Patents by Inventor CHIH-HSUA HSIEH

CHIH-HSUA HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TARGET STRUCTURE OF PHYSICAL VAPOR DEPOSITION
    Publication number: 20200347491
    Abstract: A sputtering target structure includes a body having a first side and an opposing second side. A first sputtering target is coupled to the first side of the body. The first sputtering target includes a first material. A second sputtering target is coupled to the second side of the body. The second sputtering target includes a second material. A rotation mechanism is coupled to the body and is configured to allow rotation of the body from a first orientation to a second orientation.
    Type: Application
    Filed: July 17, 2020
    Publication date: November 5, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ping-Yuan CHEN, Hung-Cheng CHEN, Chih-Hsua HSIEH, Yu-Hsuan WANG
  • Target structure of physical vapor deposition
    Patent number: 10718048
    Abstract: A sputtering target structure includes a body having a first side and an opposing second side. A first sputtering target is coupled to the first side of the body. The first sputtering target includes a first material. A second sputtering target is coupled to the second side of the body. The second sputtering target includes a second material. A rotation mechanism is coupled to the body and is configured to allow rotation of the body from a first orientation to a second orientation.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: July 21, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ping-Yuan Chen, Hung-Cheng Chen, Chih-Hsua Hsieh, Yu-Hsuan Wang
  • TARGET STRUCTURE OF PHYSICAL VAPOR DEPOSITION
    Publication number: 20190003037
    Abstract: A sputtering target structure includes a body having a first side and an opposing second side. A first sputtering target is coupled to the first side of the body. The first sputtering target includes a first material. A second sputtering target is coupled to the second side of the body. The second sputtering target includes a second material. A rotation mechanism is coupled to the body and is configured to allow rotation of the body from a first orientation to a second orientation.
    Type: Application
    Filed: January 29, 2018
    Publication date: January 3, 2019
    Inventors: Ping-Yuan CHEN, HUNG-CHENG CHEN, CHIH-HSUA HSIEH, YU-HSUAN WANG