Abstract: A method includes forming a first waveguide over a substrate; forming a first layer of low-dimensional material on the first waveguide; forming a first layer of dielectric material over the first layer of low-dimensional material; forming a second layer of low dimensional material on the first layer of dielectric material; and forming a first conductive contact that electrically contacts the first layer of low-dimensional material and a second conductive contact that electrically contacts the second layer of low-dimensional material.

Abstract: A power dividing and combining device comprising a resonance body, a plurality of circuit boards, an upper cover and a lower cover is provided. The resonance body comprises a solid conductive body, a plurality of first dividing elements, a plurality of second dividing elements, a signal-receiving end and a signal-transmitting end. The solid conductive body has a first surface, a second surface opposite to the first surface, and a plurality of side surfaces connecting the first surface and the second surface. The first dividing elements are disposed on the first surface and separate a plurality of first resonance channels on the first surface. The first resonance channels intersect at a first common region on the first surface. The second dividing elements are disposed on the second surface and separate a plurality of second resonance channels on the second surface. The second resonance channels intersect at a second common region on the second surface.

Abstract: A semiconductor package includes a package substrate; semiconductor devices disposed on the package substrate; a package ring disposed on a perimeter of the package substrate surrounding the semiconductor devices; a cover including silicon bonded to the package ring and covering the semiconductor devices; and a thermal interface structure (TIS) thermally connecting the semiconductor devices to the cover.

Abstract: A semiconductor structure, comprising a redistribution layer (RDL) including a dielectric layer and a conductive trace within the dielectric layer; a first conductive member disposed over the RDL and electrically connected with the conductive trace; a second conductive member disposed over the RDL and electrically connected with the conductive trace; a first die disposed over the RDL; a second die disposed over the first die, the first conductive member and the second conductive member; and a connector disposed between the second die and the second conductive member to electrically connect the second die with the conductive trace, wherein the first conductive member is electrically isolated from the second die.

Abstract: A semiconductor structure includes a first tier, a redistribution circuit structure, and a second tier. The first tier includes at least one first die. The redistribution circuit structure is disposed on the first tier and electrically coupled to the at least one first die, where the redistribution circuit structure has a multi-layer structure and includes a vertical connection structure continuously extending from a first side of the redistribution circuit structure to a second side of the redistribution circuit structure, and the first side is opposite to the second side along a stacking direction of the first tier and the redistribution circuit structure. The second tier includes a plurality of second dies, and is disposed on and electrically coupled to the redistribution circuit structure.

Abstract: An electronic device includes a metal back cover, a metal frame, and a first, second, third, and fourth radiators. The metal frame includes a discrete part and two connection parts. The connection parts are located by two sides of the discrete part, separated from the discrete part, and connected to the metal back cover. A U-shaped slot is formed between the discrete part and the metal back cover and between the discrete part and the connection parts. The first radiator is separated from the discrete part and includes a feed end. The second, third, and fourth radiators are connected to the discrete part and the metal back cover. The third radiator is located between the first and second radiators. The first radiator is located between the third and fourth radiators. The discrete part and the first, second, third, and fourth radiators form an antenna module together.

Abstract: A method of fabricating a device involves forming a plurality of structures, such that each structure of the plurality includes a substrate and an epitaxial layer on the substrate. The epitaxial layer and the substrate have a lattice mismatch. The method further includes forming an electrical contact on the epitaxial layer of a selected structure of the plurality of structures and performing a current leakage measurement quality control test for the selected structure of the plurality of structures through the electrical contact. The method also involves forming a device on each of the remaining structures of the plurality of structures if the selected structure passed the leakage measurement quality control test or discarding each of the remaining structures of the plurality of structures if the selected structure did not pass the leakage measurement quality control test.

Abstract: Various embodiments of the present application are directed towards an integrated circuit (IC) including a first switching device, a second switching device, an inductor, and a controller. The inductor is electrically coupled to a first source/drain region of the first switching device and a first source/drain region of the second switching device at a node. The controller is configured to alternatingly change the first and second switching devices between a first state and a second state, respectively. The first switching device is in a third state before or after the second switching device transitions between the first and second states. A subthreshold voltage is applied to a first gate of the first switching device during the third state, such that the third state is between a cutoff mode and a triode mode of the first switching device.

Abstract: A manufacturing method of group III-V semiconductor package is provided. The manufacturing method includes the following steps. A wafer comprising group III-V semiconductor dies therein is provided. A chip probing (CP) process is performed to the wafer to determine reliabilities of the group III-V semiconductor dies, wherein the CP process comprises performing a multi-step breakdown voltage testing process to the group III-V semiconductor dies to obtain a first portion of dies of the group III-V semiconductor dies with breakdown voltages to be smaller than a predetermined breakdown voltage. A singulation process is performed to separate the group III-V semiconductor dies from the wafer. A package process is performed to form group III-V semiconductor packages including the group III-V semiconductor dies. A final testing process is performed on the group III-V semiconductor packages.

Abstract: Various embodiments of the present application are directed towards an integrated circuit (IC) including a first switching device, a second switching device, an inductor, and a controller. The inductor is electrically coupled to a first source/drain region of the first switching device and a first source/drain region of the second switching device at a node. The controller is configured to alternatingly change the first and second switching devices between a first state and a second state, respectively. The first switching device is in a third state before or after the second switching device transitions between the first and second states. A subthreshold voltage is applied to a first gate of the first switching device during the third state, such that the third state is between a cutoff mode and a triode mode of the first switching device.

Abstract: Various embodiments of the present application are directed towards a buck converter circuit including a controller circuit. In some embodiments, the buck converter circuit includes a first switching device, a second switching device, an inductor, and a controller. The inductor is electrically coupled to a node at which a source/drain terminal of the first switching device and a source/drain terminal of the second switching device are electrically coupled. The controller is configured to alternatingly change the first switching device between ON and OFF, and further configured to alternatingly change the second switching device between ON and OFF. The first switching device is OFF while the second switching device is ON. The first switching device is partially ON immediately before or after the second switching device transitions between ON and OFF.

Abstract: Various embodiments of the present application are directed towards a buck converter circuit including a controller circuit. In some embodiments, the buck converter circuit includes a first switching device, a second switching device, an inductor, and a controller. The inductor is electrically coupled to a node at which a source/drain terminal of the first switching device and a source/drain terminal of the second switching device are electrically coupled. The controller is configured to alternatingly change the first switching device between ON and OFF, and further configured to alternatingly change the second switching device between ON and OFF. The first switching device is OFF while the second switching device is ON. The first switching device is partially ON immediately before or after the second switching device transitions between ON and OFF.

Abstract: A handheld electronic device and a method and a computer-readable medium for controlling the same are provided. The handheld electronic device includes a controller configured to determine a tiling state of the handheld electronic device, and control the handheld electronic device to perform a function in response to a determination that the handheld electronic device is in a first state, thereafter changes to a second tiling state, wherein the tiling state is in the first tiling state only when the tiling angle of the handheld electronic device is within a first predetermined tiling angle range with respect to a reference point, the tilting state is in the second tiling state only when the tiling angle of the handheld electronic device is within a second predetermined tiling angle range with respect to the reference point, and the first and second predetermined tiling angle ranges do not overlap with each other.

Abstract: A controlling method and a controlling system for a handheld communication device are provided. In the present method, a tilting state of the handheld communication device is detected by using a G-sensor when a notice is activated. Then, whether the tilting state is changed from a face up state to a face down state is determined. The handheld communication device is controlled to perform a function when the tilting state is confirmed to be changed from the face up state to the face down state. Accordingly, the handheld communication device may be controlled to perform a function timely according to the positioned state of the device without going through complicated procedures, so as to provide a more intuitive and convenient way to control the handheld communication device.

Abstract: A medical atomizer includes a liquid storage container, a nozzle and an adjustable valve. The liquid storage container includes an air inlet, a fixed cover plate installed at the periphery of the air inlet, and a high pressure jet installed at the bottom of the liquid storage container. The nozzle is installed in the liquid storage container and covered onto the high pressure jet. The adjustable valve is interconnected to the air inlet and has a port selectively adjusted and moved to be covered by fixed cover plate. With the fixed cover plate of the air inlet, the air inlet can be selectively adjusted and moved to change the size of the port to be covered by the fixed cover plate, so as to adjust the flow of air entering into the air inlet.

Abstract: A serial surge suppression and overload protection optimization device has an input terminal, an output terminal and multiple surge suppression units. The surge suppression units are serially connected between the input terminal and the output terminal. Each surge suppression unit has two parallel inductors and multiple surge absorbing elements. Each surge absorbing element is connected to an output end of one of the parallel inductors and has a fuse serially connected therewith. When surge energy is excessively large, the fuse melts to separate the surge absorbing element from a main power loop without causing a short circuit within the main power loop due to the meltdown of the fuse. The optimization device is used with an automatic overload protection unit to normally supply power to equipment connected to the output terminal thereof and ensure electrical safety protection with a bypass circuit design thereof.

Abstract: A serial surge suppression and overload protection optimization device has an input terminal, an output terminal and multiple surge suppression units. The surge suppression units are serially connected between the input terminal and the output terminal. Each surge suppression unit has two parallel inductors and multiple surge absorbing elements. Each surge absorbing element is connected to an output end of one of the parallel inductors and has a fuse serially connected therewith. When surge energy is excessively large, the fuse melts to separate the surge absorbing element from a main power loop without causing a short circuit within the main power loop due to the meltdown of the fuse. The optimization device is used with an automatic overload protection unit to normally supply power to equipment connected to the output terminal thereof and ensure electrical safety protection with a bypass circuit design thereof.

Abstract: A serially connected surge suppression optimization device has an input terminal, an output terminal, a plurality of surge suppression units. The surge suppression units are serially mounted between the input terminal and the output terminal. Each surge suppression unit has at least one pair of parallel inductors and a plurality of surge absorption units respectively connected with one end of each of the pair of inductors. The pair of parallel inductors mounted in the surge suppression unit in a pre-stage and the surge suppression unit in a post-stage have different conductance values. Accordingly, the surge suppression optimization device connected in a path from which surges pass can significantly reduce energy of a surge flowing in and a residual surge voltage. The different conductance values of the surge suppression units in a pre-stage and a post-stage smoothen an intruding surge to secure better safety protection without abruptly generating a peak rise.

Abstract: A controlling method and a controlling system for a handheld communication device are provided. In the present method, a tilting state of the handheld communication device is detected by using a G-sensor when a notice is activated. Then, whether the tilting state is changed from a face up state to a face down state is determined. The handheld communication device is controlled to perform a function when the tilting state is confirmed to be changed from the face up state to the face down state. Accordingly, the handheld communication device may be controlled to perform a function timely according to the positioned state of the device without going through complicated procedures, so as to provide a more intuitive and convenient way to control the handheld communication device.

Abstract: A controlling method and a controlling system for a handheld communication device are provided. In the present method, a tilting state of the handheld communication device is detected by using a G-sensor when a notice is activated. Then, whether the tilting state is changed from a face up state to a face down state is determined. The handheld communication device is controlled to perform a function when the tilting state is confirmed to be changed from the face up state to the face down state. Accordingly, the handheld communication device may be controlled to perform a function timely according to the positioned state of the device without going through complicated procedures, so as to provide a more intuitive and convenient way to control the handheld communication device.