Patents by Inventor Chih-Ho Liu

Chih-Ho Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240155672
    Abstract: Wireless communications systems, apparatuses, and methods are provided. A method of wireless communication performed by a first sidelink user equipment (UE) may include transmitting a sidelink synchronization signal block (S-SSB) in a first S-SSB slot of an S-SSB burst, and communicating a sidelink communication in at least one remaining S-SSB slot of the S-SSB burst.
    Type: Application
    Filed: November 3, 2022
    Publication date: May 9, 2024
    Inventors: Jae Ho RYU, Chih-Hao LIU, Hari SANKAR
  • Publication number: 20240114510
    Abstract: The present disclosure provides solutions to sidelink transmission/reception problems by preparing waveforms for multiple resource blocks (RBs) in a given bandwidth. Upon determining the availability of RBs or sets of RBs the apparatuses and methods of the present disclosure allow for dynamic determination and use of available sidelink frequencies. An apparatus may comprise a memory and at least one processor coupled to the memory and configured to transmit and/or receive sidelink data in at least one contiguous set of RBs within a bandwidth part (BWP) of an unlicensed frequency band, the BWP including a plurality of RB sets, wherein the SL data is transmitted and/or received in a waveform generated for at least one of the plurality of RB sets prior to a listen-before-talk procedure indicating an availability of the at least one contiguous set of RBs for transmission.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Inventors: Jae Ho RYU, Chih-Hao LIU, Sanghoon KIM, Hari SANKAR
  • Publication number: 20240006113
    Abstract: An inductor includes a coil, a conductive lead frame, and a housing. The coil includes a coil body and a lead protruding from the coil body. The lead has a U-bend portion. The lead is electrically fixed onto the conductive lead frame. The housing encapsulates the coil and exposes the conductive lead frame. A method of manufacturing an inductor includes the following steps: providing a coil, providing a conductive lead frame, making a lead of the coil be electrically fixed onto the conductive lead frame, bending the lead to form a U-bend portion and make the main body of the coil close to a portion of the lead that connects with the conductive lead frame, and forming a housing to encapsulate the coil and expose the conductive lead frame.
    Type: Application
    Filed: June 4, 2023
    Publication date: January 4, 2024
    Applicant: DARFON ELECTRONICS CORP.
    Inventors: Zuei-Chown Jou, Chih-Ho Liu, Jui-Wen Kuo, Chi-Ming Huang, Bo-Yu Huang, Yao-Tsung Chen
  • Publication number: 20230395320
    Abstract: An integrated-type coupled inductor is applied to a related manufacturing method and includes a lead frame, a first coil, a second coil and a magnetic packing component. The lead frame has a first surface and a second surface opposite to each other and includes four pins. The first coil is disposed on the first surface and coupled to two of the four pins. The second coil is disposed on the second surface and coupled to other pins. The magnetic packing component covers the first coil and the second coil to expose parts of the four pins.
    Type: Application
    Filed: May 29, 2023
    Publication date: December 7, 2023
    Applicant: DARFON ELECTRONICS CORP.
    Inventors: Chih-Ho Liu, Jui-Wen Kuo, Chi-Ming Huang, Bo-Yu Huang, Yao-Tsung Chen