Patents by Inventor Chih Hau CHEN

Chih Hau CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250070064
    Abstract: An embodiment is a device including a first die and a substrate including a first surface and a second surface opposite the first surface. The device also includes an active device on the first surface of the substrate. The device also includes a first interconnect structure on the first surface of the substrate. The device also includes a through substrate via extending through the first interconnect structure and the substrate to the second surface of the substrate, the through substrate via being electrically coupled to metallization patterns in the first interconnect structure. The device also includes one or more material-filled trench structures extending from the second surface of the substrate into the substrate, the one or more material-filled trench structures being electrically isolated from the through substrate via.
    Type: Application
    Filed: January 3, 2024
    Publication date: February 27, 2025
    Inventors: Ke-Gang Wen, Yu-Bey Wu, Liang-Wei Wang, Hsin-Feng Chen, Tsung-Chieh Hsiao, Chih Chuan Su, Dian-Hau Chen
  • Publication number: 20250070052
    Abstract: A method includes forming first nanostructures over a first region of a substrate; forming second nanostructures over a second region of the substrate; forming first gate structures around the first nanostructures; replacing the second nanostructures with isolation regions; and forming a seal ring over the substrate, wherein the seal ring is between the first region and the second region.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 27, 2025
    Inventors: Ke-Gang Wen, Chih Hsin Yang, Kuan-Hsun Wang, Tsung-Chieh Hsiao, Liang-Wei Wang, Dian-Hau Chen
  • Publication number: 20250046667
    Abstract: A method includes forming a device die including forming integrated circuits on a semiconductor substrate; and forming a thermally conductive pillar extending into the semiconductor substrate. A cooling medium is attached over and contacting the semiconductor substrate to form a package, wherein the cooling medium is thermally coupled to the thermally conductive pillar.
    Type: Application
    Filed: October 6, 2023
    Publication date: February 6, 2025
    Inventors: Tsung-Chieh Hsiao, Ke-Gang Wen, Chih-Pin Chiu, Hsin-Feng Chen, Yu-Bey Wu, Liang-Wei Wang, Dian-Hau Chen
  • Publication number: 20240309740
    Abstract: An arrangement for supporting one or more bearings of a crankshaft assembly of a hydraulic fracturing pump includes a frame and one or more bearing supports. The frame is of a first material and defines one or more bearing support profiles. The bearing supports are of a second material different from the first material of the frame. The bearing supports are cast-in-place within the corresponding bearing support profiles of the frame and are configured to be in contact with an outer race of the corresponding bearings of the crankshaft assembly. Compared to the first material of the frame, the second material of the bearing supports is more effective at preventing slippage of the bearings.
    Type: Application
    Filed: March 16, 2023
    Publication date: September 19, 2024
    Applicant: SPM Oil & Gas Inc.
    Inventors: Chandu Kumar, Johnny Eric DeLeon, II, Jeffrey Haiderer, Chih Hau Chen
  • Publication number: 20240254987
    Abstract: A pump assembly may include a bearing housing having a bore. The pump assembly may include a connecting rod connected to the bearing housing at a first end of the connecting rod and connected to a crosshead at a second end of the connecting rod via a wrist pin. The connecting rod may include a lubrication channel that extends within the connecting rod. The pump assembly may include a shell bearing in the bore of the bearing housing, the shell bearing having an inner surface and an outer surface. A portion of the inner surface of the shell bearing that contacts the crankshaft in a forward stroke of the crosshead may be uninterrupted by a groove or an aperture configured to direct lubrication fluid to the lubrication channel of the connecting rod.
    Type: Application
    Filed: December 14, 2023
    Publication date: August 1, 2024
    Applicant: SPM Oil & Gas Inc.
    Inventors: John S. MARQUEZ, Alireza ATABAIE, John MCCRADY, Chandu KUMAR, Chih Hau CHEN