Abstract: A method for fabricating a carrier is disclosed, wherein the carrier is applied for a microelectromechanical sensing device. The method includes the steps of: providing a first substrate, wherein the first substrate includes a first metal layer, a first dielectric layer, and a first opening; providing a second substrate, wherein the second substrate includes a second metal layer, a second dielectric layer, and a second opening; providing a reticular element; pressing the first substrate, the reticular element, and the second substrate to form a composite substrate, wherein the first opening and the second opening form a hole, and the reticular element is positioned in the hole; and forming at least one conductive via in the composite substrate.