Abstract: A display panel including a circuit board, a plurality of bonding pads, a plurality of light emitting devices, and a plurality of solder patterns is provided. The bonding pads are disposed on the circuit board, and each includes a first metal layer and a second metal layer. The second metal layer is located between the first metal layer and the circuit board. The first metal layer includes an opening overlapping the second metal layer. A material of the first metal layer is different from a material of the second metal layer. The light emitting devices are electrically bonded to the bonding pads. Each of the solder patterns electrically connects one of the light emitting devices and one of the bonding pads. The solder patterns each contact the second metal layer through the opening of the first metal layer of one of the bonding pads to form a eutectic bonding.

Abstract: A memory structure including a substrate, a first doped region, a second doped region, a first gate, a second gate, a first charge storage structure, and a second charge storage structure is provided. The first gate is located on the first doped region. The second gate is located on the second doped region. The first charge storage structure is located between the first gate and the first doped region. The first charge storage structure includes a first tunneling dielectric layer, a first dielectric layer, and a first charge storage layer. The second charge storage structure is located between the second gate and the second doped region. The second charge storage structure includes a second tunneling dielectric layer, a second dielectric layer, and a second charge storage layer. The thickness of the second tunneling dielectric layer is greater than the thickness of the first tunneling dielectric layer.

Abstract: A structure and a formation method of a semiconductor device are provided. The method includes forming a first semiconductor fin and a second semiconductor fin over a semiconductor substrate. The second semiconductor fin is wider than the first semiconductor fin. The method also includes forming a gate stack over the semiconductor substrate, and the gate stack extends across the first semiconductor fin and the second semiconductor fin. The method further includes forming a first source/drain structure on the first semiconductor fin, and the first source/drain structure is p-type doped. In addition, the method includes forming a second source/drain structure on the second semiconductor fin, and the second source/drain structure is n-type doped.

Abstract: Some implementations described herein provide techniques and apparatuses for a fixture including a semiconductor die package and methods of formation. The semiconductor die package is mounted to an interposer. In addition to the semiconductor die package, the fixture includes a lid component having a top structure and footing structures that connect the lid component to the interposer. The fixture includes a thermal interface material between a top surface of the semiconductor die package and the top structure of the lid component. The footing structures, connected to the interposer using deposits of an epoxy material, provide increase a structural rigidity of the fixture relative to another fixture not including the footing structures.

Abstract: In one example in accordance with the present disclosure, an electronic device is described. The electronic device includes a wireless controller. The wireless controller is to establish a first wireless connection between the electronic device and a peripheral device to receive a unique identifier for a second electronic device. The wireless controller is also to establish, based on the unique identifier for the second electronic device, a second wireless connection between the electronic device and the second electronic device. The electronic device includes a wireless transceiver to wirelessly transfer data to the second electronic device through the second wireless connection.

Abstract: A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.

Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.

Abstract: Transfer apparatuses and methods thereof are provided. First, a laser ranging unit is used to perform a first scanning ranging operation for an environment to obtain a laser scanning ranging result of the environment. Then, a displacement calculation unit is used to detect displacement information of a transfer apparatus. According to the laser scanning ranging result and the displacement information, map information of the environment is established and positioning information of the transfer apparatus in the environment is determined, wherein the map information includes information of a charging device. The map information and the positioning information of the transfer apparatus is transmitted to an application device via a connection interface.

Abstract: An interlocking bone plate system includes an outer bone plate for being arranged outside a broken bone, an inner bone plate for being installed inside the medullary cavity of the broken bone, and screws for being inserted through and engaged with the outer bone plate and the broken bone and then engaged with the inner bone plate so as to interlock the out and inner bone plates together. The inner bone plate provides an added support in addition to the support provided by the outer bone plate, enhancing the structural strength of the whole bone fixation structure and lowering the risk of failed surgery.

Abstract: An interlocking bone plate system includes an outer bone plate for being arranged outside a broken bone, an inner bone plate for being installed inside the medullary cavity of the broken bone, and screws for being inserted through and engaged with the outer bone plate and the broken bone and then engaged with the inner bone plate so as to interlock the out and inner bone plates together. The inner bone plate provides an added support in addition to the support provided by the outer bone plate, enhancing the structural strength of the whole bone fixation structure and lowering the risk of failed surgery.

Abstract: A camera for measuring the distance to an object is combined with a laser range measuring device by using a beam splitting device so as to simultaneously take the image of the object and measure the distance between the camera and the object. Using the focal length of the lens, the width and height of the image on the image detector, and the distance between the camera and the object, it is then possible to compute the width and height of the object according to the geometrical optics. By means of obtaining the speed of the image moving on the image detector, the camera of the invention further computes the speed of the object which is projected on a plane perpendicular to the optical axis of the lens.