Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: The present invention provides a method for managing memory space in an electronic device including: selecting a candidate page from a first memory space for swapping the candidate page out of the first memory space into the second memory space; compressing the candidate page to obtain a first compressed page and a first hash value of the first compressed page; performing a comparison using the first hash value of the first compressed page and the hash values of the pages stored in a second memory space to find whether the pages have the same content as the first compressed page or the candidate page; and if a page is found to have the same content as the first compressed page or the candidate page, mapping a virtual address of the first compressed page or the candidate page to the found page.

Abstract: The present invention provides a method for managing memory space in an electronic device including: selecting a candidate page from a first memory space for swapping the candidate page out of the first memory space into the second memory space; compressing the candidate page to obtain a first compressed page and a first hash value of the first compressed page; performing a comparison using the first hash value of the first compressed page and the hash values of the pages stored in a second memory space to find whether the pages have the same content as the first compressed page or the candidate page; and if a page is found to have the same content as the first compressed page or the candidate page, mapping a virtual address of the first compressed page or the candidate page to the found page.

Abstract: Techniques and implementations pertaining to a heterogeneous swap space with dynamic thresholds are provided. A technique may provide a list of a plurality of swap areas in a heterogeneous swap space. The swap areas may include at least two swap areas that are different from each other in one or more characteristics. The technique may also compute a dynamic threshold associated with a page in need of swapping and determine a priority level of the page in need of swapping based on the dynamic threshold. The technique may further select one of the swap areas from the list of swap areas for the swapping of the page in response to a determination of the priority level of the page.