Abstract: Embodiments of mechanisms for testing a die package with multiple packaged dies on a package substrate use an interconnect substrate to provide electrical connections between dies and the package substrate and to provide probing structures (or pads). Testing structures, including daisy-chain structures, with metal lines to connect bonding structures connected to signals, power source, and/or grounding structures are connected to probing structures on the interconnect substrate. The testing structures enable determining the quality of bonding and/or functionalities of packaged dies bonded. After electrical testing is completed, the metal lines connecting the probing structures and the bonding structures are severed to allow proper function of devices in the die package. The mechanisms for forming test structures with probing pads on interconnect substrate and severing connecting metal lines after testing could reduce manufacturing cost.

Abstract: Embodiments of mechanisms for testing a die package with multiple packaged dies on a package substrate use an interconnect substrate to provide electrical connections between dies and the package substrate and to provide probing structures (or pads). Testing structures, including daisy-chain structures, with metal lines to connect bonding structures connected to signals, power source, and/or grounding structures are connected to probing structures on the interconnect substrate. The testing structures enable determining the quality of bonding and/or functionalities of packaged dies bonded. After electrical testing is completed, the metal lines connecting the probing structures and the bonding structures are severed to allow proper function of devices in the die package. The mechanisms for forming test structures with probing pads on interconnect substrate and severing connecting metal lines after testing could reduce manufacturing cost.

Abstract: A device includes a top package bonded to a bottom package. The bottom package includes a molding material, a device die molded in the molding material, a Through Assembly Via (TAV) penetrating through the molding material, and a redistribution line over the device die. The top package includes a discrete passive device packaged therein. The discrete passive device is electrically coupled to the redistribution line.

Abstract: A method includes placing a plurality of bottom units onto a jig, wherein the plurality of bottom units is not sawed apart and forms an integrated component. Each of the plurality of bottom units includes a package substrate and a die bonded to the package substrate. A plurality of upper component stacks is placed onto the plurality of bottom units, wherein solder balls are located between the plurality of upper component and the plurality of bottom units. A reflow is performed to join the plurality of upper component stacks with respective ones of the plurality of bottom units through the solder balls.

Abstract: A loudspeaker includes a circuit board, a base mounted on a rear side of the circuit board, a positioning apparatus slidably installed between the base and the circuit board, a sound-reflecting member positioned at a front side of the circuit board, a connecting member connected between the base and the sound-reflecting member, a sound generator, and a controller. The sound-reflecting member includes a sound-reflecting plate and a number of magnetic pieces around the sound-reflecting plate. Many first electromagnets are mounted on the front side of the circuit board, aligning with the magnetic pieces. The position apparatus includes a positioning bracket. The connecting member includes a rotating portion rotatably connected to the base. A second electromagnet is mounted to the circuit board, to move the positioning bracket. The controller controls one or more of the first electromagnets to attract the corresponding magnetic pieces, to allow the sound-reflecting member to swing.

Abstract: A loudspeaker includes a circuit board defining a receiving hole, a supporting bracket received in the receiving hole and mounted to the circuit board, a sound-reflecting member, a connecting plate, a sound generator mounted to the sound-reflecting member, and a controller. The supporting bracket includes a hemispherical receiving portion. The sound-reflecting member includes a sound-reflecting plate received in the receiving portion and a number of magnetic pieces extending out from a circumference of the sound-reflecting plate. A number of electromagnets are mounted on the circuit board, and face the magnetic pieces. The connecting plate is slidably engaged with an outer surface of the receiving portion and connected to the sound-reflecting member. The controller is coupled to the electromagnets. The controller controls the electromagnets to attract the magnetic pieces, to allow the sound-reflecting plate to swing.

Abstract: A loudspeaker includes a base, a sound-reflecting member located at a side of the base, a sound generator mounted to the sound-reflecting member, an adjusting member including a number of magnetic pieces and located at an opposite side of the base, a connecting member connected between the sound-reflecting member and the adjusting member, a supporting member, and a controlling apparatus. The supporting member includes a number of first electromagnets mounted to the magnetic pieces. The controlling apparatus is electrically coupled to the first electromagnets. The controlling apparatus controls the first electromagnets to attract the magnetic pieces, to allow the adjusting member to swing, and the adjusting member drives the connecting member to rotate, thereby swinging the sound-reflecting member.

Abstract: A loudspeaker includes a base, a sound-reflecting member located at a side of the base, a sound generator mounted to the sound-reflecting member, an adjusting member including a number of magnetic pieces and located at an opposite side of the base, a connecting member connected between the sound-reflecting member and the adjusting member, a supporting member, and a controlling apparatus. The supporting member includes a number of first electromagnets mounted to the magnetic pieces. The controlling apparatus is electrically coupled to the first electromagnets. The controlling apparatus controls the first electromagnets to attract the magnetic pieces, to allow the adjusting member to swing, and the adjusting member drives the connecting member to rotate, thereby swinging the sound-reflecting member.

Abstract: A discrete Through-Assembly Via (TAV) module includes a substrate, and vias extending from a surface of the substrate into the substrate. The TAV module is free from conductive features in contact with one end of each of the conductive vias.

Abstract: A component package and a method of forming are provided. A first component package may include a first semiconductor device having a pair of interposers attached thereto on opposing sides of the first semiconductor device. Each interposer may include conductive traces formed therein to provide electrical coupling to conductive features formed on the surfaces of the respective interposers. A plurality of through vias may provide for electrically connecting the interposers to one another. A first interposer may provide for electrical connections to a printed circuit board or subsequent semiconductor device. A second interposer may provide for electrical connections to a second semiconductor device and a second component package. The first and second component packages may be combined to form a Package-on-Package (“PoP”) structure.

Abstract: Methods and apparatus for package on package structures having stud bump through via interconnections. A structure includes an interconnect layer having a plurality of through via assemblies each including at least one stud bump are formed on conductive pads; and encapsulant surrounding the through via assembly, a first redistribution layer formed over a surface of the encapsulant and coupled to the through via assemblies and carrying connectors, and a second redistribution layer over interconnect layer at the other end of the through via assemblies, the through via assemblies extending vertically through the interconnect layer. In an embodiment the interconnect layer is mounted using the connectors to a lower package substrate to form a package on package structure. A first integrated circuit device may be mounted on the second redistribution layer of the interconnect layer. Methods for forming the interconnect layer and the package on package structures are disclosed.

Abstract: A device includes a top package bonded to a bottom package. The bottom package includes a molding material, a device die molded in the molding material, a Through Assembly Via (TAV) penetrating through the molding material, and a redistribution line over the device die. The top package includes a discrete passive device packaged therein. The discrete passive device is electrically coupled to the redistribution line.

Abstract: A fan module includes a cooling fan, a supporting rack, and a number of fasteners sandwiched between the cooling fan and the supporting rack. The fasteners are made of vibration-resistant material. The supporting rack includes two opposite supporting walls. An installing portion protrudes out from a top of each supporting plate. Each fastener is sandwiched between the cooling fan and the corresponding installing portion. An extension portion extends from each fastener to resist against an outside surface of the cooling fan.

Abstract: A discrete Through-Assembly Via (TAV) module includes a substrate, and vias extending from a surface of the substrate into the substrate. The TAV module is free from conductive features in contact with one end of each of the conductive vias.

Abstract: Methods and apparatus for package on package structures having stud bump through via interconnections. A structure includes an interconnect layer having a plurality of through via assemblies each including at least one stud bump are formed on conductive pads; and encapsulant surrounding the through via assembly, a first redistribution layer formed over a surface of the encapsulant and coupled to the through via assemblies and carrying connectors, and a second redistribution layer over interconnect layer at the other end of the through via assemblies, the through via assemblies extending vertically through the interconnect layer. In an embodiment the interconnect layer is mounted using the connectors to a lower package substrate to form a package on package structure. A first integrated circuit device may be mounted on the second redistribution layer of the interconnect layer. Methods for forming the interconnect layer and the package on package structures are disclosed.

Abstract: An integrated circuit structure includes a semiconductor chip having a first region and a second region; a dielectric layer formed on the first region and the second region of the semiconductor chip; a first elongated under-bump metallization (UBM) connector formed in the dielectric layer and on the first region of the semiconductor chip and having a first longer axis extending in a first direction; and a second elongated UBM connector formed in the dielectric layer on the second region of the semiconductor chip and having a second longer axis extending in a second direction. The first direction is different from the second direction.

Abstract: A fan module includes an aerofoil fan and an air duct. The aerofoil fan includes a shell defining a vent extending through two opposite ends of the shell and a fan rotatably received in the vent. The air duct is mounted on an end of the shell aligning with the vent. The air duct includes a tapered pipe and a number of latching plates mounted on the pipe. A smaller end of the pipe is located adjacent to the vent of the shell. One end of each latching plate is mounted to a bigger end of the pipe, and the other end of each latching plate is mounted to the shell.

Abstract: A fixing apparatus for fixing a hard disk drive includes a first frame, a second frame, and a latching device. The first frame includes a first mounting arm and a first connecting arm. The first mounting arm includes a number of fixing columns for inserting into fixing holes of the hard disk drive. The first connecting arm defines a hole. The first connection arm defines an elongated slot on an outer surface thereof, and the elongated slot defines an inclined slot beside the hole. The second frame includes a second mounting arm and a second connecting arm, which is slidably received in the elongated slot. The latching device is attached to the second frame and, includes a pressing member, which can slide along the inclined slot and insert into or withdraw from the hole. A spring is provided between the pressing member and the second connecting arm.

Abstract: A component package and a method of forming are provided. A first component package may include a first semiconductor device having a pair of interposers attached thereto on opposing sides of the first semiconductor device. Each interposer may include conductive traces formed therein to provide electrical coupling to conductive features formed on the surfaces of the respective interposers. A plurality of through vias may provide for electrically connecting the interposers to one another. A first interposer may provide for electrical connections to a printed circuit board or subsequent semiconductor device. A second interposer may provide for electrical connections to a second semiconductor device and a second component package. The first and second component packages may be combined to form a Package-on-Package (“PoP”) structure.

Abstract: Fan includes a hub, a mounting ring encircling the hub, a plurality of connection poles rotatably connected to the mounting ring, and a plurality of blades fastened to the connection poles. A center of lift of each blade is located between a lower end of the blade and the connection pole fastened to the blade.