Abstract: An IC device includes first through third rows of fin field-effect transistors (FinFETs), wherein the second row is between and adjacent to each of the first and third rows, the FinFETs of the first row are one of an n-type or p-type, the FinFETs of the second and third rows are the other of the n-type or p-type, the FinFETs of the first and third rows include a first total number of fins, and the FinFETs of the second row include a second total number of fins one greater or fewer than the first total number of fins.

Abstract: Charging scheduling systems and methods for electric buses for use in at least one electric bus and a cloud management module are provided. First, a current location of the electric bus is obtained by a positioning unit of the electric bus and a current power state of a battery module of the electric bus is detected by a battery detection unit of the electric bus. A route corresponding to the electric bus is obtained by the cloud management module, wherein the route includes at least one charging point, and records a location of the charging point and a charging efficiency of at least one charging equipment installed at the charging point. Then, the cloud management module determines whether the electric bus needs to be charged with the charging equipment at the charging point according to the current location and the current power state of the electric bus.

Abstract: Charging scheduling systems and methods for electric buses for use in at least one electric bus and a cloud management module are provided. First, a current location of the electric bus is obtained by a positioning unit of the electric bus and a current power state of a battery module of the electric bus is detected by a battery detection unit of the electric bus. A route corresponding to the electric bus is obtained by the cloud management module, wherein the route includes at least one charging point, and records a location of the charging point and a charging efficiency of at least one charging equipment installed at the charging point. Then, the cloud management module determines whether the electric bus needs to be charged with the charging equipment at the charging point according to the current location and the current power state of the electric bus.

Abstract: An apparatus includes a package and a beam former circuit. The package may be configured to be mounted on an antenna array at a center of four antenna elements. The beam former circuit may (i) be disposed in the package, (ii) have a plurality of ports, (iii) be configured to generate a plurality of radio-frequency signals in the ports while in a transmit mode and (iv) be configured to receive the radio-frequency signals at the ports while in a receive mode. A plurality of ground bumps may be disposed between the beam former circuit and the package. The ground bumps may be positioned to bracket each port. Each ground bump may be electrically connected to a signal ground to create a radio-frequency shielding between neighboring ports.

Abstract: An apparatus comprises a phased array antenna panel, a plurality of amplifier circuits, and a plurality of beamformer circuits. The phased array antenna panel generally comprises a plurality of antenna elements. Each of the amplifier circuits is mounted on the phased array antenna panel adjacent to a respective one of the plurality of antenna elements and each of the amplifier circuits has one or more first ports directly coupled to the respective antenna element. Each of the beamformer circuits is mounted on the phased array antenna panel adjacent to a number of the amplifier circuits. Each of the beamformer circuits has one or more second ports directly coupled to each of the adjacent amplifier circuits. Each of the beamformer circuits is generally configured to exchange a plurality of radio-frequency signals with each of the adjacent amplifier circuits via the second ports.

Abstract: An apparatus include a package and a beam former circuit. The package may be configured to be mounted on an antenna array at a center of four antenna elements. The beam former circuit may (i) be disposed in the package, (ii) have a plurality of ports, (iii) be configured to generate a plurality of radio-frequency signals in the ports while in a transmit mode and (iv) be configured to receive the radio-frequency signals at the ports while in a receive mode. A plurality of ground bumps may be disposed between the beam former circuit and the package. The ground bumps may be positioned to bracket each port. Each ground bump may be electrically connected to a signal ground to create a radio-frequency shielding between neighboring ports.

Abstract: Disclosed is a wireless power transfer apparatus that includes a case for an electronic device. The case may have an electrically conductive panel portion and side portions defined along sides of the panel portion. The case further have at least one opening formed one of the side portions. A coil configured to couple to an externally generated magnetic field may have first segments that span a width of the panel portion of the case and second segments arranged along the side portions of the case and exposed through the at least one opening.

Abstract: Disclosed is a wireless power transfer apparatus that includes a case for an electronic device. The case may have an electrically conductive panel portion and side portions defined along sides of the panel portion. The case further have at least one opening formed one of the side portions. A coil configured to couple to an externally generated magnetic field may have first segments that span a width of the panel portion of the case and second segments arranged along the side portions of the case and exposed through the at least one opening.

Abstract: A biosignal measurement module is provided and includes a biosignal measurement unit, a pose detection unit, and a processing unit. The biosignal measurement unit measures an electrocardiogram signal and a pulse signal of a subject. The pose detection unit detects a position of the biosignal measurement module and outputs position signals. The processing unit receives the electrocardiogram signal, the pulse signal, and the position signals. The processing unit generates a height variation parameter, which indicates the height difference between the position of the biosignal measurement module and a reference position, according to the position signals. The processing unit calculates a current pulse transit time according to the electrocardiogram signal and the pulse signal and compensates for the current pulse transit time according to the height variation parameter to obtain a compensated pulse transit time. The processing unit obtains a blood pressure signal according to the compensated pulse transit time.

Abstract: A biosignal measurement module is provided and includes a biosignal measurement unit, a pose detection unit, and a processing unit. The biosignal measurement unit measures an electrocardiogram signal and a pulse signal of a subject. The pose detection unit detects a position of the biosignal measurement module and outputs position signals. The processing unit receives the electrocardiogram signal, the pulse signal, and the position signals. The processing unit generates a height variation parameter, which indicates the height difference between the position of the biosignal measurement module and a reference position, according to the position signals. The processing unit calculates a current pulse transit time according to the electrocardiogram signal and the pulse signal and compensates for the current pulse transit time according to the height variation parameter to obtain a compensated pulse transit time. The processing unit obtains a blood pressure signal according to the compensated pulse transit time.

Abstract: A fiber waveguide optical subassembly uses the multi-mode fiber to increase the alignment tolerance between the active optical element and the waveguide. The filter is thinner to lower the dispersion due to the optical coupling gap. The subassembly further combines the optical bench to achieve passive positioning. Therefore it reduces the cost and enhances the transmission rate.

Abstract: A canted-fiber duplex optical subassembly is disclosed herein. The optical subassembly transmits and receives optical signals by way of a single optical fiber, which has a canted surface on one end. A light source sends transmission optical signals, which are refracted through the canted surface and then enter the optical fiber. Reception optical signals in the optical fiber are reflected by the canted surface and are then received by an optical detector.

Abstract: A parallel optical subassembly module structure comprises an opto-electronic device array, a base with a reflecting slope, and a micro-lens array plate with an inclined plane provided with a specific angle. The optical signal emitted from the opto-electronic device array reflects by the reflecting slope and is incident into the inclined plane of the micro-lens array plate with the specific angle. The inclined plane rectifies the optical signal to output in horizontal direction. Then the optical signal couples with the external fibers through each micro lens of the micro-lens array. The pathway of receiving the optical signal is the same as described above, but in reverse direction.

Abstract: A fiber waveguide optical subassembly uses the multi-mode fiber to increase the alignment tolerance between the active optical element and the waveguide. The filter is thinner to lower the dispersion due to the optical coupling gap. The subassembly further combines the optical bench to achieve passive positioning. Therefore it reduces the cost and enhances the transmission rate.

Abstract: A parallel optical subassembly module structure comprises an opto-electronic device array, a base with a reflecting slope, and a micro-lens array plate with an inclined plane provided with a specific angle. The optical signal emitted from the opto-electronic device array reflects by the reflecting slope and is incident into the inclined plane of the micro-lens array plate with the specific angle. The inclined plane rectifies the optical signal to output in horizontal direction. Then the optical signal couples with the external fibers through each micro lens of the micro-lens array. The pathway of receiving the optical signal is the same as described above, but in reverse direction.

Abstract: A flexible electronic/optical interconnection film assembly which includes a flexible waveguide film laminated to a flexible electrical film, such as a flexible PCB. The flexible waveguide film has embedded internal waveguide capable of total internal reflection such that optical transmission between two IC elements can be achieved through the use of laser diode transmitters and photodetector receivers. A flexible electrical film that is laminated to the flexible waveguide film may have a plurality of metal interconnect lines formed therein for providing electrical communication. A thin metal trace layer and a plurality of conductive pads which are formed from the thin metal trace layer may be formed on top of the flexible waveguide film for providing electrical communication with active opto-electronic devices mounted on top of the flexible waveguide film.

Abstract: An optoelectronic transceiver that has integrated optical and electronic components, and can be passively aligned by a flip-chip method and a mechanical method is provided. The optoelectronic transceiver can be constructed by the key components of a circuit board, a silicon sub-mount, at least two IC chips formed on a silicon sub-mount, a microlens array, an optical fiber, and a receptacle for housing the silicon sub-mount, the at least two IC chips, the microlens array and the optical fiber connector in an aligned configuration. The at least two IC chips preferably include a laser diode, a laser diode driver, a photodetector and a photodetector amplifier. The mechanical alignment between a microlens array and a silicon sub-mount is performed by indentations provided in the surfaces of the two parts and the placement of spacer balls in the indentations.