Abstract: Disclosed is a warpage suppressing reflow oven, which comprises a reflow oven body, where a perforated steel plate circulating device comprising a perforated steel plate is disposed at a reflow-oven inner oven. A plurality of downdraft modules is arranged in the perforated steel plate, and the downdraft acting forces thereof face the upper panel. More than one air extractor is communicated with the plurality of downdraft modules via a plurality of pipelines. Under actuation of the air extractors, the downdraft modules generate downdraft acting forces to the bottom surfaces of the products, so that the products are flatly attached to the universal perforated carriers without warpage in a heat soldering process. Thereby, more uniform heating of the products and better contact of solder joints and effectively improving the yield of reflow soldering operations are achieved.

Abstract: Disclosed is a warpage suppressing reflow oven, which comprises a reflow oven body, where a perforated steel plate circulating device comprising a perforated steel plate is disposed at a reflow-oven inner oven. A plurality of downdraft modules is arranged in the perforated steel plate, and the downdraft acting forces thereof face the upper panel. More than one air extractor is communicated with the plurality of downdraft modules via a plurality of pipelines. Under actuation of the air extractors, the downdraft modules generate downdraft acting forces to the bottom surfaces of the products, so that the products are flatly attached to the universal perforated carriers without warpage in a heat soldering process. Thereby, more uniform heating of the products and better contact of solder joints and effectively improving the yield of reflow soldering operations are achieved.

Abstract: Disclosed is a method for suppressing material warpage by increasing a gas density. The method comprises the following steps: a. placing a plurality of semiconductor elements in a processing chamber; b. increasing a temperature in the processing chamber to a first predetermined temperature and importing a gas, to increase pressure to predetermined pressure and apply the processing chamber in a high-temperature and high-pressure working environment; and performing an isothermal-isobaric process at the first predetermined temperature and the predetermined pressure, to improve temperature uniformity by the high pressure gas; and c. decreasing the temperature in the processing chamber from the first predetermined temperature to a second predetermined temperature and continuing to import the gas into the processing chamber, to maintain the processing chamber at the predetermined pressure; and performing a cooling and isobaric process on each semiconductor element, to suppress warpage of each semiconductor element.

Abstract: Disclosed are embodiments related to chip pressing devices. One such chip pressing device includes a bottom portion and a top portion, which is configured to be attached to or separated from the bottom portion, and has a compartment portion, an upper chamber, and a lower chamber, wherein the upper chamber is spaced apart from the lower chamber by the compartment portion. The upper chamber has one or more gas passages, the lower chamber has one or more gas inlets and one or more gas outlets, and the compartment portion has one or more through-holes. One or more pressing heads movably fit into the through-holes; one or more gas pressure sources connected to at least one of the gas passages of the upper chamber, wherein the upper chamber is pressurized, and one or more heated gas sources are connected to the one or more gas inlets of the lower chamber.

Abstract: This invention relates to a method for securing a carrier by gas pressurization to inhibit warpage of the carrier. The method includes following steps: provide a carrier with an upper surface and a lower surface which are opposite to each other; providing an evacuable jig with an apertured surface on which a plurality of apertures are provided; placing and securing one of the upper and lower surfaces of the carrier on the apertured surface in a manner of facing the apertured surface, wherein the surface of the carrier faced to the apertured surface is defined as a first surface, and the other surface opposed to the first surface is defined as a second surface; and gas pressurizing a chamber and evacuating the jig positioned in the chamber, to form a pressure difference between the first surface and the second surface of the carrier, whereby the carrier is pressed on the jig, wherein the chamber is pressurized to a predetermined pressure greater than a standard atmospheric pressure.

Abstract: The present invention relates to a method for adjusting temperature by increasing gas molecular density. The method includes: filling a chamber with at least one gas to a predetermined pressure, wherein the predetermined pressure is higher than 1 atm and lower than or equal to 50 atm; flowing the gas in the chamber to a temperature adjusting device, wherein the temperature adjusting device includes a cooler and a gas returning device; cooling the gas by the cooler; and returning the gas to the chamber by the gas returning device.

Abstract: Disclosed are embodiments related to chip pressing devices. One such chip pressing device includes a bottom portion and a top portion, which is configured to be attached to or separated from the bottom portion, and has a compartment portion, an upper chamber, and a lower chamber, wherein the upper chamber is spaced apart from the lower chamber by the compartment portion. The upper chamber has one or more gas passages, the lower chamber has one or more gas inlets and one or more gas outlets, and the compartment portion has one or more through-holes. One or more pressing heads movably fit into the through-holes; one or more gas pressure sources connected to at least one of the gas passages of the upper chamber, wherein the upper chamber is pressurized, and one or more heated gas sources are connected to the one or more gas inlets of the lower chamber.

Abstract: This invention relates to a method for securing a carrier by gas pressurization to inhibit warpage of the carrier. The method includes following steps: provide a carrier with an upper surface and a lower surface which are opposite to each other; providing an evacuable jig with an apertured surface on which a plurality of apertures are provided; placing and securing one of the upper and lower surfaces of the carrier on the apertured surface in a manner of facing the apertured surface, wherein the surface of the carrier faced to the apertured surface is defined as a first surface, and the other surface opposed to the first surface is defined as a second surface; and gas pressurizing a chamber and evacuating the jig positioned in the chamber, to form a pressure difference between the first surface and the second surface of the carrier, whereby the carrier is pressed on the jig, wherein the chamber is pressurized to a predetermined pressure greater than a standard atmospheric pressure.

Abstract: A method for fabricating a window ball grid array (WBGA) semiconductor package is provided. A substrate is prepared having a through opening and ball pads on a lower surface thereof. A chip is mounted over the opening of the substrate via an adhesive, with gaps not applied with the adhesive left between the chip and substrate. The chip is electrically connected to the substrate via bonding wires through the opening. A spacer is attached to the lower surface of the substrate and has a through hole and a recessed portion around the through hole. During molding, the spacer is clamped between the substrate and a mold, and the recessed portion is located between the ball pads and the opening, such that a resin material for forming an encapsulation body encapsulates the chip and flows through the gaps to encapsulate the bonding wires. The recessed portion holds resin flash therein.

Abstract: A method for fabricating a window ball grid array (WBGA) semiconductor package is provided. A substrate is prepared having a through opening and ball pads on a lower surface thereof. A chip is mounted over the opening of the substrate via an adhesive, with gaps not applied with the adhesive left between the chip and substrate. The chip is electrically connected to the substrate via bonding wires through the opening. A spacer is attached to the lower surface of the substrate and has a through hole and a recessed portion around the through hole. During molding, the spacer is clamped between the substrate and a mold, and the recessed portion is located between the ball pads and the opening, such that a resin material for forming an encapsulation body encapsulates the chip and flows through the gaps to encapsulate the bonding wires. The recessed portion holds resin flash therein.

Abstract: A fabrication method of a window-type ball grid array (WBGA) semiconductor package is provided. With a chip being mounted over an opening formed through a substrate and electrically connected to the substrate by bonding wires through the opening, a molding process is performed to form a first encapsulant for encapsulating the chip. Then, a printing process is performed to form a second encapsulant for filling the opening and encapsulating the bonding wires. Finally, a plurality of solder balls are implanted on the substrate at area outside the second encapsulant. By implementing the molding process first and then the printing process, problems such as chip cracks, bond pad contamination and delamination generated in the prior art, can be eliminated.

Abstract: A fabrication method of a window-type ball grid array (WBGA) semiconductor package is provided. With a chip being mounted over an opening formed through a substrate and electrically connected to the substrate by bonding wires through the opening, a molding process is performed to form a first encapsulant for encapsulating the chip. Then, a printing process is performed to form a second encapsulant for filling the opening and encapsulating the bonding wires. Finally, a plurality of solder balls are implanted on the substrate at area outside the second encapsulant. By implementing the molding process first and then the printing process, problems such as chip cracks, bond pad contamination and delamination generated in the prior art, can be eliminated.