Abstract: A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.

Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

Abstract: A high-strength zirconia-alumina composite ceramic substrate suitable for semiconductor devices has been invented. It is manufactured by a procedure starting with mixing powder formula of alumina, zirconia, and a self-made synthetic additive for ball milling in an organic solvent at room temperature. The resulting mixture is homogenously dispersed and is then subjected to the steps of slurry preparation, degassing, green embryo forming, punching, calculation, and sintering to yield the final composite ceramic substrate with an excellent mechanical property of three-point bending strength>600 MPa and superior thermoelectric properties of thermal conductivity>26 W/mK, insulation resistance>1014 ?·cm and surface leakage current (150° C.)<200 nA.

Abstract: A high-strength zirconia-alumina composite ceramic substrate suitable for semiconductor devices has been invented. It is manufactured by a procedure starting with mixing powder formula of alumina, zirconia, and a self-made synthetic additive for ball milling in an organic solvent at room temperature. The resulting mixture is homogenously dispersed and is then subjected to the steps of slurry preparation, degassing, green embryo forming, punching, calculation, and sintering to yield the final composite ceramic substrate with an excellent mechanical property of three-point bending strength>600 MPa and superior thermoelectric properties of thermal conductivity>26 W/mK, insulation resistance>1014 ?·cm and surface leakage current (150° C.)<200 nA.

Abstract: A mold includes a substrate and a plurality of micro-structures. The micro-structures are disposed on the substrate. Each of the micro-structures includes a supporting layer and a convex top portion. The supporting layer is disposed on the substrate, wherein the material of the supporting layer is amorphous metal. The convex top portion is disposed on the supporting layer, wherein the material of the convex top portion is a thermoplastic polymer.

Abstract: A mold includes a substrate and a plurality of micro-structures. The micro-structures are disposed on the substrate. Each of the micro-structures includes a supporting layer and a convex top portion. The supporting layer is disposed on the substrate, wherein the material of the supporting layer is amorphous metal. The convex top portion is disposed on the supporting layer, wherein the material of the convex top portion is a thermoplastic polymer.