Patents by Inventor Chih-Hua Liu

Chih-Hua Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11107917
    Abstract: A high voltage semiconductor device includes a semiconductor substrate, a first doped well, a second doped well, a mixed doped well, and a gate structure. The first, the second, and the mixed doped wells are disposed in the semiconductor substrate. At least a part of the first doped well and at least a part of the second doped well are located at two opposites sides of the gate structure in a horizontal direction respectively. The mixed doped well are located between the first doped well and the second doped well. The first and the second doped well include a first conductivity type dopant and a second conductivity type dopant respectively. The mixed doped well includes a mixed dopant. A part of the mixed dopant is identical to the first conductivity type dopant, and another part of the mixed dopant is identical to the second conductivity type dopant.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: August 31, 2021
    Assignee: Realtek Semiconductor Corp.
    Inventors: I-Jhen Hsu, Chih-Hua Liu, Kai-Yi Huang, Ta-Hsun Yeh
  • Publication number: 20210083109
    Abstract: A high voltage semiconductor device includes a semiconductor substrate, a first doped well, a second doped well, a mixed doped well, and a gate structure. The first, the second, and the mixed doped wells are disposed in the semiconductor substrate. At least a part of the first doped well and at least a part of the second doped well are located at two opposites sides of the gate structure in a horizontal direction respectively. The mixed doped well are located between the first doped well and the second doped well. The first and the second doped well include a first conductivity type dopant and a second conductivity type dopant respectively. The mixed doped well includes a mixed dopant. A part of the mixed dopant is identical to the first conductivity type dopant, and another part of the mixed dopant is identical to the second conductivity type dopant.
    Type: Application
    Filed: January 16, 2020
    Publication date: March 18, 2021
    Inventors: I-Jhen Hsu, Chih-Hua Liu, Kai-Yi Huang, Ta-Hsun Yeh
  • Patent number: 10818429
    Abstract: An inductor device includes at least two wires and at least two switches. Each of the at least two wires includes an opening, and the openings are disposed correspondingly to each other. One of the at least two switches is coupled to two terminals of the opening of one of the at least two wires. Another one of the at least two switches is coupled to one terminal of the opening of the one of the at least two wires and one terminal of the opening of another one of the at least two wires in an interlaced manner. If the one of the at least two switches is turned on, one of the at least two wires forms an inductor; if another one of the at least two switches is turned on, both of the at least two wires form the inductor.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: October 27, 2020
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Chih-Hua Liu
  • Patent number: 10369827
    Abstract: A transfer film including a substrate, a protection layer, a metal coating layer, and an ink layer is provided. The substrate has a first surface and a second surface, and the first surface has a first stereoscopic pattern. The protection layer is disposed on the substrate, and has a third surface and a fourth surface. The third surface contacts the first surface, and has a second stereoscopic pattern complementing the first stereoscopic pattern. The fourth surface has a third stereoscopic pattern. The metal coating layer is disposed on the protection layer, and has a fifth surface contacting the fourth surface and a sixth surface. The ink layer is disposed on the metal coating layer. The protection layer and the substrate are separated after transfer to expose the second stereoscopic pattern and reflect out the third stereoscopic pattern. A manufacturing method of the transfer film is also provided.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: August 6, 2019
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Ju-Chen Chiu, Po-An Lin, Chih-Hua Liu
  • Publication number: 20190054750
    Abstract: A transfer film including a substrate, a protection layer, a metal coating layer, and an ink layer is provided. The substrate has a first surface and a second surface, and the first surface has a first stereoscopic pattern. The protection layer is disposed on the substrate, and has a third surface and a fourth surface. The third surface contacts the first surface, and has a second stereoscopic pattern complementing the first stereoscopic pattern. The fourth surface has a third stereoscopic pattern. The metal coating layer is disposed on the protection layer, and has a fifth surface contacting the fourth surface and a sixth surface. The ink layer is disposed on the metal coating layer. The protection layer and the substrate are separated after transfer to expose the second stereoscopic pattern and reflect out the third stereoscopic pattern. A manufacturing method of the transfer film is also provided.
    Type: Application
    Filed: October 11, 2017
    Publication date: February 21, 2019
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Ju-Chen Chiu, Po-An Lin, Chih-Hua Liu
  • Publication number: 20190035544
    Abstract: An inductor device includes at least two wires and at least two switches. Each of the at least two wires includes an opening, and the openings are disposed correspondingly to each other. One of the at least two switches is coupled to two terminals of the opening of one of the at least two wires. Another one of the at least two switches is coupled to one terminal of the opening of the one of the at least two wires and one terminal of the opening of another one of the at least two wires in an interlaced manner. If the one of the at least two switches is turned on, one of the at least two wires forms an inductor; if another one of the at least two switches is turned on, both of the at least two wires form the inductor.
    Type: Application
    Filed: January 11, 2018
    Publication date: January 31, 2019
    Inventors: Hsiao-Tsung YEN, Chih-Hua LIU
  • Publication number: 20180264873
    Abstract: A decorative film structure includes a foamed resin layer and a protective resin layer. The protective resin layer is disposed on the foamed resin layer and has a stereoscopic patterned surface relatively far from the foamed resin layer. A manufacturing method of the decorative film structure is also provided.
    Type: Application
    Filed: March 14, 2018
    Publication date: September 20, 2018
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Ju-Chen Chiu, Po-An Lin, Sheng-Hung Lee, Kuo-Nan Ling, Chih-Hua Liu
  • Patent number: 9242505
    Abstract: A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.
    Type: Grant
    Filed: November 24, 2011
    Date of Patent: January 26, 2016
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Wan-Li Chuang, Chien-Min Chang, Ju-Chen Chiu, Chih-Hua Liu, Tsung-Sheng Chuang
  • Patent number: 8911581
    Abstract: A composite light guide plate manufacturing method includes the steps of providing a light guide substrate; providing a transfer membrane, which sequentially includes a substrate, a reflective layer and a diffusion microstructure; attaching the transfer membrane to the light guide substrate with a side of the transfer membrane, which has the diffusion microstructure thereon; and removing the substrate to expose the reflective layer.
    Type: Grant
    Filed: June 11, 2013
    Date of Patent: December 16, 2014
    Assignee: Compal Electronics, Inc.
    Inventors: Ju-Chen Chiu, Chien-Min Chang, Po-An Lin, Chih-Hua Liu, Hao-Ying Chang
  • Publication number: 20140116607
    Abstract: A composite light guide plate manufacturing method includes the steps of providing a light guide substrate; providing a transfer membrane, which sequentially includes a substrate, a reflective layer and a diffusion microstructure; attaching the transfer membrane to the light guide substrate with a side of the transfer membrane, which has the diffusion microstructure thereon; and removing the substrate to expose the reflective layer.
    Type: Application
    Filed: June 11, 2013
    Publication date: May 1, 2014
    Inventors: Ju-Chen CHIU, Chien-Min CHANG, Po-An LIN, Chih-Hua LIU, Hao-Ying CHANG
  • Publication number: 20120070639
    Abstract: A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.
    Type: Application
    Filed: November 24, 2011
    Publication date: March 22, 2012
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Wan-Li Chuang, Chien-Min Chang, Ju-Chen Chiu, Chih-Hua Liu, Tsung-Sheng Chuang
  • Patent number: 6621915
    Abstract: The present invention disclosed a method and system inspecting cotton web homogeneity by a digital image processing technique, in particular, for an on-line cotton web homogeneity test. It uses optical principles in conjunction with a charge coupled device type camera to find a theoretical equation indicating the correlation between the transmittance of cotton webs and basic weights (weights per unit area). Next, the invention makes use of a numerical analysis method to find the optimal approximation equation representing a relationship between measured transmittance and basic weights of cotton webs. When executing an on-line inspection, a system according to the invention detects the transmittance of cotton webs by means of the computer controlled visual device and then calculates correlated data of cotton web homogeneity variations according to the approximation equation acquired previously.
    Type: Grant
    Filed: February 29, 2000
    Date of Patent: September 16, 2003
    Assignee: China Textile Institute
    Inventors: Hung-Jen Chen, Hsin-Chung Lien, Chih-Hua Liu, Ding-Kuo Huang