Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.

Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.

Abstract: A surge protecting circuit is provided. A first stage filter circuit is connected to an alternating current (AC) source. A surge detection driver circuit is connected to a first stage filter circuit. A first snubber circuit is connected to the AC source. A first terminal of a first power switch is connected to the first snubber circuit. A control terminal of the first power switch is connected to the surge detection driver circuit. A first terminal of a second power switch is connected to a second snubber circuit. A second terminal of the second power switch is connected to an output terminal of the surge protecting circuit. A control terminal of the second power switch is connected to the surge detection driver circuit. A multi-stage filter circuit is connected to a second terminal of the first power switch and the second snubber circuit.

Abstract: The invention provides a stacked structure comprising a master circuit board and at least two slave circuit boards. The master circuit board comprises a plurality of connecting seats. Each slave circuit board is equipped with a connector, and defined with a plurality of post-production process areas. Wherein the connector of each slave circuit board is disposed on one of post-production process areas, and inserted into the corresponding connecting seat. When the connector of the slave circuit board must be through other slave circuit boards in order to insert the corresponding connecting seat, the post-production process areas that are disposed on other slave circuit boards and impede the connection between the connector and the corresponding connecting seat will be cut into hollow areas. Accordingly, the connector of the slave circuit board is capable of inserting the corresponding connecting seat through the hollow areas of other slave circuit boards.

Abstract: The invention provides a stacked structure comprising a master circuit board and at least two slave circuit boards. The master circuit board comprises a plurality of connecting seats. Each slave circuit board is equipped with a connector, and defined with a plurality of post-production process areas. Wherein the connector of each slave circuit board is disposed on one of post-production process areas, and inserted into the corresponding connecting seat. When the connector of the slave circuit board must be through other slave circuit boards in order to insert the corresponding connecting seat, the post-production process areas that are disposed on other slave circuit boards and impede the connection between the connector and the corresponding connecting seat will be cut into hollow areas. Accordingly, the connector of the slave circuit board is capable of inserting the corresponding connecting seat through the hollow areas of other slave circuit boards.

Abstract: A wafer defines a plurality of chips arranged in array manner. Each chip includes at least one aluminum pad and a middle material. The middle material covers the aluminum pad and is mounted on the aluminum pad.

Abstract: A paper feeding apparatus includes a fluid-supply device, a connecting pipe communicating with the fluid-supply device, and a plurality of force units connecting to the connecting pipe, each force unit having a pressing wheel on one end thereof, wherein each pressing wheel operates in coordination with a paper feeding wheel for feeding paper. The force units output equal force according to the same hydraulic pressure so that the pressing wheels provide the same component force to the corresponding paper feeding wheel so as to improve the quality of paper feeding. Furthermore, a method for using the paper feeding apparatus is disclosed.

Abstract: A wafer defines a plurality of chips arranged in array manner. Each chip includes at least one aluminum pad and a middle material. The middle material covers the aluminum pad and is mounted on the aluminum pad.

Abstract: A paper feeding apparatus comprises a fluid-supply device; a connecting pipe communicating with the fluid-supply device; and a plurality of force units connecting to the connecting pipe, each force unit having a pressing wheel on one end thereof; wherein each pressing wheel operates in coordination with a paper feeding wheel for feeding paper. The force units output equal force according to the same hydraulic pressure so that the pressing wheels provide the same component force to the corresponding paper feeding wheel so as to improve the quality of paper feeding. Furthermore, a method for using the paper feeding apparatus is disclosed.

Abstract: A wafer structure with a buffer layer is provided. The wafer structure comprises a wafer which has at least one pad formed thereon, a passivation layer formed on the wafer for partially exposing the at least one pad, a buffer layer formed on the passivation layer and the pad, and an under bump metallurgy (UBM) formed on the buffer layer. The buffer layer comprises a thickness-increased inner buffering member made from aluminum and located between the UBM and the pad to enhance the shock-absorbing ability of the wafer in a drop test to avoid the conductive bump bonded to a substrate coming off or cracking. The invention can also enhance the bonding between the conductive bump and the UBM. The buffer layer may further comprise an outer buffering member made of polyimide, coated on the passivation layer and partially arranged between the UBM and the passivation layer.

Abstract: A method for removing residual flux applied to a wafer process is disclosed by the present invention, the method comprises the steps of: providing a wafer; forming a plurality of bumps on the surface of the wafer; coating flux on the surfaces of the bumps; reflowing the bumps; immersing the wafer in a cleaning solvent; cleaning the wafer by a plasma descum cleaning; rinsing the wafer; and drying the wafer.

Abstract: A method and system for preventing white pixel difficulties resulting from undesired current induced in an image sensor having a photodiode and a depletion region therein. The photodiode is isolated in a pixel layout for an image sensor. A depletion region is configured, such that the depletion region is maintained in a defect-free region associated with the pixel layout for the image sensor, thereby reducing white pixel difficulties caused by induced and undesired current. The image sensor is preferably a CMOS image sensor. A depletion region of the photodiode is constantly maintained in a defect-free region during operation of the CMOS image sensor.

Abstract: A golf ball dispensing device is disclosed. The device body includes an elevating device, a ball seat and a railing device. The ball seat, corresponding to the end side of the railing device, is mounted to the elevating device, allowing up and down movement. When the ball seat moves upward, golf ball is loaded and when the ball seat moves downward, golf ball is placed onto the ball seat from the railing device. The elevating device, the railing device are respectively mounted with a plurality of sensors and motor. The dispensing device can automatically provide golf balls ready for practicing.

Abstract: A solid tire includes an annular tire body having opposite left and right side faces and a ground contacting face interconnecting the left and right side faces. Each of the left and right side faces is formed with a plurality of axially extending blind bores. Each of the blind bores has an open end, a closed end opposite to the open end, a reduced section extending inwardly from the open end, and an enlarged section extending from the reduced section to the closed end. The enlarged section of each of the blind bores reduces gradually in cross-section toward the reduced section and the closed end.

Abstract: A method and system for preventing white pixel difficulties resulting from undesired current induced in an image sensor having a photodiode and a depletion region therein. The photodiode is isolated in a pixel layout for an image sensor. A depletion region is configured, such that the depletion region is maintained in a defect-free region associated with the pixel layout for the image sensor, thereby reducing white pixel difficulties caused by induced and undesired current. The image sensor is preferably a CMOS image sensor. A depletion region of the photodiode is constantly maintained in a defect-free region during operation of the CMOS image sensor.