Patents by Inventor Chih-Horng Chang

Chih-Horng Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080305354
    Abstract: A filler composition for welding onto a substrate is composed of 82.5˜96.5 wt %, aluminum, 3.0˜10.0 wt % copper, 0.2˜1.5 wt % magnesium, 0.1˜1.5 wt % silver, 0.1˜2.0 wt % scandium, 0˜1.5 wt % zirconium, and 0˜1.0 wt % titanium, and can be welded with a high success rate to a substrate (such as an aluminum-copper alloy substrate) and avoiding a hot cracking phenomenon and a low welding strength, so as to achieve the effects of enhancing the yield rate and lowering the cost of a product.
    Type: Application
    Filed: August 16, 2007
    Publication date: December 11, 2008
    Inventors: Sheng-Long Lee, Chih-Horng Chang, Jing-Chie Lin, Chin-Kui Lin, Meng-Syuan Doong, Kent-Yi Lee, Yu-Chou Tsai, Yu-Te Chen