Patents by Inventor Chih-Hsiang LIANG

Chih-Hsiang LIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961951
    Abstract: A light emitting diode device includes a substrate, a conductive via, first and second conductive pads, a driving chip, a flat layer, a redistribution layer, a light emitting diode, and an encapsulating layer. The substrate has a first surface and a second surface opposite thereto. The conductive via penetrates from the first surface to the second surface. The first and second conductive pads are respectively disposed on the first and second surface and in contact with the conductive via. The driving chip is disposed on the first surface. The flat layer is disposed over the first surface and covers the driving chip and the first conductive pad. The redistribution layer is disposed on the flat layer and electrically connects to the driving chip. The light emitting diode is flip-chip bonded to the redistribution layer. The encapsulating layer covers the redistribution layer and the light emitting diode.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: April 16, 2024
    Assignee: Lextar Electronics Corporation
    Inventors: Chih-Hao Lin, Jian-Chin Liang, Shih-Lun Lai, Jo-Hsiang Chen
  • Patent number: 11949056
    Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, micro light emitting elements, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting elements are disposed on the first adhesive layer and have a first surface facing to the first adhesive layer and an opposing second surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting elements and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A thickness of the flexible substrate is less than 100 um.
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: April 2, 2024
    Assignee: Lextar Electronics Corporation
    Inventors: Chih-Hao Lin, Jo-Hsiang Chen, Shih-Lun Lai, Min-Che Tsai, Jian-Chin Liang
  • Publication number: 20240058936
    Abstract: A control device of a power tool includes a trigger mounting bracket, a control circuit board, a control trigger, and a direction-switching button. The control circuit board is disposed on the trigger mounting bracket and has a 3D Hall sensor. The control trigger has a first magnet and is disposed on the trigger mounting bracket to approach or move away from the 3D Hall sensor along a first axis. The direction-switching button has a second magnet and is disposed on the trigger mounting bracket to approach or move away from the 3D Hall sensor along a second axis. By detecting a variation of a magnetic field generated by different magnets in the first axis and the second axis when approaching or moving away from the 3D Hall sensor through the 3D Hall sensor, the power tool could be controlled to activate and switch directions.
    Type: Application
    Filed: August 9, 2023
    Publication date: February 22, 2024
    Applicant: MOBILETRON ELECTRONICS CO., LTD.
    Inventor: CHIH-HSIANG LIANG
  • Publication number: 20230060196
    Abstract: The present application relates to a composite material and a method for molding the same. Firstly, components to be pressed is disposed in a gas-isolation element, and located between two pressing plates. Next, a plate is disposed based on a location of a prepreg element of the components, and then a hot pressing step is performed. After the hot pressing step, a cooling step is performed, thereby producing the composite material of the present application. A dimension of the composite material can be easily adjusted to meet requirements of various applications.
    Type: Application
    Filed: August 26, 2022
    Publication date: March 2, 2023
    Inventors: Chien-Hsu CHOU, Chih-Hsiang LIANG, Long-Tyan HWANG
  • Publication number: 20230044426
    Abstract: The present invention relates to carbon fiber composites and a method for producing the same. By reducing specific transition metal ions with a specific concentration, the method for producing the carbon fiber composites can form nanoparticles of a transition metal on an outer surface of a titanium dioxide layer encapsulating a carbon fiber to produce the carbon fiber composites. The nanoparticles of the transition metal directionally contact the titanium dioxide layer, so that the carbon fiber composites have synergistically photocatalytic activity.
    Type: Application
    Filed: July 29, 2022
    Publication date: February 9, 2023
    Inventors: Yu-Cheng HSU, Tang-Chun KAO, Long-Tyan HWANG, Chih-Hsiang LIANG, Chien-Hsu CHOU, Yi-Chuan CHANG, Chih-Hsuan OU, Han-Chang WU
  • Publication number: 20220411992
    Abstract: A manufacturing method for an antibacterial fiber includes the following steps. A dipping step is performed to soak a conductive fiber in a solution, in which the solution includes an ionic compound, and the ionic compound includes a metal cation. An oxidation step is performed by using the conductive fiber as an anode, such that an antibacterial material produced by the solution is adhered to a surface of the conductive fiber, in which the antibacterial material includes a metal oxide.
    Type: Application
    Filed: June 29, 2022
    Publication date: December 29, 2022
    Applicant: FORMOSA PLASTICS CORPORATRION
    Inventors: Chih-Hsiang LIANG, Yu-Cheng HSU, Tang-Chun KAO, Chien-Hsu CHOU, Yi-Chuan CHANG, Chih-Hsuan OU, Han-Chang WU, Long-Tyan HWANG