Abstract: A method for switching a power mode of a computer device is adapted to a computer accessory. The method comprises setting a power management mode of the computer device to be awakened when connected to the external power; connecting the computer accessory to a host connector of the computer device to establish a power connection and a communication connection through a host signal pin set of the host connector; through the power connection and the communication connection, detecting and determining the power mode of the computer device; and executing one of following steps upon receiving the switch signal: when the power mode is the normal operation state, transmitting a communication signal; when the power mode is the Suspend-To-RAM state, transmitting a wake up signal; and when the power mode is the Suspend-To-Disk state or the shutdown state, temporarily cutting off the external power and then restoring the external power.

Abstract: A semiconductor structure includes a semiconductor fin extending from a substrate, a source/drain (S/D) feature disposed over the semiconductor fin, a silicide layer disposed over the S/D feature, where the silicide layer extends along a sidewall of the S/D feature, and an etch-stop layer (ESL) disposed along a sidewall of the silicide layer.

Abstract: The present disclosure relates to an integrated circuit. In one implementation, the integrated circuit may include a semiconductor substrate; at least one source region comprising a first doped semiconductor material; at least one drain region comprising a second doped semiconductor material; at least one gate formed between the at least one source region and the at least one drain region; and a nanosheet formed between the semiconductor substrate and the at least one gate. The nanosheet may be configured as a routing channel for the at least one gate and may have a first region having a first width and a second region having a second width. The first width may be smaller than the second width.

Abstract: A semiconductor device includes a substrate, a gate stack, and epitaxy structures. The substrate has a P-type region. The gate stack is over the P-type region of the substrate and includes a gate dielectric layer, a bottom work function (WF) metal layer, a top WF metal layer, and a filling metal. The bottom WF metal layer is over the gate dielectric layer. The top WF metal layer is over and in contact with the bottom WF metal layer. Dipoles are formed between the top WF metal layer and the bottom WF metal layer, and the dipoles direct from the bottom WF metal layer to the top WF metal layer. The filling metal is over the top WF metal layer. The epitaxy structures are over the P-type region of the substrate and on opposite sides of the gate stack.

Abstract: A semiconductor device includes a substrate, a gate stack, and an epitaxy structure. The gate stack over the substrate and includes a gate dielectric layer, a bottom work function (WF) metal layer, a top WF metal layer, and a filling metal. The bottom WF metal layer is over the gate dielectric layer. The top WF metal layer is over and in contact with the bottom WF metal layer. At least one of the top and bottom WF metal layers includes dopants, and the top WF metal layer is thicker than the bottom WF metal layer. The filling metal is over the top WF metal layer. The epitaxy structure is over the substrate and adjacent the gate stack.

Abstract: A semiconductor device includes a substrate, a gate stack, and an epitaxy structure. The gate stack over the substrate and includes a gate dielectric layer, a bottom work function (WF) metal layer, a top WF metal layer, and a filling metal. The bottom WF metal layer is over the gate dielectric layer. The top WF metal layer is over and in contact with the bottom WF metal layer. At least one of the top and bottom WF metal layers includes dopants, and the top WF metal layer is thicker than the bottom WF metal layer. The filling metal is over the top WF metal layer. The epitaxy structure is over the substrate and adjacent the gate stack.

Abstract: An apparatus comprises a first port, a second port, a battery, and a power control unit electrically connected to the battery, the first port and the second port. The power control unit is configured to, on the basis of an output from the battery: transmit a first power signal to the first port and transmit a second power signal to the second port; or transmit a third power signal received by the first port to the second port.

Abstract: The present invention illustrates an automatic focusing method. Firstly, through multiple cameras of an image capturing device, a scene is captured, such that multiple images generated corresponding to the cameras are obtained. Then, multiple depth maps are generated according to the images. Next, according to the resolutions of single one or multiple objects in the depth maps, the depth information of the single one or multiple objects in the depth maps can be selected to generate a merged depth map. Then, a target focus distance of the single one object or target focus distances of multiple objects are calculated according to the merged depth map. Next, an actual focus distance of the multi-lenses module associated with the cameras is adjusted according to the target focus distance of the single one object or one of the multiple objects.

Abstract: The disclosure relates to a multi-camera imaging system, and a compensation method for image reconstruction. The main components of the multi-camera imaging system are an image capturing module having a multi-lens module and a multi-sensor module, and a distance adjustment unit automatically adjusting the distance between the multi-lens and multi-sensor modules. Note that the distance adjustment unit conducts compensation performed on the change of the system's focal length caused by temperature in the system. The multi-camera imaging system further includes a position-sensing module which is used to sense a displacement or change of the distance made by the distance adjustment unit. A set of image reconstruction parameters corresponding to the displacement or the change of distance is then provided.

Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a substrate and an interfacial layer formed over the substrate. The semiconductor structure further includes a gate structure formed over the interfacial layer. In addition, the interfacial layer is made of metal germanium oxide, metal silicon oxide, or metal germanium silicon oxide and is in direct contact with a top surface of the substrate.

Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a substrate and an interfacial layer formed over the substrate. The semiconductor structure further includes a gate structure formed over the interfacial layer. In addition, the interfacial layer is made of metal germanium oxide, metal silicon oxide, or metal germanium silicon oxide and is in direct contact with a top surface of the substrate.

Abstract: The disclosure relates to a multi-camera imaging system, and a compensation method for image reconstruction. The main components of the multi-camera imaging system are an image capturing module having a multi-lens module and a multi-sensor module, and a distance adjustment unit automatically adjusting the distance between the multi-lens and multi-sensor modules. Note that the distance adjustment unit conducts compensation performed on the change of the system's focal length caused by temperature in the system. The multi-camera imaging system further includes a position-sensing module which is used to sense a displacement or change of the distance made by the distance adjustment unit. A set of image reconstruction parameters corresponding to the displacement or the change of distance is then provided.

Abstract: A power converting device includes a first substrate, a driving module, and a converting module. The first substrate is inserted into a main plate. The first substrate has a first axial direction and a second axial direction perpendicular to the first axial direction, the second axial direction is perpendicular to the main plate. The driving module is located at one side of the first substrate and electrically connected to the first substrate. The converting module is located at the other side of the first substrate and electrically connected to the driving module. A length of the converting module is substantially equal to a length of the first substrate in the first axial direction, and a width of the converting module is smaller than the length of the first substrate in the first axial direction.

Abstract: The present invention illustrates an automatic focusing method. Firstly, through multiple cameras of an image capturing device, a scene is captured, such that multiple images generated corresponding to the cameras are obtained. Then, multiple depth maps are generated according to the images. Next, according to the resolutions of single one or multiple objects in the depth maps, the depth information of the single one or multiple objects in the depth maps can be selected to generate a merged depth map. Then, a target focus distance of the single one object or target focus distances of multiple objects are calculated according to the merged depth map. Next, an actual focus distance of the multi-lenses module associated with the cameras is adjusted according to the target focus distance of the single one object or one of the multiple objects.

Abstract: A power converting device includes a first substrate, a driving module, and a converting module. The first substrate is inserted into a main plate. The first substrate has a first axial direction and a second axial direction perpendicular to the first axial direction, the second axial direction is perpendicular to the main plate. The driving module is located at one side of the first substrate and electrically connected to the first substrate. The converting module is located at the other side of the first substrate and electrically connected to the driving module. A length of the converting module is substantially equal to a length of the first substrate in the first axial direction, and a width of the converting module is smaller than the length of the first substrate in the first axial direction.

Abstract: A lens displacement mechanism using shaped memory alloy (SMA) applied to an auto-focusing lens module is disclosed. The lens displacement mechanism comprising at least one SMA wire. Two opposite ends of the SMA wire are fixed and a longitudinal mid-point of an intermediate movable portion between the two opposite ends is tightened and is fixed on a corresponding hook disposed on an outer edge of the lens so that the intermediate movable portion is tightened between the two opposite ends. When the SMA wire is heated, the intermediate movable portion contracts to pull the hook of the lens for driving the lens to move and slide along with an optical axis so as to achieve auto-focus control. The present lens displacement mechanism is simple in structure and reflow process. Therefore, the present displacement mechanism is suitable to be used in portable camera or mobile phone or PDA, which needs to be small and have easily mass production by SMT.

Abstract: A miniature stacked glass lens module is disclosed. The miniature stacked glass lens module includes at least one stacked optical glass lens element, a lens holder and other optical element. The stacked optical glass lens element is formed by cutting along alignment notches on a glued and stacked optical glass lens array. Then the stacked optical glass lens element and other optical element are mounted into the lens holder to form a miniature stacked glass lens module. Thereby the precise alignment of the optical axis of the lens in the lens module can be achieved. The manufacturing processes of the lens module can be simplified dramatically and the manufacturing cost is reduced significantly.

Abstract: An optical glass lens set and a manufacturing method thereof are disclosed. An optical glass lens is used as an insert that is set into a cavity of a mold. By injection molding of the molded insert or press molding, an optical glass lens set with a lens holder is formed. The optical glass lens set includes at least one optical glass lens and a lens holder for fixing the optical glass lens. The manufacturing method simplifies processes and improves the yield rate. Moreover, the produced optical glass lens set is easily packaged into a camera lens, especially suitable for mini-cameras and camera phones.

Abstract: A lens displacement mechanism using shaped memory alloy (SMA) applied to an auto-focusing lens module is disclosed. The lens displacement mechanism comprising at least one SMA wire. Two opposite ends of the SMA wire are fixed and a longitudinal mid-point of an intermediate movable portion between the two opposite ends is tightened and is fixed on a corresponding hook disposed on an outer edge of the lens so that the intermediate movable portion is tightened between the two opposite ends. When the SMA wire is heated, the intermediate movable portion contracts to pull the hook of the lens for driving the lens to move and slide along with an optical axis so as to achieve auto-focus control. The present lens displacement mechanism is simple in structure and reflow process. Therefore, the present displacement mechanism is suitable to be used in portable camera or mobile phone or PDA, which needs to be small and have easily mass production by SMT.

Abstract: A miniature stacked glass lens module is disclosed. The miniature stacked glass lens module includes at least one stacked optical glass lens element, a lens holder and other optical element. The stacked optical glass lens element is formed by cutting along alignment notches on a glued and stacked optical glass lens array. Then the stacked optical glass lens element and other optical element are mounted into the lens holder to form a miniature stacked glass lens module. Thereby the precise alignment of the optical axis of the lens in the lens module can be achieved. The manufacturing processes of the lens module can be simplified dramatically and the manufacturing cost is reduced significantly.