yuan LIN, Chih-Hao HSU
  • Patent number: 9879848
    Abstract: An LED illumination apparatus includes a first lighting module, a second lighting module, a lamp cup, a heat pipe, and a plurality of heat dissipation fins. The first and second lighting modules are connected with each other and emit light in opposite directions, in addition being received by the lamp cup. The lamp cup includes two reflecting surfaces arranged in symmetrical mirror fashion. The light emitting from the first and second lighting modules are directed to respective reflecting surfaces and reflected toward a same direction by the reflecting surfaces. The heat pipe is disposed in between the first and second lighting modules. The heat dissipation fins are fitted over the heat pipe. The heat generated by lighting modules would transmit to the heat pipe and be guided to the heat dissipation fins in order to accelerate cooling.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: January 30, 2018
    Assignee: NATIONAL TAIWAN UNIVERSITY
    Inventors: Guo-Dung Su, Chih-Hao Hsu
  • Patent number: 9827814
    Abstract: A carrier module of a tire pressure monitoring device includes a plastic carrier and a metallic tube. The plastic carrier has a trough and a tube extended from a bottom portion of the trough. The trough has an airflow channel penetratingly formed on the bottom portion thereof, and the trough is in air communication with the tube by the airflow channel The metallic tube is seamlessly formed on an inner surface of the tube of the plastic carrier. The metallic tube has an inner screw thread formed on an inner surface thereof for detachably screwing to a nozzle of a tire. Thus, by seamlessly forming the metallic tube on the inner surface of the tube of the plastic carrier, the tire pressure monitoring device of the instant disclosure has a better airproof effect and a longer service life.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: November 28, 2017
    Assignee: ICHIA TECHNOLOGIES, INC.
    Inventors: Chih-Hao Hsu, Chung-Hsin Yang, Chih-Pin Lin, Shih-Fu Yu, Wei-Tsen Yen
  • Patent number: 9806050
    Abstract: A package structure includes: a first dielectric layer having a first surface and a second surface opposing the first surface; a semiconductor chip embedded in the first dielectric layer in a manner that the semiconductor chip protrudes from the second surface, and having an active surface and an inactive surface opposing the active surface, electrode pads being disposed on the active surface and in the first dielectric layer, the inactive surface and a part of a side surface adjacent the inactive surface protruding from the second surface; a first circuit layer disposed on the first surface; a built-up structure disposed on the first surface and the first circuit layer; and an insulating protective layer disposed on the built-up structure, a plurality of cavities being formed in the insulating protective layer for exposing a part of a surface of the built-up structure. The package structure includes only one built-up structure.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: October 31, 2017
    Assignee: Unimicron Technology Corp.
    Inventors: Pao-Hung Chou, Chih-Hao Hsu
  • Publication number: 20170297386
    Abstract: A carrier module of a tire pressure monitoring device includes a plastic carrier and a metallic tube. The plastic carrier has a trough and a tube extended from a bottom portion of the trough. The trough has an airflow channel penetratingly formed on the bottom portion thereof, and the trough is in air communication with the tube by the airflow channel The metallic tube is seamlessly formed on an inner surface of the tube of the plastic carrier. The metallic tube has an inner screw thread formed on an inner surface thereof for detachably screwing to a nozzle of a tire. Thus, by seamlessly forming the metallic tube on the inner surface of the tube of the plastic carrier, the tire pressure monitoring device of the instant disclosure has a better airproof effect and a longer service life.
    Type: Application
    Filed: April 18, 2016
    Publication date: October 19, 2017
    Inventors: CHIH-HAO HSU, CHUNG-HSIN YANG, CHIH-PIN LIN, SHIH-FU YU, WEI-TSEN YEN
  • Publication number: 20170205030
    Abstract: An LED illumination apparatus includes a first lighting module, a second lighting module, a lamp cup, a heat pipe, and a plurality of heat dissipation fins. The first and second lighting modules are connected with each other and emit light in opposite directions, in addition being received by the lamp cup. The lamp cup includes two reflecting surfaces arranged in symmetrical mirror fashion. The light emitting from the first and second lighting modules are directed to respective reflecting surfaces and reflected toward a same direction by the reflecting surfaces. The heat pipe is disposed in between the first and second lighting modules. The heat dissipation fins are fitted over the heat pipe. The heat generated by lighting modules would transmit to the heat pipe and be guided to the heat dissipation fins in order to accelerate cooling.
    Type: Application
    Filed: June 9, 2016
    Publication date: July 20, 2017
    Applicant: National Taiwan University
    Inventors: Guo-Dung SU, Chih-Hao HSU
  • Publication number: 20170176497
    Abstract: A microelectromechanical probe is manufactured by a MEMS manufacturing process forming a probe body and a cutting process providing a pinpoint portion a cutting face. The probe has a top surface, a body portion, and a pinpoint portion extended in a probing direction from the body portion and provided with first and second sides and a probing end oriented in the probing direction. The cutting face is provided on the top surface, adjoins the first and second sides and the probing end, and has at least one cut mark formed by the cutting process, extended from the first side to the second side and non-parallel to the probing direction. The cutting face descends from an edge cut mark to the probing end.
    Type: Application
    Filed: December 15, 2016
    Publication date: June 22, 2017
    Inventors: Shao-Lun WEI, Yu-Chen HSU, Mao-Fa SHEN, Chih-Hao HSU
  • Patent number: 9658250
    Abstract: A vertical probe device includes upper and lower dies having upper and lower installing holes, probe needles, a lower positioning film disposed between the dies and having lower positioning holes, and a dividing film disposed between the lower positioning film and the upper die and having through holes and dividing ribs. The needle tail is individually inserted through a lower installing hole. The needle head is individually inserted through an upper installing hole. Each lower positioning hole is located under at least one dividing rib and capable of accommodating a plurality of needle heads. Each needle head is inserted through a lower positioning hole and a through hole. Therefore, the films are easily installed, free of irregular hole but passable by narrow needle bodies, and facilitate easy and fast installation and less damage to the probe needles that are well positioned, and facilitate easy installation of the upper die.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: May 23, 2017
    Assignee: MPI CORPORATION
    Inventors: Hsiang-Sheng Hsieh, Sang-Yi Lin, Chih-Hao Hsu