Abstract: The present subject matter relates to Nickel-free (Ni-free) sealing of anodized metal substrates. In an example mentation of the present subject matter, an anodized metal substrate is disposed with a first layer of a Ni-free sealing material over a surface of the anodized metal substrate. Further, a second layer of a second sealing material is disposed atop the first layer to sandwich the first layer of Ni-free sealing material between the surface of the anodized metal substrate and the second layer, to form a sealed metal substrate.

Abstract: The application discloses examples of a device housing of an electronic device including a magnesium-alloy substrate. The device housing further including a treatment layer applied over the magnesium-alloy substrate and a metallic coating layer applied over the treatment layer to provide a metallic luster. Further, a paint coating layer is disposed over a first portion of the metallic coating layer. Further, a top coating layer is applied over the paint coating layer and a visible second portion of the metallic coating layer.

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an aluminum or aluminum alloy cover frame having an opening. A magnesium or magnesium alloy cover panel supported by the aluminum or aluminum alloy cover frame within or over the opening. A protective coating can be over a surface of the aluminum or aluminum alloy cover frame and a surface of the magnesium or magnesium alloy cover panel. A chamfered edge can include a chamfer at an edge of the aluminum or aluminum alloy cover frame. The chamfer can expose the aluminum or aluminum alloy cover frame beneath the protective coating, and the chamfer at the same time does not expose the magnesium or magnesium alloy cover panel.

Abstract: Examples of an alloy injection molded liquid metal substrate are described. In an example, an alloy injection molded liquid metal substrate includes a liquid metal substrate and an alloy injection molded on a first surface of the liquid metal substrate.

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an aluminum or aluminum alloy cover frame having an opening. A magnesium or magnesium alloy cover panel supported by the aluminum or aluminum alloy cover frame within or over the opening. A protective coating can be over a surface of the aluminum or aluminum alloy cover frame and a surface of the magnesium or magnesium alloy cover panel. A chamfered edge can include a chamfer at an edge of the aluminum or aluminum alloy cover frame. The chamfer can expose the aluminum or aluminum alloy cover frame beneath the protective coating, and the chamfer at the same time does not expose the magnesium or magnesium alloy cover panel.

Abstract: The present subject matter relates to Nickel-free (Ni-free) sealing of anodized metal substrates. In an example mentation of the present subject matter, an anodized metal substrate is disposed with a first layer of a Ni-free sealing material over a surface of the anodized metal substrate. Further, a second layer of a second sealing material is disposed atop the first layer to sandwich the first layer of Ni-free sealing material between the surface of the anodized metal substrate and the second layer, to form a sealed metal substrate.

Abstract: The application discloses examples of a device housing of an electronic device comprising a magnesium-alloy substrate. The device housing further comprising a treatment layer applied over the magnesium-alloy substrate and a metallic coating layer applied over the treatment layer to provide a metallic luster. Further, a paint coating layer is disposed over a first portion of the metallic coating layer. Further, a top coating layer is applied over the paint coating layer and a visible second portion of the metallic coating layer.

Abstract: In example implementations, a hinge is provided. The hinge comprises a first hinge plate having at least one opening, where the first hinge plate is coupled to a system cover via at least one fastener fitted through the at least one opening. The hinge comprises a second hinge plate movably coupled to the first hinge plate, where the second hinge plate comprises a tab member that is coupled to a display cover via an insert molding process. The hinge comprises a hinge cap to enclose a portion of the first hinge plate and the second hinge plate that are movable coupled.

Abstract: In example implementations, a hinge is provided. The hinge comprises a first hinge plate having at least one opening, where the first hinge plate is coupled to a system cover via at least one fastener fitted through the at least one opening. The hinge comprises a second hinge plate movably coupled to the first hinge plate, where the second hinge plate comprises a tab member that is coupled to a display cover via an insert molding process. The hinge comprises a hinge cap to enclose a portion of the first hinge plate and the second hinge plate that are movable coupled.

Abstract: A hook shaft balance connection structure includes an operating element, a balance rod, and a connecting part. The operating element moves into a shell along the direction of the imposed force. The operating element includes a protrusion toward the direction of the force. The balance rod includes two axial parts and an eccentric part. The axial parts are on both ends of the balance rod, pivotally connected with the shell. The axes of them are on the same extension line. The eccentric part is disposed between the two axial parts, deviating from the axial parts by a predetermined distance. Its axis is parallel to those of the two axial parts. The eccentric part includes a first eccentric part in contact with the protrusion of the operating element and a second eccentric part by the first eccentric part. The connecting part includes a pushing part and two coupling parts. The pushing part is connected with the second eccentric part. The two coupling parts are connected to both ends of the connecting part.

Abstract: A hook shaft balance connection structure includes an operating element, a balance rod, and a connecting part. The operating element moves into a shell along the direction of the imposed force. The operating element includes a protrusion toward the direction of the force. The balance rod includes two axial parts and an eccentric part. The axial parts are on both ends of the balance rod, pivotally connected with the shell. The axes of them are on the same extension line. The eccentric part is disposed between the two axial parts, deviating from the axial parts by a predetermined distance. Its axis is parallel to those of the two axial parts. The eccentric part includes a first eccentric part in contact with the protrusion of the operating element and a second eccentric part by the first eccentric part. The connecting part includes a pushing part and two coupling parts. The pushing part is connected with the second eccentric part. The two coupling parts are connected to both ends of the connecting part.