Patents by Inventor Chih-Hsiang Hsu

Chih-Hsiang Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12183712
    Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: December 31, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Che-Ting Liu, Jheng-Yu Hong, Yu-Ting Lu, Po-Chun Lee, Chih-Hsiang Hsu
  • Patent number: 12183781
    Abstract: The power semiconductor device comprises a base that includes a substrate and an epitaxial layer located above the substrate, with the base comprising a unit area and a peripheral area surrounding the unit area. A junction layer is located within the peripheral area and above the epitaxial layer. A barrier layer is located within the unit area and above the epitaxial layer. A first electrode is located on the junction layer and a second electrode is located on the barrier layer. The epitaxial layer includes a doped channel located within the peripheral area, extending between the junction layer and the base substrate. Current flows from the substrate through the doped channel and the junction layer to the first electrode.
    Type: Grant
    Filed: June 3, 2024
    Date of Patent: December 31, 2024
    Assignee: Diodes Incorporated
    Inventors: Chih-Hsiang Hsu, Tao Long, Pin-Hao Huang, Peng Chun Chen
  • Patent number: 12102171
    Abstract: A supporting member in a sole for an article of footwear including at least a vertical sub-member extending in both a vertical direction and a longitudinal direction that extends along a toe region to a heel region of the sole. Located within or adjacent to a cushioning member, the vertical sub-member has a curvature along the longitudinal direction wherein the curvature is configured to reduce flexion of the cushioning element and/or improve the durability of the supporting member. The supporting member further includes a horizontal sub-member extending from a sidewall of the vertical sub-member in a latitudinal direction of the sole and being angled away from the vertical sub-member and at least a portion of the vertical sub-member being coextensive with the vertical sub-member.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: October 1, 2024
    Inventors: Kurt Stockbridge, Anthony Dean, Chih Hsiang Hsu, Geoffrey Gray
  • Publication number: 20240146085
    Abstract: The present disclosure provides a battery charging system and method. The battery charging method includes: determining a degree of healthy of a battery module according to an evaluation mechanism; setting a charging standard according to the degree of healthy; by handshaking with a charger, setting a charging voltage for the charger according to the charging standard to charge the battery module; and by the charger, perform a charging operation on the battery module until a fully charged condition is satisfied.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 2, 2024
    Inventors: Tsung-Nan WU, Chih-Hsiang HSU, Wei-Cheng CHEN
  • Patent number: 11900150
    Abstract: A system and method for storing data associated with a system management interrupt (SMI) in a computer system. Notification of a system management interrupt is received on a central processing unit. The central processing unit enters a system management mode. A system management handler of a basic input output system (BIOS) is executed by a bootstrap processor of the central processing unit. The system management interrupt is initiated via the bootstrap processor. The system management interrupt data is stored in a register of the bootstrap processor. The SMI data is converted to an accessible format. The converted SMI data is stored in a memory.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: February 13, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chih-Hsiang Hsu, Wei-Wei Li, Shang-Lin Tsai, Lueh-Chih Fang
  • Publication number: 20230371647
    Abstract: A sole structure for articles of footwear and a method of manufacturing them comprising at least one polymeric foamed component expanded through supercritical fluid (SCF) expansion of a shaped pre-expanded polymeric material. The polymeric foamed component may include apertures situated and fashioned in the formation of the pre-expanded polymeric material to promote uniform expansion and optimal curing conditions during the SCF expansion process. At least one polymeric foamed component having one set of physical properties that may be bound to or assembled in conjunction with one or more sole components having the same or another set of physical properties.
    Type: Application
    Filed: August 4, 2023
    Publication date: November 23, 2023
    Applicant: Skechers U.S.A., Inc. II
    Inventors: Kurt Stockbridge, Chih Hsiang Hsu, Anthony Dean
  • Publication number: 20230205574
    Abstract: A system and method for storing data associated with a system management interrupt (SMI) in a computer system. Notification of a system management interrupt is received on a central processing unit. The central processing unit enters a system management mode. A system management handler of a basic input output system (BIOS) is executed by a bootstrap processor of the central processing unit. The system management interrupt is initiated via the bootstrap processor. The system management interrupt data is stored in a register of the bootstrap processor. The SMI data is converted to an accessible format. The converted SMI data is stored in a memory.
    Type: Application
    Filed: December 29, 2021
    Publication date: June 29, 2023
    Inventors: Chih-Hsiang HSU, Wei-Wei LI, Shang-Lin TSAI, Lueh-Chih FANG
  • Publication number: 20230138460
    Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).
    Type: Application
    Filed: December 27, 2022
    Publication date: May 4, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Che-Ting LIU, Jheng-Yu HONG, Yu-Ting LU, Po-Chun LEE, Chih-Hsiang HSU
  • Patent number: 11538787
    Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: December 27, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Che-Ting Liu, Jheng-Yu Hong, Yu-Ting Lu, Po-Chun Lee, Chih-Hsiang Hsu
  • Publication number: 20220139872
    Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).
    Type: Application
    Filed: October 30, 2020
    Publication date: May 5, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Che-Ting LIU, Jheng-Yu HONG, Yu-Ting LU, Po-Chun LEE, Chih-Hsiang HSU
  • Patent number: 11300466
    Abstract: A pressure gauge includes a case with a dial, and a pressure detection unit is located in the case. The chassis plate including a first pivot unit, a second pivot unit, a first Bourdon Tube, a second Bourdon Tube, a first transmission unit, a second transmission unit and an entrance connected thereto. The first Bourdon Tube is connected to the first pivot unit by the first transmission unit, and the second Bourdon Tube is connected to the second pivot unit by the second transmission unit. The entrance communicates with the first and second Bourdon Tubes. The first and second pivot units extend through the dial so as to be connected with a first hand and a second hand respectively. The first and second hands respectively respond different pressure values for more accuracy.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: April 12, 2022
    Assignees: PORAUTO INDUSTRIAL CO., LTD., ACCUAIRE CORP.
    Inventor: Chih-Hsiang Hsu
  • Patent number: 11275638
    Abstract: A system and method that allows debugging data to be stored without slowing down initialization is disclosed. The system includes a processor, a firmware read only memory (ROM), and a first memory device coupled to the firmware ROM. The firmware ROM can be a BIOS ROM. The first memory device is configured to store debug information from the firmware ROM prior to running an operating system on the processor. Having the firmware ROM store the debug information on the first memory device allows debug information associated with the firmware to be easily accessible without needing a debug firmware or a cable to receive outputs of the debug firmware.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: March 15, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chun-Ping Huang, Kuo-Chun Liao, Chih-Hsiang Hsu
  • Publication number: 20210276034
    Abstract: The present invention discloses an aperture plate and an aerosol generator. The aperture plate is made by metal materials with a plurality of apertures. The aperture plate has a multi-layer structure, which comprises a substrate, a protective layer and/or at least one intermediate layer between the substrate and the protective layer. The intermediate layer is configured to enhance the adhesion between the substrate and the protective layer, so that it can increase the durability of the aperture plate. The aperture plate can be a dome-shaped, a flat-shaped or an irregular shape. The aperture plate of the present invention can optimize the volume and size of droplets under the vibration at certain frequency.
    Type: Application
    Filed: September 24, 2020
    Publication date: September 9, 2021
    Inventors: Chih-Hsien CHOU, Huan-Ping TENG, Chih-Hsiang HSU
  • Patent number: 11089420
    Abstract: Speech processing system includes a first sound receiving device, a second sound receiving device, a main controller, and an audio processor. First and second sound receiving devices are configured to generate a main voice signal or a secondary voice signal. A first sensing device in first sound receiving device and a second sensing device in second sound receiving device are configured to output a first sensing signal or a second sensing signal based on a sensing result. Main controller controls first sound receiving device to generate main voice signal and controls second sound receiving device to generate secondary voice signal when receiving first sensing signal. Main controller controls second sound receiving device to generate main voice signal and controls first sound receiving device to generate secondary voice signal when receiving second sensing signal. Audio processor is configured to process main and secondary voice signals into an output voice signal.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: August 10, 2021
    Assignee: Chicony Electronics Co., Ltd.
    Inventor: Chih-Hsiang Hsu
  • Publication number: 20210137213
    Abstract: A supporting member in a sole for an article of footwear comprising at least a vertical sub-member extending in both a vertical direction and a longitudinal direction that extends along a toe region to a heel region of the sole. Located within or adjacent to a cushioning member, the vertical sub-member has a curvature along the longitudinal direction wherein the curvature is configured to reduce flexion of the cushioning element and/or improve the durability of the supporting member. The supporting member further comprises a horizontal sub-member extending from a sidewall of the vertical sub-member in a latitudinal direction of the sole and being angled away from the vertical sub-member and at least a portion of the vertical sub-member being coextensive with the vertical sub-member.
    Type: Application
    Filed: January 4, 2021
    Publication date: May 13, 2021
    Inventors: Kurt Stockbridge, Anthony Dean, Chih Hsiang Hsu, Geoffrey Gray
  • Patent number: 10813627
    Abstract: An ultrasound system includes an ultrasound probe, N switch elements and a processing unit, wherein the N switch elements are electrically connected to the ultrasound probe, the processing unit is electrically connected to the ultrasound probe and the N switch elements, and N is a positive integer. The ultrasound probe transmits and receives an ultrasound signal by a scanning frequency. Each of the switch elements has a main output frequency. The processing unit converts the ultrasound signal into an ultrasound image. The processing unit determines whether a noise exists in the ultrasound image. When the processing unit determines that the noise exists in the ultrasound image, the processing unit adjusts the main output frequency of at least one of the N switch elements.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: October 27, 2020
    Assignee: Qisda Corporation
    Inventors: Chih-Hsiang Hsu, Chun-Chih Wang, Chia-En Chuang
  • Publication number: 20200314572
    Abstract: Speech processing system includes a first sound receiving device, a second sound receiving device, a main controller, and an audio processor. First and second sound receiving devices are configured to generate a main voice signal or a secondary voice signal. A first sensing device in first sound receiving device and a second sensing device in second sound receiving device are configured to output a first sensing signal or a second sensing signal based on a sensing result. Main controller controls first sound receiving device to generate main voice signal and controls second sound receiving device to generate secondary voice signal when receiving first sensing signal. Main controller controls second sound receiving device to generate main voice signal and controls first sound receiving device to generate secondary voice signal when receiving second sensing signal. Audio processor is configured to process main and secondary voice signals into an output voice signal.
    Type: Application
    Filed: August 5, 2019
    Publication date: October 1, 2020
    Inventor: Chih-Hsiang HSU
  • Publication number: 20200296503
    Abstract: A speaker device includes an external housing, a sound guide structure, and a speaker unit. The sound guide structure is located in the external housing and has a paraboloid. The speaker unit is located in the external housing and configured to sound towards the paraboloid. The paraboloid has a focus. The speaker unit has a sound emitting surface. The center of the sound emitting surface is substantially coincident with the focus.
    Type: Application
    Filed: August 20, 2019
    Publication date: September 17, 2020
    Inventors: Chih-Hsiang HSU, Ching-Chung CHEN
  • Publication number: 20200281314
    Abstract: A sole structure for articles of footwear and a method of manufacturing them comprising at least one polymeric foamed component expanded through supercritical fluid (SCF) expansion of a shaped pre-expanded polymeric material. The polymeric foamed component may include apertures situated and fashioned in the formation of the pre-expanded polymeric material to promote uniform expansion and optimal curing conditions during the SCF expansion process. At least one polymeric foamed component having one set of physical properties that may be bound to or assembled in conjunction with one or more sole components having the same or another set of physical properties.
    Type: Application
    Filed: November 5, 2019
    Publication date: September 10, 2020
    Inventors: Kurt Stockbridge, Chih Hsiang Hsu
  • Patent number: 10337937
    Abstract: A detection device for a digital torque adapter includes a case having an operation area and a display area located on the outside thereof. A torque strain axle extends through the case. A recess is defined in one end of the torque strain axle. A circuit board having a receiving unit and a setting unit is electrically connected to the operation area and the display area. The case has a torque strain gauge located on the outer surface of the torque strain axle. An angle sensor is located in the case and detects the angle of the case and the torque strain axle relative to a horizontal plane. An accumulator is electrically connected to the circuit board and accumulates the angle detected by the angle sensor of each time that the wrench rotates, until the sum meets a pre-set value of angle of the setting unit.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: July 2, 2019
    Inventor: Chih-Hsiang Hsu