Patents by Inventor Chih-Hsuan TSAI

Chih-Hsuan TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088307
    Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Patent number: 11929318
    Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Publication number: 20240075082
    Abstract: Provided is a composition including a lactic acid bacterium and a carrier thereof for prophylaxis or treatment of an allergy. The lactic acid bacterium is Lactobacillus paragasseri, such as Lactobacillus paragasseri BBM171 deposited under DSMZ Accession No. DSM 34311. Also provided is a method for preventing or treating an allergy in a subject that includes administering an effective amount of the composition of Lactobacillus paragasseri to the subject.
    Type: Application
    Filed: August 24, 2023
    Publication date: March 7, 2024
    Inventors: Ying-Chieh Tsai, Yu-Hsuan Wei, Chih-Chieh Hsu, Chien-Chen Wu
  • Publication number: 20240071981
    Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.
    Type: Application
    Filed: November 1, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo-Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo, Yu-Chia Lai, Chih-Hsuan Tai
  • Publication number: 20230160892
    Abstract: Disclosed herein are recombinant viruses and/or insect cells suitable for detecting the infection of a pathogen in a biological sample of a test subject. The information derived from the detection may also be used to render a diagnosis on whether the test subject is infected with the pathogen or not, so that proper course of treatment may be assigned to the subject. Also disclosed herein is a vaccine for the prophylaxis and/or treatment of infection caused by said pathogen.
    Type: Application
    Filed: March 22, 2021
    Publication date: May 25, 2023
    Applicant: Academia Sinica
    Inventors: Yu-Chan CHAO, Sung-Chan WEI, Huei-Ru LO, Chih-Hsuan TSAI, Yu-Wen LO, Wei-Ting HSU, Chuan-Yu LIAO
  • Publication number: 20220267382
    Abstract: Provided is a chimeric hemagglutinin (HA) protein including an HA1 subunit and an HA2 subunit, in which the HA1 subunit is composed of a first domain derived from a parental HA1 subunit of a first subtype influenza virus and a second domain derived from a parental HA1 subunit of a second subtype influenza virus. The chimeric HA protein has improved thermal stability and can be used in a vaccine composition for preventing influenza virus infection. Also provided is a method of inducing an immune response against an influenza virus in a subject in need thereof that includes administering the chimeric HA protein to the subject, thereby conferring protection against the influenza virus infection on the subject.
    Type: Application
    Filed: September 18, 2020
    Publication date: August 25, 2022
    Applicant: ACADEMIA SINICA
    Inventors: Yu-Chan CHAO, Chih-Hsuan TSAI, Chia-Jung CHANG, Sung-Chan WEI, Lin-Li LIAO, Huei-Ru LO
  • Publication number: 20210371899
    Abstract: This disclosure provides a method and a kit for pesticide detection. By expressing acetylcholinesterases on cell surface, rapid pesticide screening, identification and quantification of pesticides or insecticides may be achieved.
    Type: Application
    Filed: October 17, 2019
    Publication date: December 2, 2021
    Applicant: ACADEMIA SINICA
    Inventors: Yu-Chan CHAO, Lin-Li LIAO, Chuan-yu LIAO, Chih-Hsuan TSAI, Paul Wei-che HSU