Patents by Inventor Chih-Hsien Sun
Chih-Hsien Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7866373Abstract: A heat pipe includes a metal casing (10) filled with a working fluid therein, a capillary wick (20) provided inside of the metal casing and a tube (30) contacting with a surface of the capillary wick. The metal casing includes an evaporating section (40), a condensing section (60) and an adiabatic section (50) between the evaporating section and the condensing section. A vapor passage (70) is formed inside of the casing and a liquid channel (80) is defined by the capillary wick. The working fluid in vapor state flows from the evaporating section towards the condensing section along the vapor passage and the working fluid in liquid state returns to the evaporating section from the condensing section along the liquid channel. The tube separates the vapor from the liquid at a place where the tube is located.Type: GrantFiled: July 19, 2006Date of Patent: January 11, 2011Assignee: Foxconn Technology Co., Ltd.Inventors: Chuen-Shu Hou, Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun
-
Patent number: 7866374Abstract: A heat pipe includes a cylinder-shaped casing (100) containing a working fluid therein and a capillary wick (200) arranged on an inner wall of the casing. The capillary wick encloses a vapor passage (300) in a center of the casing. The capillary wick includes a plurality of shaped foils stacked on the inner wall of the casing along a radial direction thereof. The foils are sintered to the inner wall of the casing and define a multi-channel structure for the working fluid to flow from a condensing section to an evaporating section of the heat pipe.Type: GrantFiled: August 2, 2006Date of Patent: January 11, 2011Assignee: Foxconn Technology Co., Ltd.Inventors: Chuen-Shu Hou, Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun
-
Patent number: 7674037Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe to be tested. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.Type: GrantFiled: July 27, 2006Date of Patent: March 9, 2010Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun, Chuen-Shu Hou, Cheng-Hui Lin
-
Patent number: 7665508Abstract: A heat pipe includes a pipe containing phase changeable working media therein. A wick structure is located on an inner face of the pipe. A space is surrounded by the wick structure in the pipe. At least one muzzle with an inlet and an outlet is positioned inside the pipe; the inlet and the outlet are deferent in radius thereof.Type: GrantFiled: July 20, 2006Date of Patent: February 23, 2010Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hsien Sun
-
Patent number: 7637655Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion and slideably receives the movable portion therein for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.Type: GrantFiled: July 19, 2006Date of Patent: December 29, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou
-
Patent number: 7632009Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion for detecting temperature of the heat pipe.Type: GrantFiled: July 20, 2006Date of Patent: December 15, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hsien Sun
-
Patent number: 7594749Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion to detect a temperature of the heat pipe.Type: GrantFiled: July 14, 2006Date of Patent: September 29, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hsien Sun, Hui-Fu Lee
-
Patent number: 7594537Abstract: A heat pipe includes a casing (100) containing a working fluid therein and a capillary wick (200) arranged on an inner wall of the casing. The casing includes an evaporating section (400) at one end thereof and a condensing section (600) at an opposite end thereof, and a central section (500) located between the evaporating section and the condensing section. The thickness of the capillary wick formed at the evaporating section is smaller than that of the capillary wick formed at the central section in a radial direction of the casing. The capillary wick is capable of reducing thermal resistance between the working fluid and the casing.Type: GrantFiled: July 19, 2006Date of Patent: September 29, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Chuen-Shu Hou, Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun
-
Patent number: 7572033Abstract: An exemplary light source module includes a printed circuit board (PCB), a heat-dissipating assembly, and a number of light emitting elements. The PCB includes a first surface, an opposite second surface, and a number of through holes. The heat-dissipating assembly is located adjacent to the second surface and includes a base, a number of heat-conducting elements, and a number of heat dissipation fins. The base includes a third surface defining a number of cavities therein and an opposite fourth surface. The heat dissipation fins extend from the fourth surface. Each of the heat-conducting elements is inlaid in a corresponding cavity. Each of the light emitting elements is placed in a corresponding through hole and thermally contacts a corresponding heat-conducting element. Each light emitting element electrically connects with the PCB and defines a respective light emitting surface located outside the corresponding through hole.Type: GrantFiled: September 18, 2007Date of Patent: August 11, 2009Assignee: Foxsemicon Integrated Technology, Inc.Inventors: Chih-Hsien Sun, Cheng-Wei Chang
-
Patent number: 7553073Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement of the movable portion relative to the immovable portion.Type: GrantFiled: August 3, 2006Date of Patent: June 30, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hsien Sun
-
Patent number: 7553074Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion and slideably receives the movable portion therein for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement the movable portion relative to the immovable portion.Type: GrantFiled: August 3, 2006Date of Patent: June 30, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou
-
Patent number: 7553072Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.Type: GrantFiled: July 13, 2006Date of Patent: June 30, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun, Chuen-Shu Hou, Cheng-Chi Lee
-
Patent number: 7547138Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A positioning structure extends from at least one of the immovable portion and the movable portion to ensure that the receiving structure is capable of precisely receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.Type: GrantFiled: July 26, 2006Date of Patent: June 16, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun, Chuen-Shu Hou
-
Patent number: 7547139Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.Type: GrantFiled: July 27, 2006Date of Patent: June 16, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hsien Sun, Hui-Fu Lee
-
Patent number: 7537380Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe. A positioning structure extends from at least one of the immovable portion and the movable portion to ensure that the receiving structure is capable of precisely receiving the heat pipe therein. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.Type: GrantFiled: July 27, 2006Date of Patent: May 26, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou, Keng-Han Liu
-
Patent number: 7537379Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. A positioning structure extends from at least one of the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for detecting temperature of the heat pipe.Type: GrantFiled: July 14, 2006Date of Patent: May 26, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou, Keng-Han Liu
-
Patent number: 7530734Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe needing to be tested. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion. The least a temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.Type: GrantFiled: April 5, 2006Date of Patent: May 12, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou
-
Patent number: 7530735Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.Type: GrantFiled: July 7, 2006Date of Patent: May 12, 2009Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou, Jing-Hao Li
-
Patent number: 7527426Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for ensuring the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein to provide a thermally stable environment for the heat pipe during test.Type: GrantFiled: July 26, 2006Date of Patent: May 5, 2009Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou
-
Patent number: 7520315Abstract: A heat pipe includes a casing (100) containing a working fluid therein and a capillary wick (200) arranged in an inner wall of the casing. The casing includes an evaporating section (400) at one end thereof and a condensing section (600) at an opposite end thereof, and a central section (500) located between the evaporating section and the condensing section. The thickness of the capillary wick formed at the condensing section is smaller than that of the capillary wick formed at the central section in a radial direction of the casing. The capillary wick is capable of reducing the thermal resistance between the working fluid and the casing at the condensing section.Type: GrantFiled: July 19, 2006Date of Patent: April 21, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Chuen-Shu Hou, Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun