Patents by Inventor Chih-Hsun Hsu

Chih-Hsun Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11430733
    Abstract: A method includes capturing an image of a wafer, the wafer comprising a first conductive contact over an active region of the wafer and a second conductive contact over a shallow trench isolation (STI) region abutting the active region; identifying a brightness of a first contact region in the captured image at which the first conductive contact is rendered; identifying a brightness of a second contact region in the captured image at which the second conductive contact is rendered; and in response to the identified brightness of the first contact region in the captured image being substantially the same as the identified brightness of the second contact region in the captured image, determining that the second conductive contact is shorted to the first conductive contact.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: August 30, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yen-Hsung Ho, Chia-Yi Tseng, Chih-Hsun Lin, Kun-Tsang Chuang, Yung-Lung Hsu
  • Publication number: 20220209566
    Abstract: The present invention provides a method for controlling M power supplies connected in series. The method comprises the following steps. Sending a test signal by a master power supply. Recording a first delay time when the test signal is received by the 1st power supply and a second delay time when the test signal is received by the Mth power supply. Selecting a maximum delay time from the first delay time and the second delay time. Calculating a difference time between the first delay time and the second delay time. When the maximum delay time is the first delay time, the master power supply waits for the first delay time to execute the first command after receiving the first command. The 1st power supply directly executes the first command after receiving it. The Mth power supply waits for the difference time to execute the first command after receiving it.
    Type: Application
    Filed: December 30, 2021
    Publication date: June 30, 2022
    Inventors: Chih-Cherng LU, Te-Lung CHEN, Chia-Ching TING, Shih-Hsun HSU, Chen-Syuan WONG
  • Publication number: 20220173052
    Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.
    Type: Application
    Filed: January 28, 2021
    Publication date: June 2, 2022
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsun Hsu, Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Rui-Feng Tai, Don-Son Jiang
  • Publication number: 20220148975
    Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.
    Type: Application
    Filed: December 28, 2020
    Publication date: May 12, 2022
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin, Don-Son Jiang, Chih-Ming Huang, Yi-Hsin Chen
  • Publication number: 20220131561
    Abstract: A transmitter includes a pre-driver stage circuitry, a post-driver stage circuitry, and resistance adjustment circuits. The pre-driver stage circuitry is configured to output a second data signal according to a first data signal. The post-driver stage circuitry is configured to output a third data signal according to the second data signal. The resistance adjustment circuits are configured to provide a first variable resistor and a second variable resistor, and transmit a first power supply voltage and a second power supply voltage to at least one of the pre-driver stage circuitry or the post-driver stage circuitry, in order to adjust a slew rate of the third data signal.
    Type: Application
    Filed: September 3, 2021
    Publication date: April 28, 2022
    Inventor: CHIH-HSUN HSU
  • Publication number: 20220076924
    Abstract: A substrate processing system includes an upper chamber and a gas delivery system to supply a gas mixture to the upper chamber. An RF generator generates plasma in the upper chamber. A lower chamber includes a substrate support. A dual ion filter is arranged between the upper chamber and the lower chamber. The dual ion filter includes an upper filter including a first plurality of through holes configured to filter ions. A lower filter includes a second plurality of through holes configured to control plasma uniformity.
    Type: Application
    Filed: January 21, 2020
    Publication date: March 10, 2022
    Inventors: Andrew Stratton BRAVO, Chih-Hsun HSU, Serge KOSCHE, Stephen WHITTEN, Shih-Chung KON, Mark KAWAGUCHI, Himanshu CHOKSHI, Dan ZHANG, Gnanamani AMBUROSE
  • Publication number: 20210280530
    Abstract: Provided is an electronic package, including a multi-chip packaging body with a plurality of electronic elements and a stress buffer layer disposed on the multi-chip packaging body. The stress buffer layer is in contact with the plurality of electronic elements so as to cause stresses to be evenly distributed in the stress buffer layer instead of being concentrated in specific areas, thereby preventing structural stresses from being concentrated in corners of the electronic elements.
    Type: Application
    Filed: May 18, 2020
    Publication date: September 9, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chi-Jen Chen, Chih-Hsun Hsu, Chee-Key Chung, Jia-Wei Pan, Chang-Fu Lin
  • Patent number: 10790180
    Abstract: Electrostatic chucks with variable pixelated magnetic field are described. For example, an electrostatic chuck (ESC) includes a ceramic plate having a front surface and a back surface, the front surface for supporting a wafer or substrate. A base is coupled to the back surface of the ceramic plate. A plurality of electromagnets is disposed in the base, the plurality of electromagnets configured to provide pixelated magnetic field tuning capability for the ESC.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: September 29, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Chih-Hsun Hsu, Tza-Jing Gung, Benjamin Schwarz, Shahid Rauf, Ankur Agarwal, Vijay D. Parkhe, Michael D. Willwerth, Zhiqiang Guo
  • Patent number: 10574217
    Abstract: A transmitter circuit is provided in the present disclosure. The transmitter circuit includes a first capacitance, a first current pump circuit for charging or discharging the first capacitance to output a first voltage, a second capacitance, and a second current pump circuit for charging or discharging the second capacitance to output a second voltage. A charging rate at which the first current pump circuit charges the first capacitance or a discharging rate at which the first current pump circuit discharges the first capacitance determines a rising slew rate or a falling slew rate of the first voltage. A charging rate at which the second current pump circuit charges the second capacitance or a discharging rate at which the second current pump circuit discharges the second capacitance determines a rising slew rate or a falling slew rate of the second voltage.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: February 25, 2020
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Chih-Hsun Hsu, Chun-Hao Lai
  • Publication number: 20200013661
    Abstract: Electrostatic chucks with variable pixelated magnetic field are described. For example, an electrostatic chuck (ESC) includes a ceramic plate having a front surface and a back surface, the front surface for supporting a wafer or substrate. A base is coupled to the back surface of the ceramic plate. A plurality of electromagnets is disposed in the base, the plurality of electromagnets configured to provide pixelated magnetic field tuning capability for the ESC.
    Type: Application
    Filed: September 19, 2019
    Publication date: January 9, 2020
    Inventors: Chih-Hsun Hsu, Tza-Jing Gung, Benjamin Schwarz, Shahid Rauf, Ankur Agarwal, Vijay D. Parkhe, Michael D. Willwerth, Zhiqiang Guo
  • Patent number: 10460968
    Abstract: Electrostatic chucks with variable pixelated magnetic field are described. For example, an electrostatic chuck (ESC) includes a ceramic plate having a front surface and a back surface, the front surface for supporting a wafer or substrate. A base is coupled to the back surface of the ceramic plate. A plurality of electromagnets is disposed in the base, the plurality of electromagnets configured to provide pixelated magnetic field tuning capability for the ESC.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: October 29, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Chih-Hsun Hsu, Tza-Jing Gung, Benjamin Schwarz, Shahid Rauf, Ankur Agarwal, Vijay D. Parkhe, Michael D. Willwerth, Zhiqiang Guo
  • Publication number: 20190158076
    Abstract: A transmitter circuit is provided in the present disclosure. The transmitter circuit includes a first capacitance, a first current pump circuit for charging or discharging the first capacitance to output a first voltage, a second capacitance, and a second current pump circuit for charging or discharging the second capacitance to output a second voltage. A charging rate at which the first current pump circuit charges the first capacitance or a discharging rate at which the first current pump circuit discharges the first capacitance determines a rising slew rate or a falling slew rate of the first voltage. A charging rate at which the second current pump circuit charges the second capacitance or a discharging rate at which the second current pump circuit discharges the second capacitance determines a rising slew rate or a falling slew rate of the second voltage.
    Type: Application
    Filed: September 28, 2018
    Publication date: May 23, 2019
    Inventors: CHIH-HSUN HSU, CHUN-HAO LAI
  • Patent number: 9595452
    Abstract: A method for selectively etching silicon oxide is provided. A surface reaction phase is provided comprising flowing a surface reaction gas comprising hydrogen, nitrogen and fluorine containing components to form silicon oxide into a compound comprising silicon, hydrogen, nitrogen, and fluorine, forming the surface reaction gas into a plasma, and stopping the flow of the surface reaction gas. The surface is wet treated to remove the compound.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: March 14, 2017
    Assignee: Lam Research Corporation
    Inventors: Chih-Hsun Hsu, Meihua Shen, Thorsten Lill
  • Publication number: 20160351418
    Abstract: A method for selectively etching silicon oxide is provided. A surface reaction phase is provided comprising flowing a surface reaction gas comprising hydrogen, nitrogen and fluorine containing components to form silicon oxide into a compound comprising silicon, hydrogen, nitrogen, and fluorine, forming the surface reaction gas into a plasma, and stopping the flow of the surface reaction gas. The surface is wet treated to remove the compound.
    Type: Application
    Filed: May 27, 2015
    Publication date: December 1, 2016
    Inventors: Chih-Hsun HSU, Meihua SHEN, Thorsten LILL
  • Patent number: 9200378
    Abstract: The present invention is directed towards methods for growing diamond nanowires via chemical vapor deposition and apparatuses that incorporate these diamond nanowires.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: December 1, 2015
    Assignee: Brown University
    Inventors: Jingming Xu, Chih-Hsun Hsu, Sylvain Cloutier
  • Publication number: 20150221481
    Abstract: Electrostatic chucks with magnetic cathode liners for critical dimension (CD) tuning are described. For example, an electrostatic chuck (ESC) includes a cathode region. A wafer processing region is disposed above the cathode region. A magnetic cathode liner surrounds the cathode region, below the wafer processing region. The magnetic cathode liner is configured to provide magnetic field tuning capability for the ESC.
    Type: Application
    Filed: January 31, 2014
    Publication date: August 6, 2015
    Inventors: Michael D. Willwerth, Chih-Hsun Hsu, Valentin N. Todorow
  • Publication number: 20150155193
    Abstract: Electrostatic chucks with variable pixelated magnetic field are described. For example, an electrostatic chuck (ESC) includes a ceramic plate having a front surface and a back surface, the front surface for supporting a wafer or substrate. A base is coupled to the back surface of the ceramic plate. A plurality of electromagnets is disposed in the base, the plurality of electromagnets configured to provide pixelated magnetic field tuning capability for the ESC.
    Type: Application
    Filed: December 2, 2013
    Publication date: June 4, 2015
    Inventors: Chih-Hsun Hsu, Tza-Jing Gung, Benjamin Schwarz, Shahid Rauf, Ankur Agarwal, Vijay D. Parkhe, Michael D. Willwerth, Zhiqiang Guo
  • Patent number: 8044754
    Abstract: A transformer for reducing the electromagnetic interference (EMI) effect is disclosed. The transformer includes a bobbin; a magnetic core assembly partially sleeved by the bobbin; a first primary winding coiled around the bobbin; a secondary winding coiled on the first primary winding; and a first shielded element disposed between the first primary winding and the secondary winding for disconnecting the EMI transmission from the first primary winding to the secondary winding. The first primary winding includes a first winding portion and a second winding portion, and the first winding portion has larger EMI comparing to the second winding portion. The first winding portion of the first primary winding is adjacently disposed to the magnetic core assembly for shielding the EMI of the first primary winding by using the magnetic core assembly.
    Type: Grant
    Filed: September 3, 2009
    Date of Patent: October 25, 2011
    Assignee: Delta Electronics, Inc.
    Inventors: Jr-Hong Ouyang, Chih-Hsun Hsu, Jui-Ling Lin
  • Publication number: 20100060255
    Abstract: A transformer for reducing the electromagnetic interference (EMI) effect is disclosed. The transformer includes a bobbin; a magnetic core assembly partially sleeved by the bobbin; a first primary winding coiled around the bobbin; a secondary winding coiled on the first primary winding; and a first shielded element disposed between the first primary winding and the secondary winding for disconnecting the EMI transmission from the first primary winding to the secondary winding. The first primary winding includes a first winding portion and a second winding portion, and the first winding portion has larger EMI comparing to the second winding portion. The first winding portion of the first primary winding is adjacently disposed to the magnetic core assembly for shielding the EMI of the first primary winding by using the magnetic core assembly.
    Type: Application
    Filed: September 3, 2009
    Publication date: March 11, 2010
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Jr-Hong Ouyang, Chih-Hsun Hsu, Jui-Ling Lin