Abstract: A light-emitting element, comprises: a substrate; a light-emitting semiconductor stack over the substrate and comprising an active layer; and a Distributed Bragg reflective unit under the substrate comprising a first Distributed Bragg reflective structure under the substrate and comprising a first number of pairs of alternately stacked first sub-layers and second sub-layers, and a second Distributed Bragg reflective structure under the first Distributed Bragg reflective structure and comprising a second number of pairs of alternately stacked third sub-layers and fourth sub-layers, wherein the first number is different from the second number.

Abstract: A light-emitting element, comprises: a substrate; a light-emitting semiconductor stack over the substrate and comprising an active layer; and a Distributed Bragg reflective unit under the substrate comprising a first Distributed Bragg reflective structure under the substrate and comprising a first number of pairs of alternately stacked first sub-layers and second sub-layers, and a second Distributed Bragg reflective structure under the first Distributed Bragg reflective structure and comprising a second number of pairs of alternately stacked third sub-layers and fourth sub-layers, wherein the first number is different from the second number.

Abstract: A method for manufacturing a light-emitting device includes steps of: providing a light-emitting wafer including an upper surface and a lower surface opposite to the upper surface; setting a plurality of scribing streets on the upper surface of the light-emitting wafer; irradiating a laser beam to form a plurality of cutting regions along the scribing streets, wherein each of the plurality of cutting regions has a sharp end, or the plurality of cutting regions forms a specific pattern in a cross-sectional view; and forming a plurality of light-emitting devices by connecting the plurality of cutting regions and extending the plurality of cutting regions from the respective sharp ends thereof to the lower surface of the light-emitting wafer.

Abstract: A method for manufacturing a light-emitting device includes steps of: providing a light-emitting wafer including an upper surface and a lower surface opposite to the upper surface; setting a plurality of scribing streets on the upper surface of the light-emitting wafer; irradiating a laser beam to form a plurality of cutting regions along the scribing streets, wherein each of the plurality of cutting regions has a sharp end, or the plurality of cutting regions forms a specific pattern in a cross-sectional view; and forming a plurality of light-emitting devices by connecting the plurality of cutting regions and extending the plurality of cutting regions from the respective sharp ends thereof to the lower surface of the light-emitting wafer.