Abstract: A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A conductive region is disposed in the polymer region and electrically coupled to the redistribution line. The conductive region includes a second flat top surface not higher than the first flat top surface.

Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: A flexible display device includes a TFT array substrate, a flexible printed circuit board, a front panel laminate, a first protection sheet having a through hole, and waterproof glue. The flexible printed circuit board is disposed on an edge of a first surface of the TFT array substrate, and extends outward from the edge of the first surface. The front panel laminate is located on the first surface of the TFT array substrate. The first protection sheet covers the front panel laminate, the first surface of the TFT array substrate, and the flexible printed circuit board. A portion of the flexible printed circuit board and a portion of the TFT array substrate are located in the through hole. The waterproof glue is located in the through hole and covers the portion of the flexible printed circuit board and the portion of the TFT array substrate.

Abstract: A flexible display device includes a TFT array substrate, a flexible printed circuit board, a front panel laminate, a first protection sheet having a through hole, and waterproof glue. The flexible printed circuit board is disposed on an edge of a first surface of the TFT array substrate, and extends outward from the edge of the first surface. The front panel laminate is located on the first surface of the TFT array substrate. The first protection sheet covers the front panel laminate, the first surface of the TFT array substrate, and the flexible printed circuit board. A portion of the flexible printed circuit board and a portion of the TFT array substrate are located in the through hole. The waterproof glue is located in the through hole and covers the portion of the flexible printed circuit board and the portion of the TFT array substrate.

Abstract: The invention discloses a curved display module and a display device. The curved display module includes an enclosure, at least one opening, a flexible display panel and an Optical Clear Adhesive (OCA) layer. There is a first curved surface inside the enclosure. A cavity is formed within the enclosure. The at least one opening are disposed on at least one edge of the enclosure and connected to the cavity. The flexible display panel is disposed on the first curved surface in the cavity. The OCA layer is disposed within the cavity. The OCA layer directly covers the flexible display panel.

Abstract: Disclosed herein is an LED backlight module, which includes a metallic plate, a metallic sidewall, a connecting portion, a light guide and an LED ribbon. The metallic sidewall is substantially perpendicular to the metallic plate and located beside a side edge of the metallic plate. The metallic side-plate has a lower edge extending downwards to a position beneath a lower surface of the metallic plate. The connecting portion extends in a direction towards the side edge of the metallic plate from the lower edge of the metallic sidewall, and is further connected to the side edge of the metallic plate. The light guide is disposed above the metallic plate, and the LED ribbon for emitting a light into the light guide is disposed on the metallic sidewall.

Abstract: Disclosed herein is an LED backlight module, which includes a metallic plate, a metallic sidewall, a connecting portion, a light guide and an LED ribbon. The metallic sidewall is substantially perpendicular to the metallic plate and located beside a side edge of the metallic plate. The metallic side-plate has a lower edge extending downwards to a position beneath a lower surface of the metallic plate. The connecting portion extends in a direction towards the side edge of the metallic plate from the lower edge of the metallic sidewall, and is further connected to the side edge of the metallic plate. The light guide is disposed above the metallic plate, and the LED ribbon for emitting a light into the light guide is disposed on the metallic sidewall.

Abstract: The invention discloses a curved display module and a display device. The curved display module includes an enclosure, at least one opening, a flexible display panel and an Optical Clear Adhesive (OCA) layer. There is a first curved surface inside the enclosure. A cavity is formed within the enclosure. The at least one opening are disposed on at least one edge of the enclosure and connected to the cavity. The flexible display panel is disposed on the first curved surface in the cavity. The OCA layer is disposed within the cavity. The OCA layer directly covers the flexible display panel.

Abstract: A backlight module includes a light guide plate and a flexible illuminating bar. The light guide plate has a light emitting top surface and a plurality of light incident side surfaces. Each of the light incident side surfaces is connected to the light emitting top surface. The flexible illuminating bar includes a circuit board module and a plurality of point light sources. The circuit board module includes a plurality of circuit boards and at least one flexible electrical connection member. The circuit boards are disposed at the light incident side surfaces, respectively. The flexible electrical connection member electrically connects two of the circuit boards and is bendingly disposed between corresponding two of the circuit boards. The point light sources are electrically disposed on the circuit boards and suitable for emitting light towards the light incident side surfaces. In addition, another backlight module is also provided.

Abstract: A backlight module includes a light guide plate and a flexible illuminating bar. The light guide plate has a light emitting top surface and a plurality of light incident side surfaces. Each of the light incident side surfaces is connected to the light emitting top surface. The flexible illuminating bar includes a circuit board module and a plurality of point light sources. The circuit board module includes a plurality of circuit boards and at least one flexible electrical connection member. The circuit boards are disposed at the light incident side surfaces, respectively. The flexible electrical connection member electrically connects two of the circuit boards and is bendingly disposed between the corresponding two of the circuit boards. The point light sources are electrically disposed on the circuit boards and suitable for emitting light towards the light incident side surfaces. In addition, another backlight module is also provided.