Patents by Inventor Chih-Hsien Chien

Chih-Hsien Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11043151
    Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive selected from the group consisting of alumina, ceria, titania, zirconia, and combinations thereof, wherein the abrasive is surface-coated with a copolymer comprising a combination of sulfonic acid monomeric units and carboxylic acid monomeric units a combination of sulfonic acid monomeric units and phosphonic acid monomeric units, (b) an oxidizing agent, and (c) water, wherein the polishing composition has a pH of about 2 to about 5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate comprises tungsten or cobalt and silicon oxide.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: June 22, 2021
    Assignee: CMC Materials, Inc.
    Inventors: Ji Cui, Helin Huang, Kevin P. Dockery, Pankaj K. Singh, Hung-Tsung Huang, Chih-Hsien Chien
  • Publication number: 20200332150
    Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive comprising silica particles and alumina particles, wherein the alumina particles are surface-coated with an anionic polymer, and (b) water. The invention also provides a method of chemically mechanically polishing a substrate, especially a substrate comprising tungsten, silicon oxide, and nitride, with the polishing composition.
    Type: Application
    Filed: April 15, 2020
    Publication date: October 22, 2020
    Inventors: Chih-Hsien CHIEN, Lung-Tai LU, Hung-Tsung HUANG, Helin HUANG
  • Publication number: 20190100677
    Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive selected from the group consisting of alumina, ceria, titania, zirconia, and combinations thereof, wherein the abrasive is surface-coated with a copolymer comprising a combination of sulfonic acid monomeric units and carboxylic acid monomeric units a combination of sulfonic acid monomeric units and phosphonic acid monomeric units, (b) an oxidizing agent, and (c) water, wherein the polishing composition has a pH of about 2 to about 5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate comprises tungsten or cobalt and silicon oxide.
    Type: Application
    Filed: October 3, 2017
    Publication date: April 4, 2019
    Inventors: Ji CUI, Helin HUANG, Kevin P. DOCKERY, Pankaj K. SINGH, Hung-Tsung HUANG, Chih-Hsien CHIEN
  • Publication number: 20190085205
    Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) abrasive particles, b) a removal rate inhibitor selected from (I) a surfactant comprising a polyoxyalkylene functional group and a sulfonate functional group, (II) a surfactant comprising a polyoxyalkylene functional group and a sulfate functional group, (III) a first surfactant comprising a polyoxyalkylene functional group and a second surfactant comprising a sulfonate functional group, and (IV) a first surfactant comprising a polyoxyalkylene functional group and a second surfactant comprising a sulfate functional group, and (c) an aqueous carrier. The invention also provides a method of chemically-mechanically polishing a substrate comprising TiN and SiN with the inventive chemical-mechanical polishing composition.
    Type: Application
    Filed: September 15, 2017
    Publication date: March 21, 2019
    Inventors: Chih-Hsien CHIEN, Yi-Hong CHIU, Hung-Tsung HUANG, Ming-Chih YEH
  • Patent number: 8648250
    Abstract: A multi-stack semiconductor device comprises: a substrate; a first conductive layer, a first group of the semiconductor material layers and a second group of the semiconductor material layers. The first conductive layer is formed on the substrate scribed by laser on the bottom of the first conductive layer to form a plurality of the first scribe lines. The first group of the semiconductor material layers is formed on the first conductive layer, and the second group of the semiconductor material layers is formed on the first group of the semiconductor material layers. The first group of the semiconductor material layers and the second group of the semiconductor material layers are simultaneously scribed by laser on bottom of the first group of the semiconductor material layers to form a plurality of the second scribe lines. Each second scribe line is comprised of a plurality of the second pores.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: February 11, 2014
    Assignee: Sun Well Solar Corporation
    Inventors: Chang-Shiang Yang, Ke-Hsuan Liu, Chih-hsien Chien
  • Publication number: 20120056306
    Abstract: A multi-stack semiconductor device comprises: a substrate; a first conductive layer, a first group of the semiconductor material layers and a second group of the semiconductor material layers. The first conductive layer is formed on the substrate scribed by laser on the bottom of the first conductive layer to form a plurality of the first scribe lines. The first group of the semiconductor material layers is formed on the first conductive layer, and the second group of the semiconductor material layers is formed on the first group of the semiconductor material layers. The first group of the semiconductor material layers and the second group of the semiconductor material layers are simultaneously scribed by laser on bottom of the first group of the semiconductor material layers to form a plurality of the second scribe lines. Each second scribe line is comprised of a plurality of the second pores.
    Type: Application
    Filed: September 2, 2011
    Publication date: March 8, 2012
    Inventors: Chang-Shiang YANG, Ke-Hsuan Liu, Chih-hsien Chien
  • Patent number: 7040524
    Abstract: An automatic packaging method of optical elements includes a focusing platform set, a Z-axis feeder set and an automatic feeding set. The Z-axis feeder set is provided above the focusing platform set. An automatic feeding set is arranged on a horizontal plane between the Z-axis feeder set and the focusing platform set by an appropriate distance. An upper part and a lower part of an optical element are supported by the lower end of the Z-axis feeder set and the upper end of the focusing platform set, respectively. The lower end of the Z-axis feeder set is adjusted vertically and horizontally with respect to the focusing platform set such that the upper part and the lower part are arranged in a line and coincide with each other. Afterward, by using the automatic feeding set, the upper part and the lower part of the optical element are bound together via the solders.
    Type: Grant
    Filed: December 29, 2003
    Date of Patent: May 9, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Hsien Chien, Shean-Son Chiou, Chin-Yi Tsai, Sung-Ho Liu, Wen-Peng Tseng
  • Publication number: 20050139638
    Abstract: An automatic packaging method of optical elements includes a focusing platform set, a Z-axis feeder set and an automatic feeding set. The Z-axis feeder set is provided above the focusing platform set. An automatic feeding set is arranged on a horizontal plane between the Z-axis feeder set and the focusing platform set by an appropriate distance. An upper part and a lower part of an optical element are supported by the lower end of the Z-axis feeder set and the upper end of the focusing platform set, respectively. The lower end of the Z-axis feeder set is adjusted vertically and horizontally with respect to the focusing platform set such that the upper part and the lower part are arranged in a line and coincide with each other. Afterward, by using the automatic feeding set, the upper part and the lower part of the optical element are bound together via the solders.
    Type: Application
    Filed: December 29, 2003
    Publication date: June 30, 2005
    Inventors: Chih-Hsien Chien, Shean-Son Chiou, Chin-Yi Tsai, Sung-Ho Liu, Wen-Peng Tseng
  • Patent number: 6478571
    Abstract: A clamping apparatus of an injection molding machine includes a servo motor installed at the center of the rear platen and two timing belts to drive two ball screws so as to push a five point inwardly bending toggle mechanism to open the mold, close the mold and mold clamping. Moreover, a servo motor is fixed to the lateral side of the movable platen to drive the nuts of the screw to rotate so as to push the ball screw, ejector rod and ejector plate to move linearly for achieving the object of ejecting. An electromotive motor on the rear platen will drive the mold adjusting means. By the assisting of the servo motor on the rear platen, the function and object of automatic mold adjusting can be achieved rapidly.
    Type: Grant
    Filed: April 6, 2000
    Date of Patent: November 12, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Kun-Lung Tsai, Jih-Jong Hsu, Chih-Hsien Chien
  • Patent number: 6403911
    Abstract: A wire cutting discharging machining device and the method thereof are disclosed. The method includes the steps of feeding a wire to be machined to a plurality of guide blocks; detecting one end of the wire and positioning the end; driving the plurality of guide blocks and a parallel device which is connected to the plurality of guide blocks and is operated synchronously so as to vertically guide the wire to an upper guide; and feeding the wire continuously to a workpiece, and a lower guide to a drawing roller. When in the process of machining, if a wire is broken abruptly or a machining path is to be updated, then a wire end detecting device, a wire cutting means, a wire end clamping device and a wire pressing device are used to achieve the object of wire modification.
    Type: Grant
    Filed: September 22, 2000
    Date of Patent: June 11, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Huie-Jan Shih, Jih-Jong Hsu, Chih-Hsien Chien, Jui-Fang Liang, Yea-June Day
  • Patent number: 6320537
    Abstract: A beam forming network having a division network for a hexagonal structure of elements, where the neighboring elements in the same column, having the same primary polarization, have three-way power division. The neighboring elements in adjacent columns, having a different primary polarization, have four-way power division. In the combining network, seven signals are combined from outputs of elements having the same polarization. Three of the signals will come from adjacent elements in the same column, and four signals will come from feeds in adjacent columns that are diagonal to the center element. The overlapping element configuration covers a large geographical area with reduced interference between neighboring elements. A waveguide implementation of the beam-forming network of the present invention is provided in which waveguides are structures so as to avoid crossovers, thereby eliminating interference and simplifying construction and assembly techniques.
    Type: Grant
    Filed: February 8, 2000
    Date of Patent: November 20, 2001
    Assignee: Hughes Electronics Corporation
    Inventors: Chih-Hsien Chien, Dale A. Londre, Kevin L. Sutton