Abstract: A device package includes a sensor die, one or more additional dies adjacent the sensor die, and a molding compound encircling the sensor die and the one or more additional dies. The device package further includes redistribution layers over the sensor die, the one or more additional dies, and the molding compound. The redistribution layers include first conductive features in a first dielectric layer. The first conductive features electrically connect the sensor die to the one or more additional dies. The redistribution layers further include an array of electrodes in a second dielectric layer over the first dielectric layer and electrically connected to the sensor die.

Abstract: A package structure includes a semiconductor device, a first molding compound, a through-via, a first dielectric layer, a first redistribution line, and a second molding compound. The first molding compound is in contact with a sidewall of the semiconductor device. The through-via is in the first molding compound and is electrically connected to the semiconductor device. The first dielectric layer is over the semiconductor device. The first redistribution line is in the first dielectric layer and is electrically connected to the semiconductor device and the through-via. The second molding compound is in contact with a sidewall of the first dielectric layer.

Abstract: A method of forming a package structure includes disposing a semiconductor device over a first dielectric layer, wherein a first redistribution line is in the first dielectric layer, forming a molding compound over the first dielectric layer and in contact with a sidewall of the semiconductor device, forming a second dielectric layer over the molding compound and the semiconductor device, forming a first opening in the second dielectric layer, the molding compound, and the first dielectric layer to expose the first redistribution line, and forming a first conductor in the first opening, wherein the first conductor is electrically connected to the first redistribution line.

Abstract: A device package includes a sensor die, one or more additional dies adjacent the sensor die, and a molding compound encircling the sensor die and the one or more additional dies. The device package further includes redistribution layers over the sensor die, the one or more additional dies, and the molding compound. The redistribution layers include first conductive features in a first dielectric layer. The first conductive features electrically connect the sensor die to the one or more additional dies. The redistribution layers further include an array of electrodes in a second dielectric layer over the first dielectric layer and electrically connected to the sensor die.

Abstract: A device package includes a sensor die, one or more additional dies adjacent the sensor die, and a molding compound encircling the sensor die and the one or more additional dies. The device package further includes redistribution layers over the sensor die, the one or more additional dies, and the molding compound. The redistribution layers include first conductive features in a first dielectric layer. The first conductive features electrically connect the sensor die to the one or more additional dies. The redistribution layers further include an array of electrodes in a second dielectric layer over the first dielectric layer and electrically connected to the sensor die.

Abstract: A device package includes a sensor die, one or more additional dies adjacent the sensor die, and a molding compound encircling the sensor die and the one or more additional dies. The device package further includes redistribution layers over the sensor die, the one or more additional dies, and the molding compound. The redistribution layers include first conductive features in a first dielectric layer. The first conductive features electrically connect the sensor die to the one or more additional dies. The redistribution layers further include an array of electrodes in a second dielectric layer over the first dielectric layer and electrically connected to the sensor die.

Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution layer, a second redistribution layer, and a plurality of through interlayer vias. The molded semiconductor device includes a die. The first redistribution layer is disposed on a first side of the molded semiconductor device. The second redistribution layer is disposed on a second side of the molded semiconductor device opposite to the first side, wherein the second redistribution layer includes a patterned metal layer having an interconnection circuit portion electrically connected to the die and a metal ring surrounding and insulated from the interconnection circuit portion. The through interlayer vias are located right under the metal ring and extending through the molded semiconductor device to be electrically connect the first redistribution layer and the second redistribution layer.