Patents by Inventor Chih-Hui KAO

Chih-Hui KAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942403
    Abstract: In an embodiment, a package includes: an interposer having a first side; a first integrated circuit device attached to the first side of the interposer; a second integrated circuit device attached to the first side of the interposer; an underfill disposed beneath the first integrated circuit device and the second integrated circuit device; and an encapsulant disposed around the first integrated circuit device and the second integrated circuit device, a first portion of the encapsulant extending through the underfill, the first portion of the encapsulant physically disposed between the first integrated circuit device and the second integrated circuit device, the first portion of the encapsulant being planar with edges of the underfill and edges of the first and second integrated circuit devices.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chien Pan, Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu
  • Publication number: 20240079399
    Abstract: A package structure and methods of forming a package structure are provided. The package structure includes a first die, a second die, a wall structure and an encapsulant. The second die is electrically bonded to the first die. The wall structure is located aside the second die and on the first die. The wall structure is in contact with the first die and a hole is defined within the wall structure for accommodating an optical element. The encapsulant laterally encapsulates the second die and the wall structure.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chien Pan, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu
  • Patent number: 11560423
    Abstract: The present invention relates to isolated monoclonal antibodies (mAbs) and/or antigen-binding fragments thereof that specifically recognize indoxyl sulfate, a protein-bound uremic toxin, and uses of such isolated anti-IS mAbs and/or antigen-binding fragments thereof to create immunoassay methods applied in theragnosis of IS-related diseases.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: January 24, 2023
    Assignee: LEADGENE BIOMEDICAL, INC.
    Inventors: Yung-Chun Chuang, Yu-Wei Cheng, Chih-Hui Kao
  • Publication number: 20200308263
    Abstract: The present invention relates to isolated monoclonal antibodies (mAbs) and/or antigen-binding fragments thereof that specifically recognize indoxyl sulfate, a protein-bound uremic toxin, and uses of such isolated anti-IS mAbs and/or antigen-binding fragments thereof to create immunoassay methods applied in theragnosis of IS-related diseases.
    Type: Application
    Filed: June 15, 2020
    Publication date: October 1, 2020
    Inventors: Yung-Chun Chuang, Yu-Wei Cheng, Chih-Hui Kao
  • Patent number: 10723791
    Abstract: The present invention relates to isolated monoclonal antibodies (mAbs) and/or antigen-binding fragments thereof that specifically recognize indoxyl sulfate, a protein-bound uremic toxin, isolated polynucleotide segment encoding the isolated antibodies and/or antigen-binding fragments thereof, and uses of such isolated anti-IS mAbs and/or antigen-binding fragments thereof to create immunoassay methods, device compositions, and pharmaceutical compositions applied in theragnosis of IS-related diseases.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: July 28, 2020
    Assignee: LEADGENE BIOMEDICAL, INC.
    Inventors: Yung-Chun Chuang, Yu-Wei Cheng, Chih-Hui Kao
  • Publication number: 20200040148
    Abstract: A plant fiber foam board contains: plant fibers, Ethylene Vinyl Acetate (EVA) copolymer, calcium carbonate, blowing agent, and cross-linking agent which are mixed and molded in a high temperature and a high pressure. The plant fiber foam board includes multiple air holes foamed thereon, and the multiple air holes do not communicate with one another. A method of making the plant fiber foam board contains steps of: putting and mixing plant fibers, Ethylene Vinyl Acetate (EVA) copolymer, calcium carbonate, blowing agent, and cross-linking agent in a mixing machine so as to produce a semi-finished product; and putting the semi-finished product into a mold of a foaming machine so as to be heated and pressurized, such that multiple air holes are foamed on the semi-finished product, and the multiple air holes do not communicate with one another.
    Type: Application
    Filed: May 15, 2019
    Publication date: February 6, 2020
    Applicants: SHING YAU SPONGE ENTERPRISE CO., LTD., BAOLIN BIOTECH CO., LTD.
    Inventor: CHIH-HUI KAO
  • Publication number: 20200031909
    Abstract: The present invention relates to isolated monoclonal antibodies (mAbs) and/or antigen-binding fragments thereof that specifically recognize indoxyl sulfate, a protein-bound uremic toxin, isolated polynucleotide segment encoding the isolated antibodies and/or antigen-binding fragments thereof, and uses of such isolated anti-IS mAbs and/or antigen-binding fragments thereof to create immunoassay methods, device compositions, and pharmaceutical compositions applied in theragnosis of IS-related diseases.
    Type: Application
    Filed: April 18, 2019
    Publication date: January 30, 2020
    Applicant: LEADGENE BIOMEDICAL, INC.
    Inventors: Yung-Chun CHUANG, Yu-Wei CHENG, Chih-Hui KAO